WO2007137019A3 - A case for a liquid submersion cooled electronic device - Google Patents

A case for a liquid submersion cooled electronic device Download PDF

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Publication number
WO2007137019A3
WO2007137019A3 PCT/US2007/068854 US2007068854W WO2007137019A3 WO 2007137019 A3 WO2007137019 A3 WO 2007137019A3 US 2007068854 W US2007068854 W US 2007068854W WO 2007137019 A3 WO2007137019 A3 WO 2007137019A3
Authority
WO
WIPO (PCT)
Prior art keywords
case
lid
liquid
interior space
motherboard
Prior art date
Application number
PCT/US2007/068854
Other languages
French (fr)
Other versions
WO2007137019A2 (en
Inventor
Chad Daniel Attlesey
R Daren Klum
Allen James Berning
Original Assignee
Hardcore Computer Inc
Chad Daniel Attlesey
R Daren Klum
Allen James Berning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hardcore Computer Inc, Chad Daniel Attlesey, R Daren Klum, Allen James Berning filed Critical Hardcore Computer Inc
Publication of WO2007137019A2 publication Critical patent/WO2007137019A2/en
Publication of WO2007137019A3 publication Critical patent/WO2007137019A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A case for a liquid submersion cooled computer includes a plurality of walls defining a liquid-tight interior space. At least a portion of one of the walls is made of a material that permits viewing of objects, for example, a motherboard, within the interior space. A removable lid closes the top of the interior space. The lid forms a liquid-tight seal with the plurality of walls, and the lid includes a sealed electrical connector fixed thereto that is configured to attach to the motherboard disposed in the interior space and to provide electrical connection between the motherboard and an exterior of the case. The case can include a drain valve for draining liquid from the case. Further, the lid can have an opening for introducing liquid into the interior space, and a handle to facilitate lifting of the lid along with the motherboard connected to the lid.
PCT/US2007/068854 2006-05-16 2007-05-14 A case for a liquid submersion cooled electronic device WO2007137019A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US80071506P 2006-05-16 2006-05-16
US60/800,715 2006-05-16
US11/736,965 2007-04-18
US11/736,965 US20080017355A1 (en) 2006-05-16 2007-04-18 Case for a liquid submersion cooled electronic device

Publications (2)

Publication Number Publication Date
WO2007137019A2 WO2007137019A2 (en) 2007-11-29
WO2007137019A3 true WO2007137019A3 (en) 2008-02-28

Family

ID=38723962

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/068854 WO2007137019A2 (en) 2006-05-16 2007-05-14 A case for a liquid submersion cooled electronic device

Country Status (3)

Country Link
US (2) US20080017355A1 (en)
TW (1) TWI424308B (en)
WO (1) WO2007137019A2 (en)

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Also Published As

Publication number Publication date
US7724517B2 (en) 2010-05-25
US20080196868A1 (en) 2008-08-21
TWI424308B (en) 2014-01-21
US20080017355A1 (en) 2008-01-24
WO2007137019A2 (en) 2007-11-29
TW200821799A (en) 2008-05-16

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