WO2007149813A3 - Electrochemical sensing and data analysis system, apparatus and method for metal plating - Google Patents

Electrochemical sensing and data analysis system, apparatus and method for metal plating Download PDF

Info

Publication number
WO2007149813A3
WO2007149813A3 PCT/US2007/071462 US2007071462W WO2007149813A3 WO 2007149813 A3 WO2007149813 A3 WO 2007149813A3 US 2007071462 W US2007071462 W US 2007071462W WO 2007149813 A3 WO2007149813 A3 WO 2007149813A3
Authority
WO
WIPO (PCT)
Prior art keywords
data analysis
analysis system
electrochemical sensing
metal plating
control
Prior art date
Application number
PCT/US2007/071462
Other languages
French (fr)
Other versions
WO2007149813A2 (en
Inventor
Jianwen Han
Monica K Hilgarth
Mackenzie King
Steven M Lurcott
Original Assignee
Advanced Tech Materials
Jianwen Han
Monica K Hilgarth
Mackenzie King
Steven M Lurcott
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Tech Materials, Jianwen Han, Monica K Hilgarth, Mackenzie King, Steven M Lurcott filed Critical Advanced Tech Materials
Priority to US12/305,650 priority Critical patent/US20090200171A1/en
Publication of WO2007149813A2 publication Critical patent/WO2007149813A2/en
Publication of WO2007149813A3 publication Critical patent/WO2007149813A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32182—If state of tool, product deviates from standard, adjust system, feedback
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

An electrochemical sensing and data analysis system (and apparatus and methods) adapted for control of electroplating of various metal(s) on a wafer or other suitable substrate. Components of the system utilize multi-variate analysis (MVA) and galvanostatic, potentiodynamic or other electrical measurements (or combinations thereof) to predict, adjust or control plating parameters, e.g., to achieve improved yield of plated substrates with acceptable levels of defects (or lack thereof).
PCT/US2007/071462 2006-06-20 2007-06-18 Electrochemical sensing and data analysis system, apparatus and method for metal plating WO2007149813A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/305,650 US20090200171A1 (en) 2006-06-20 2007-06-18 Electrochemical sensing and data analysis system, apparatus and method for metal plating

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81520606P 2006-06-20 2006-06-20
US60/815,206 2006-06-20

Publications (2)

Publication Number Publication Date
WO2007149813A2 WO2007149813A2 (en) 2007-12-27
WO2007149813A3 true WO2007149813A3 (en) 2008-02-21

Family

ID=38834286

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/071462 WO2007149813A2 (en) 2006-06-20 2007-06-18 Electrochemical sensing and data analysis system, apparatus and method for metal plating

Country Status (3)

Country Link
US (1) US20090200171A1 (en)
TW (1) TW200829915A (en)
WO (1) WO2007149813A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397615B (en) * 2010-04-01 2013-06-01 Zhen Ding Technology Co Ltd Plating apparatus
TR201810032T4 (en) * 2013-07-02 2018-08-27 Ancosys Gmbh On-site fingerprint analysis for electrochemical precipitation and / or electrochemical etching.

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6551483B1 (en) * 2000-02-29 2003-04-22 Novellus Systems, Inc. Method for potential controlled electroplating of fine patterns on semiconductor wafers
US20030080000A1 (en) * 2001-08-09 2003-05-01 Robertson Peter M. Interference correction of additives concentration measurements in metal electroplating solutions
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US20050241948A1 (en) * 2004-04-30 2005-11-03 Jianwen Han Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6492601B1 (en) * 1999-11-01 2002-12-10 The Johns Hopkins University Self-monitoring controller for quartz crystal Microbalance sensors
US6846380B2 (en) * 2002-06-13 2005-01-25 The Boc Group, Inc. Substrate processing apparatus and related systems and methods
US6709568B2 (en) * 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
US7678258B2 (en) * 2003-07-10 2010-03-16 International Business Machines Corporation Void-free damascene copper deposition process and means of monitoring thereof
FI20031733A0 (en) * 2003-11-27 2003-11-27 Outokumpu Oy Method for determining the state index of a copper electrolysis
US6984299B2 (en) * 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
US7368042B2 (en) * 2004-12-30 2008-05-06 United Microelectronics Corp. Electroplating apparatus including a real-time feedback system
US20070261963A1 (en) * 2006-02-02 2007-11-15 Advanced Technology Materials, Inc. Simultaneous inorganic, organic and byproduct analysis in electrochemical deposition solutions

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6551483B1 (en) * 2000-02-29 2003-04-22 Novellus Systems, Inc. Method for potential controlled electroplating of fine patterns on semiconductor wafers
US20030080000A1 (en) * 2001-08-09 2003-05-01 Robertson Peter M. Interference correction of additives concentration measurements in metal electroplating solutions
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US20050241948A1 (en) * 2004-04-30 2005-11-03 Jianwen Han Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions

Also Published As

Publication number Publication date
US20090200171A1 (en) 2009-08-13
WO2007149813A2 (en) 2007-12-27
TW200829915A (en) 2008-07-16

Similar Documents

Publication Publication Date Title
WO2009075885A3 (en) Method and apparatus for plating solution analysis and control
WO2010033761A3 (en) Self-diagnostic semiconductor equipment
TW201612367A (en) Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
WO2005098409A3 (en) Quantitative transient analysis of localized corrosion
WO2007099522A3 (en) Apparatus and method for measuring parameters associated with electrochemical processes
WO2011041758A3 (en) Method and apparatus for conducting measurements when multiple carriers are supported
WO2009124180A3 (en) In situ plating and soldering of materials covered with a surface film
TW200636834A (en) Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow
ATE555235T1 (en) PD AND PD-NI ELECTROLYTE BATHS
WO2007111676A3 (en) Method of direct plating of copper on a substrate structure
WO2007004494A3 (en) Production condition determining method, production condition determining apparatus, mounter, and program
WO2008127112A3 (en) Electrodeposition
BRPI0907497A2 (en) Pyrophosphate based bath for coating of tin alloy layers
WO2012088256A3 (en) Process for evaluating corrosion resistance of coating
DK1776586T3 (en) Substrates for performing functional tests of biological cells as well as methods for coating a substrate
WO2016124921A3 (en) Electrolyte for electroplating
WO2008154180A3 (en) Method of electroplating a conversion electron emitting source on implant
WO2005100967A3 (en) Electrochemical deposition analysis system including high-stability electrode
WO2007149813A3 (en) Electrochemical sensing and data analysis system, apparatus and method for metal plating
EP2166379A3 (en) Interbed seismic multiple prediction
TWI265204B (en) Method for coating substrates in inline installations
WO2006086169A3 (en) Immersion process for electroplating applications
WO2007082275A3 (en) Thickness distribution control for electroplating
WO2006055145A3 (en) Current collimation for thin seed and direct plating
WO2009044266A3 (en) System and method of plating metal alloys by using galvanic technology

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07812183

Country of ref document: EP

Kind code of ref document: A2

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
NENP Non-entry into the national phase

Ref country code: DE

NENP Non-entry into the national phase

Ref country code: RU

WWE Wipo information: entry into national phase

Ref document number: 12305650

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 07812183

Country of ref document: EP

Kind code of ref document: A2