WO2007139780A3 - Lighting device and method of making - Google Patents

Lighting device and method of making Download PDF

Info

Publication number
WO2007139780A3
WO2007139780A3 PCT/US2007/012158 US2007012158W WO2007139780A3 WO 2007139780 A3 WO2007139780 A3 WO 2007139780A3 US 2007012158 W US2007012158 W US 2007012158W WO 2007139780 A3 WO2007139780 A3 WO 2007139780A3
Authority
WO
WIPO (PCT)
Prior art keywords
emitter
lighting device
region
encapsulant
making
Prior art date
Application number
PCT/US2007/012158
Other languages
French (fr)
Other versions
WO2007139780A2 (en
Inventor
Gerald H Negley
Original Assignee
Cree Led Lighting Solutions
Gerald H Negley
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Led Lighting Solutions, Gerald H Negley filed Critical Cree Led Lighting Solutions
Priority to JP2009512101A priority Critical patent/JP2009538531A/en
Priority to EP07795157A priority patent/EP2027602A4/en
Publication of WO2007139780A2 publication Critical patent/WO2007139780A2/en
Publication of WO2007139780A3 publication Critical patent/WO2007139780A3/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/021Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles by casting in several steps
    • B29C39/025Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles by casting in several steps for making multilayered articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22Component parts, details or accessories; Auxiliary operations
    • B29C39/26Moulds or cores
    • B29C39/34Moulds or cores for undercut articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/02Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C41/14Dipping a core
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00Optical elements, e.g. lenses, prisms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/005Processes relating to semiconductor body packages relating to encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements

Abstract

A lighting device comprises a solid state light emitter, first and second electrodes connected to the emitter, an encapsulant region comprising a silicone compound and a supporting region. The encapsulant region extends to an external surface of the lighting device. At least a portion of the first electrode is surrounded by the supporting region. The encapsulant region and the supporting region together define an outer surface which substantially encompasses the emitter. A method of making a lighting device, comprises electrically connecting first and second electrodes to an emitter; inserting the emitter into mold cavity; inserting an encapsulant composition comprising a one silicone compound; and then inserting a second composition to substantially surround at least a portion of the first electrode.
PCT/US2007/012158 2006-05-23 2007-05-22 Lighting device and method of making WO2007139780A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009512101A JP2009538531A (en) 2006-05-23 2007-05-22 LIGHTING DEVICE AND MANUFACTURING METHOD
EP07795157A EP2027602A4 (en) 2006-05-23 2007-05-22 Lighting device and method of making

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US80269706P 2006-05-23 2006-05-23
US60/802,697 2006-05-23

Publications (2)

Publication Number Publication Date
WO2007139780A2 WO2007139780A2 (en) 2007-12-06
WO2007139780A3 true WO2007139780A3 (en) 2008-07-24

Family

ID=38779168

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/012158 WO2007139780A2 (en) 2006-05-23 2007-05-22 Lighting device and method of making

Country Status (5)

Country Link
US (1) US7718991B2 (en)
EP (1) EP2027602A4 (en)
JP (1) JP2009538531A (en)
TW (1) TWI447934B (en)
WO (1) WO2007139780A2 (en)

Families Citing this family (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7145125B2 (en) 2003-06-23 2006-12-05 Advanced Optical Technologies, Llc Integrating chamber cone light using LED sources
US7521667B2 (en) 2003-06-23 2009-04-21 Advanced Optical Technologies, Llc Intelligent solid state lighting
US7355284B2 (en) * 2004-03-29 2008-04-08 Cree, Inc. Semiconductor light emitting devices including flexible film having therein an optical element
US20060097385A1 (en) * 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
US8125137B2 (en) 2005-01-10 2012-02-28 Cree, Inc. Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7564180B2 (en) 2005-01-10 2009-07-21 Cree, Inc. Light emission device and method utilizing multiple emitters and multiple phosphors
US7872430B2 (en) 2005-11-18 2011-01-18 Cree, Inc. Solid state lighting panels with variable voltage boost current sources
EP1949765B1 (en) 2005-11-18 2017-07-12 Cree, Inc. Solid state lighting panels with variable voltage boost current sources
US8514210B2 (en) 2005-11-18 2013-08-20 Cree, Inc. Systems and methods for calibrating solid state lighting panels using combined light output measurements
US7993021B2 (en) * 2005-11-18 2011-08-09 Cree, Inc. Multiple color lighting element cluster tiles for solid state lighting panels
EP1963743B1 (en) 2005-12-21 2016-09-07 Cree, Inc. Lighting device
BRPI0620413A2 (en) 2005-12-21 2011-11-08 Cree Led Lighting Solutions lighting device and lighting method
EP1969633B1 (en) 2005-12-22 2018-08-29 Cree, Inc. Lighting device
US8441179B2 (en) 2006-01-20 2013-05-14 Cree, Inc. Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources
TWI460880B (en) 2006-04-18 2014-11-11 Cree Inc Lighting device and lighting method
US9084328B2 (en) 2006-12-01 2015-07-14 Cree, Inc. Lighting device and lighting method
US8513875B2 (en) 2006-04-18 2013-08-20 Cree, Inc. Lighting device and lighting method
US7821194B2 (en) 2006-04-18 2010-10-26 Cree, Inc. Solid state lighting devices including light mixtures
US8998444B2 (en) 2006-04-18 2015-04-07 Cree, Inc. Solid state lighting devices including light mixtures
US7997745B2 (en) 2006-04-20 2011-08-16 Cree, Inc. Lighting device and lighting method
US8008676B2 (en) 2006-05-26 2011-08-30 Cree, Inc. Solid state light emitting device and method of making same
KR20140116536A (en) 2006-05-31 2014-10-02 크리, 인코포레이티드 Lighting device and method of lighting
US7766508B2 (en) * 2006-09-12 2010-08-03 Cree, Inc. LED lighting fixture
US7665862B2 (en) * 2006-09-12 2010-02-23 Cree, Inc. LED lighting fixture
TWI426622B (en) * 2006-10-23 2014-02-11 Cree Inc Lighting devices and methods of installing light engine housings and/or trim elements in lighting device housings
US8029155B2 (en) 2006-11-07 2011-10-04 Cree, Inc. Lighting device and lighting method
TWI496315B (en) 2006-11-13 2015-08-11 Cree Inc Lighting device, illuminated enclosure and lighting methods
EP2084452B1 (en) * 2006-11-14 2016-03-02 Cree, Inc. Lighting assemblies and components for lighting assemblies
CN101611258A (en) 2006-11-14 2009-12-23 科锐Led照明科技公司 Light engine assemblies
WO2008067441A1 (en) 2006-11-30 2008-06-05 Cree Led Lighting Solutions, Inc. Lighting device and lighting method
US9441793B2 (en) * 2006-12-01 2016-09-13 Cree, Inc. High efficiency lighting device including one or more solid state light emitters, and method of lighting
EP2095011A1 (en) 2006-12-04 2009-09-02 Cree Led Lighting Solutions, Inc. Lighting assembly and lighting method
US8258682B2 (en) 2007-02-12 2012-09-04 Cree, Inc. High thermal conductivity packaging for solid state light emitting apparatus and associated assembling methods
US9061450B2 (en) 2007-02-12 2015-06-23 Cree, Inc. Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding
US20080198572A1 (en) 2007-02-21 2008-08-21 Medendorp Nicholas W LED lighting systems including luminescent layers on remote reflectors
JP5476128B2 (en) 2007-02-22 2014-04-23 クリー インコーポレイテッド Illumination device, illumination method, optical filter, and light filtering method
US7638811B2 (en) * 2007-03-13 2009-12-29 Cree, Inc. Graded dielectric layer
US7824070B2 (en) 2007-03-22 2010-11-02 Cree, Inc. LED lighting fixture
JP2010527155A (en) 2007-05-08 2010-08-05 クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド Lighting device and lighting method
EP2156090B1 (en) 2007-05-08 2016-07-06 Cree, Inc. Lighting device and lighting method
JP2010527157A (en) 2007-05-08 2010-08-05 クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド Lighting device and lighting method
US8049709B2 (en) 2007-05-08 2011-11-01 Cree, Inc. Systems and methods for controlling a solid state lighting panel
CN101680604B (en) 2007-05-08 2013-05-08 科锐公司 Lighting devices and methods for lighting
US8079729B2 (en) 2007-05-08 2011-12-20 Cree, Inc. Lighting device and lighting method
JP2010527156A (en) 2007-05-08 2010-08-05 クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド Lighting device and lighting method
US7863635B2 (en) 2007-08-07 2011-01-04 Cree, Inc. Semiconductor light emitting devices with applied wavelength conversion materials
BRPI0818048B1 (en) 2007-10-10 2018-11-21 Cree Led Lighting Solutions Inc lighting device
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8350461B2 (en) 2008-03-28 2013-01-08 Cree, Inc. Apparatus and methods for combining light emitters
US8240875B2 (en) 2008-06-25 2012-08-14 Cree, Inc. Solid state linear array modules for general illumination
US7955875B2 (en) * 2008-09-26 2011-06-07 Cree, Inc. Forming light emitting devices including custom wavelength conversion structures
US8445824B2 (en) * 2008-10-24 2013-05-21 Cree, Inc. Lighting device
US8858032B2 (en) * 2008-10-24 2014-10-14 Cree, Inc. Lighting device, heat transfer structure and heat transfer element
US10197240B2 (en) * 2009-01-09 2019-02-05 Cree, Inc. Lighting device
US7967652B2 (en) 2009-02-19 2011-06-28 Cree, Inc. Methods for combining light emitting devices in a package and packages including combined light emitting devices
US8333631B2 (en) 2009-02-19 2012-12-18 Cree, Inc. Methods for combining light emitting devices in a package and packages including combined light emitting devices
US8950910B2 (en) 2009-03-26 2015-02-10 Cree, Inc. Lighting device and method of cooling lighting device
US8337030B2 (en) 2009-05-13 2012-12-25 Cree, Inc. Solid state lighting devices having remote luminescent material-containing element, and lighting methods
US9841162B2 (en) 2009-05-18 2017-12-12 Cree, Inc. Lighting device with multiple-region reflector
US8921876B2 (en) 2009-06-02 2014-12-30 Cree, Inc. Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements
US8716952B2 (en) * 2009-08-04 2014-05-06 Cree, Inc. Lighting device having first, second and third groups of solid state light emitters, and lighting arrangement
US8648546B2 (en) 2009-08-14 2014-02-11 Cree, Inc. High efficiency lighting device including one or more saturated light emitters, and method of lighting
US9605844B2 (en) 2009-09-01 2017-03-28 Cree, Inc. Lighting device with heat dissipation elements
US10264637B2 (en) 2009-09-24 2019-04-16 Cree, Inc. Solid state lighting apparatus with compensation bypass circuits and methods of operation thereof
US9713211B2 (en) 2009-09-24 2017-07-18 Cree, Inc. Solid state lighting apparatus with controllable bypass circuits and methods of operation thereof
US8901845B2 (en) 2009-09-24 2014-12-02 Cree, Inc. Temperature responsive control for lighting apparatus including light emitting devices providing different chromaticities and related methods
US9353933B2 (en) 2009-09-25 2016-05-31 Cree, Inc. Lighting device with position-retaining element
WO2011037876A1 (en) 2009-09-25 2011-03-31 Cree, Inc. Lighting device having heat dissipation element
US9068719B2 (en) 2009-09-25 2015-06-30 Cree, Inc. Light engines for lighting devices
KR20120094477A (en) 2009-09-25 2012-08-24 크리, 인코포레이티드 Lighting device with low glare and high light level uniformity
US8777449B2 (en) 2009-09-25 2014-07-15 Cree, Inc. Lighting devices comprising solid state light emitters
US8602579B2 (en) 2009-09-25 2013-12-10 Cree, Inc. Lighting devices including thermally conductive housings and related structures
WO2011037882A2 (en) 2009-09-25 2011-03-31 Cree, Inc. Lighting device having heat dissipation element
US9464801B2 (en) 2009-09-25 2016-10-11 Cree, Inc. Lighting device with one or more removable heat sink elements
US9285103B2 (en) 2009-09-25 2016-03-15 Cree, Inc. Light engines for lighting devices
US9217542B2 (en) 2009-10-20 2015-12-22 Cree, Inc. Heat sinks and lamp incorporating same
US9030120B2 (en) 2009-10-20 2015-05-12 Cree, Inc. Heat sinks and lamp incorporating same
US9435493B2 (en) 2009-10-27 2016-09-06 Cree, Inc. Hybrid reflector system for lighting device
US8536615B1 (en) 2009-12-16 2013-09-17 Cree, Inc. Semiconductor device structures with modulated and delta doping and related methods
US8604461B2 (en) * 2009-12-16 2013-12-10 Cree, Inc. Semiconductor device structures with modulated doping and related methods
US8508116B2 (en) 2010-01-27 2013-08-13 Cree, Inc. Lighting device with multi-chip light emitters, solid state light emitter support members and lighting elements
EP2534407A2 (en) 2010-02-12 2012-12-19 Cree, Inc. Lighting devices that comprise one or more solid state light emitters
US9518715B2 (en) * 2010-02-12 2016-12-13 Cree, Inc. Lighting devices that comprise one or more solid state light emitters
US8773007B2 (en) 2010-02-12 2014-07-08 Cree, Inc. Lighting devices that comprise one or more solid state light emitters
WO2011100193A1 (en) 2010-02-12 2011-08-18 Cree, Inc. Lighting device with heat dissipation elements
CN102782391B (en) 2010-02-12 2016-08-03 科锐公司 Solid state illumination device and assembly method thereof
US9275979B2 (en) 2010-03-03 2016-03-01 Cree, Inc. Enhanced color rendering index emitter through phosphor separation
US8476836B2 (en) 2010-05-07 2013-07-02 Cree, Inc. AC driven solid state lighting apparatus with LED string including switched segments
WO2011143197A2 (en) 2010-05-13 2011-11-17 Cree, Inc. Lighting device and method of making
US8684559B2 (en) 2010-06-04 2014-04-01 Cree, Inc. Solid state light source emitting warm light with high CRI
US8835199B2 (en) * 2010-07-28 2014-09-16 GE Lighting Solutions, LLC Phosphor suspended in silicone, molded/formed and used in a remote phosphor configuration
US9648673B2 (en) 2010-11-05 2017-05-09 Cree, Inc. Lighting device with spatially segregated primary and secondary emitters
US8556469B2 (en) 2010-12-06 2013-10-15 Cree, Inc. High efficiency total internal reflection optic for solid state lighting luminaires
US9822949B2 (en) * 2011-01-28 2017-11-21 Kuraray Co., Ltd. Polyamide composition for reflector, reflector, light emitting device including the reflector, and lighting device and image display device each including the light emitting device
US11251164B2 (en) 2011-02-16 2022-02-15 Creeled, Inc. Multi-layer conversion material for down conversion in solid state lighting
US9839083B2 (en) 2011-06-03 2017-12-05 Cree, Inc. Solid state lighting apparatus and circuits including LED segments configured for targeted spectral power distribution and methods of operating the same
US8742671B2 (en) 2011-07-28 2014-06-03 Cree, Inc. Solid state lighting apparatus and methods using integrated driver circuitry
TWI441362B (en) * 2011-10-05 2014-06-11 Delta Electronics Inc Lighting module and lighting device thereof
US9151477B2 (en) 2012-02-03 2015-10-06 Cree, Inc. Lighting device and method of installing light emitter
US9151457B2 (en) 2012-02-03 2015-10-06 Cree, Inc. Lighting device and method of installing light emitter
DE102013215326A1 (en) * 2013-04-30 2014-10-30 Tridonic Jennersdorf Gmbh LED module with highly reflective surface
US10038122B2 (en) 2013-06-28 2018-07-31 Lumileds Llc Light emitting diode device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6518600B1 (en) * 2000-11-17 2003-02-11 General Electric Company Dual encapsulation for an LED

Family Cites Families (97)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US527840A (en) * 1894-10-23 Support for trolley-wires
JPS5353983U (en) 1976-10-12 1978-05-09
US4154219A (en) 1977-03-11 1979-05-15 E-Systems, Inc. Prismatic solar reflector apparatus and method of solar tracking
JPS5936837B2 (en) 1977-04-05 1984-09-06 株式会社東芝 Optical semiconductor device
JPS5776885A (en) 1980-10-31 1982-05-14 Nec Corp Optical semiconductor device
US4545366A (en) 1984-09-24 1985-10-08 Entech, Inc. Bi-focussed solar energy concentrator
US4711972A (en) 1985-07-05 1987-12-08 Entech, Inc. Photovoltaic cell cover for use with a primary optical concentrator in a solar energy collector
US4843280A (en) 1988-01-15 1989-06-27 Siemens Corporate Research & Support, Inc. A modular surface mount component for an electrical device or led's
CA1337918C (en) 1988-03-16 1996-01-16 Norihisa Osaka Phosphor paste compositions and phosphor coatings obtained therefrom
US4918497A (en) 1988-12-14 1990-04-17 Cree Research, Inc. Blue light emitting diode formed in silicon carbide
US5027168A (en) 1988-12-14 1991-06-25 Cree Research, Inc. Blue light emitting diode formed in silicon carbide
US5338994A (en) 1989-07-20 1994-08-16 General Electric Company Method and apparatus for achieving current balance in parallel connected switching devices
US4966862A (en) 1989-08-28 1990-10-30 Cree Research, Inc. Method of production of light emitting diodes
US5210051A (en) 1990-03-27 1993-05-11 Cree Research, Inc. High efficiency light emitting diodes from bipolar gallium nitride
US5416342A (en) 1993-06-23 1995-05-16 Cree Research, Inc. Blue light-emitting diode with high external quantum efficiency
JPH0730154A (en) * 1993-07-07 1995-01-31 Omron Corp Optical semiconductor element and product with built-in optical semiconductor chip
US5338944A (en) 1993-09-22 1994-08-16 Cree Research, Inc. Blue light-emitting diode with degenerate junction structure
US5393993A (en) 1993-12-13 1995-02-28 Cree Research, Inc. Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices
US5604135A (en) 1994-08-12 1997-02-18 Cree Research, Inc. Method of forming green light emitting diode in silicon carbide
US5523589A (en) 1994-09-20 1996-06-04 Cree Research, Inc. Vertical geometry light emitting diode with group III nitride active layer and extended lifetime
US5631190A (en) 1994-10-07 1997-05-20 Cree Research, Inc. Method for producing high efficiency light-emitting diodes and resulting diode structures
JP3357756B2 (en) 1994-10-14 2002-12-16 株式会社シチズン電子 Surface mount type light emitting device
US5739554A (en) 1995-05-08 1998-04-14 Cree Research, Inc. Double heterojunction light emitting diode with gallium nitride active layer
JPH0974225A (en) * 1995-09-06 1997-03-18 Nichia Chem Ind Ltd Led light source
JP2947156B2 (en) 1996-02-29 1999-09-13 双葉電子工業株式会社 Phosphor manufacturing method
US5803579A (en) 1996-06-13 1998-09-08 Gentex Corporation Illuminator assembly incorporating light emitting diodes
DE19638667C2 (en) 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mixed-color light-emitting semiconductor component with luminescence conversion element
TW383508B (en) 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
US5912447A (en) * 1997-01-14 1999-06-15 United Parcel Service Of America, Inc. Concentric optical path equalizer with radially moving mirrors
US6031179A (en) 1997-05-09 2000-02-29 Entech, Inc. Color-mixing lens for solar concentrator system and methods of manufacture and operation thereof
US5813753A (en) 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
EP0995183A2 (en) 1997-07-11 2000-04-26 Fed Corporation Bonded active matrix organic light emitting device display and method of producing the same
JP3830238B2 (en) 1997-08-29 2006-10-04 セイコーエプソン株式会社 Active matrix type device
US6201262B1 (en) 1997-10-07 2001-03-13 Cree, Inc. Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlay structure
US5993993A (en) * 1997-10-22 1999-11-30 Space Systems/Loral, Inc. Unregulated spacecraft electrical bus
US6252254B1 (en) 1998-02-06 2001-06-26 General Electric Company Light emitting device with phosphor composition
JPH11251638A (en) 1998-03-03 1999-09-17 Yamaha Corp Brightness adjustable device
GB9813326D0 (en) 1998-06-19 1998-08-19 Cambridge Display Tech Ltd Backlit displays
US5959316A (en) 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6077724A (en) 1998-09-05 2000-06-20 First International Computer Inc. Multi-chips semiconductor package and fabrication method
US6274924B1 (en) 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
US6204523B1 (en) 1998-11-06 2001-03-20 Lumileds Lighting, U.S., Llc High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range
US6521916B2 (en) * 1999-03-15 2003-02-18 Gentex Corporation Radiation emitter device having an encapsulant with different zones of thermal conductivity
MY125115A (en) * 1999-03-31 2006-07-31 Hoya Corp Substrate for an information recording medium, information recording medium using the substrate and method of producing the substrate
US6075200A (en) 1999-06-30 2000-06-13 Entech, Inc. Stretched Fresnel lens solar concentrator for space power
DE10006738C2 (en) 2000-02-15 2002-01-17 Osram Opto Semiconductors Gmbh Light-emitting component with improved light decoupling and method for its production
US6483196B1 (en) 2000-04-03 2002-11-19 General Electric Company Flip chip led apparatus
JP2001326390A (en) 2000-05-18 2001-11-22 Rohm Co Ltd Rear-surface light-emitting chip type light-emitting element and insulating board used therefor
US6747406B1 (en) 2000-08-07 2004-06-08 General Electric Company LED cross-linkable phospor coating
US6635363B1 (en) 2000-08-21 2003-10-21 General Electric Company Phosphor coating with self-adjusting distance from LED chip
US6998281B2 (en) 2000-10-12 2006-02-14 General Electric Company Solid state lighting device with reduced form factor including LED with directional emission and package with microoptics
JP3614776B2 (en) * 2000-12-19 2005-01-26 シャープ株式会社 Chip component type LED and its manufacturing method
JP2002198570A (en) * 2000-12-26 2002-07-12 Toyoda Gosei Co Ltd Solid state optical element
JP3738824B2 (en) 2000-12-26 2006-01-25 セイコーエプソン株式会社 OPTICAL DEVICE, ITS MANUFACTURING METHOD, AND ELECTRONIC DEVICE
AU2002243628A1 (en) * 2001-01-31 2002-08-12 Gentex Corporation Radiation emitter devices and method of making the same
US6791119B2 (en) 2001-02-01 2004-09-14 Cree, Inc. Light emitting diodes including modifications for light extraction
US6297598B1 (en) 2001-02-20 2001-10-02 Harvatek Corp. Single-side mounted light emitting diode module
TW546624B (en) 2001-03-30 2003-08-11 Matsushita Electric Ind Co Ltd Display device
JP4101468B2 (en) * 2001-04-09 2008-06-18 豊田合成株式会社 Method for manufacturing light emitting device
US6958497B2 (en) 2001-05-30 2005-10-25 Cree, Inc. Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures
US6973718B2 (en) 2001-05-30 2005-12-13 Microchips, Inc. Methods for conformal coating and sealing microchip reservoir devices
US6878972B2 (en) * 2001-06-08 2005-04-12 Agilent Technologies, Inc. Light-emitting diode with plastic reflector cup
JP4114331B2 (en) 2001-06-15 2008-07-09 豊田合成株式会社 Light emitting device
US6984934B2 (en) 2001-07-10 2006-01-10 The Trustees Of Princeton University Micro-lens arrays for display intensity enhancement
US6632892B2 (en) * 2001-08-21 2003-10-14 General Electric Company Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst
US6921920B2 (en) * 2001-08-31 2005-07-26 Smith & Nephew, Inc. Solid-state light source
US20030054184A1 (en) 2001-09-06 2003-03-20 Hitachi Chemical Co., Ltd. Optical element, method for the production thereof and optical module
US6765351B2 (en) 2001-12-20 2004-07-20 The Trustees Of Princeton University Organic optoelectronic device structures
US6924514B2 (en) * 2002-02-19 2005-08-02 Nichia Corporation Light-emitting device and process for producing thereof
JP4269709B2 (en) 2002-02-19 2009-05-27 日亜化学工業株式会社 Light emitting device and manufacturing method thereof
JP2003341403A (en) * 2002-05-24 2003-12-03 Aisin Seiki Co Ltd Detection device of occupant on seat
TW546799B (en) 2002-06-26 2003-08-11 Lingsen Precision Ind Ltd Packaged formation method of LED and product structure
JP4240276B2 (en) 2002-07-05 2009-03-18 株式会社半導体エネルギー研究所 Light emitting device
US7125205B2 (en) * 2002-09-04 2006-10-24 Kennametal Inc. Cutting tool for rough and finish milling
US7264378B2 (en) 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
CA2495149A1 (en) 2002-09-19 2004-04-01 Cree, Inc. Phosphor-coated light emitting diodes including tapered sidewalls, and fabrication methods therefor
US6869753B2 (en) 2002-10-11 2005-03-22 Agilent Technologies, Inc. Screen printing process for light emitting base layer
US6717362B1 (en) 2002-11-14 2004-04-06 Agilent Technologies, Inc. Light emitting diode with gradient index layering
US7692206B2 (en) 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
JP4216577B2 (en) 2002-12-20 2009-01-28 シチズン電子株式会社 Light guide plate
US6917057B2 (en) * 2002-12-31 2005-07-12 Gelcore Llc Layered phosphor coatings for LED devices
JP2004354717A (en) 2003-05-29 2004-12-16 Seiko Epson Corp Display device and projection display device
US7989825B2 (en) 2003-06-26 2011-08-02 Fuji Xerox Co., Ltd. Lens-attached light-emitting element and method for manufacturing the same
KR101001040B1 (en) 2003-06-30 2010-12-14 엘지디스플레이 주식회사 Liquid crystal display module and driving apparatus thereof
US6921927B2 (en) * 2003-08-28 2005-07-26 Agilent Technologies, Inc. System and method for enhanced LED thermal conductivity
US7183587B2 (en) 2003-09-09 2007-02-27 Cree, Inc. Solid metal block mounting substrates for semiconductor light emitting devices
US7029935B2 (en) 2003-09-09 2006-04-18 Cree, Inc. Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same
US7915085B2 (en) 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
JP4479882B2 (en) * 2003-11-20 2010-06-09 信越化学工業株式会社 Cannonball type light emitting semiconductor device
US7355284B2 (en) 2004-03-29 2008-04-08 Cree, Inc. Semiconductor light emitting devices including flexible film having therein an optical element
US7456499B2 (en) 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US7280288B2 (en) 2004-06-04 2007-10-09 Cree, Inc. Composite optical lens with an integrated reflector
US20050280016A1 (en) * 2004-06-17 2005-12-22 Mok Thye L PCB-based surface mount LED device with silicone-based encapsulation structure
US7344902B2 (en) 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die
US7358542B2 (en) * 2005-02-02 2008-04-15 Lumination Llc Red emitting phosphor materials for use in LED and LCD applications
US20060292747A1 (en) 2005-06-27 2006-12-28 Loh Ban P Top-surface-mount power light emitter with integral heat sink

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6518600B1 (en) * 2000-11-17 2003-02-11 General Electric Company Dual encapsulation for an LED

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2027602A4 *

Also Published As

Publication number Publication date
EP2027602A4 (en) 2012-11-28
TW200814370A (en) 2008-03-16
TWI447934B (en) 2014-08-01
US7718991B2 (en) 2010-05-18
EP2027602A2 (en) 2009-02-25
US20070274063A1 (en) 2007-11-29
JP2009538531A (en) 2009-11-05
WO2007139780A2 (en) 2007-12-06

Similar Documents

Publication Publication Date Title
WO2007139780A3 (en) Lighting device and method of making
WO2010062079A3 (en) Light emitting device package
EP2341541A3 (en) Image sensor packaging structure with predetermined focal length
WO2009020061A1 (en) High efficiency module
WO2009075551A3 (en) Semiconductor light emitting device and method of fabricating the same
MY163778A (en) Method for manufacturing a semiconductor component and structure therefor
EP1778339A4 (en) A process of manufacturing an electrical lead
JP2009523310A5 (en)
WO2010132517A3 (en) Led retrofit for miniature bulbs
WO2010039855A3 (en) Vertical mount package for mems sensors
WO2010141215A3 (en) Solid state lighting device
EP2282327A3 (en) Manufacturing method for molding image sensor package structure and image sensor package structure thereof
HK1127161A1 (en) Light emitting device and method of manufacturing the same
EP1912294A3 (en) Shield contact for a connector housing
TW200741796A (en) High intensity discharge lamp with improved crack control and method of manufacture
IL180337A0 (en) Method for connecting at least one wire to a contact element
EP2341560A3 (en) Light emitting device and method of manufacturing the same
WO2010004472A3 (en) High-pressure sodium vapor discharge lamp with hybrid antenna
WO2010044548A3 (en) Light emitting device package, manufacturing method thereof, and lighting apparatus
EP2020675A3 (en) HID lamp with frit seal thermal control
WO2009151668A3 (en) Integral housing and user interface
WO2007005259A3 (en) Ceramic lamps and methods of making same
WO2006047263A3 (en) Integrally formed molded parts and method for making the same
CN103633552A (en) Surface-mounted type laser packaging structure and packaging method of surface-mounted type laser in photoelectric circuit
WO2009154391A3 (en) Method for manufacturing a power semiconductor device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07795157

Country of ref document: EP

Kind code of ref document: A2

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2009512101

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2007795157

Country of ref document: EP