WO2008008727A3 - Scheduling method for processing equipment - Google Patents

Scheduling method for processing equipment Download PDF

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Publication number
WO2008008727A3
WO2008008727A3 PCT/US2007/073055 US2007073055W WO2008008727A3 WO 2008008727 A3 WO2008008727 A3 WO 2008008727A3 US 2007073055 W US2007073055 W US 2007073055W WO 2008008727 A3 WO2008008727 A3 WO 2008008727A3
Authority
WO
WIPO (PCT)
Prior art keywords
transferred
substrate
processing equipment
robot
scheduling method
Prior art date
Application number
PCT/US2007/073055
Other languages
French (fr)
Other versions
WO2008008727A2 (en
Inventor
Steve S Hongkham
Eric A Englhardt
Michael R Rice
Hilario L Oh
Helen R Armer
Chongyang Chris Wang
Original Assignee
Applied Materials Inc
Steve S Hongkham
Eric A Englhardt
Michael R Rice
Hilario L Oh
Helen R Armer
Chongyang Chris Wang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Steve S Hongkham, Eric A Englhardt, Michael R Rice, Hilario L Oh, Helen R Armer, Chongyang Chris Wang filed Critical Applied Materials Inc
Publication of WO2008008727A2 publication Critical patent/WO2008008727A2/en
Publication of WO2008008727A3 publication Critical patent/WO2008008727A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Abstract

Methods and apparatus for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput and repeatable wafer processing history are provided. In one embodiment a first substrate is transferred from a first position to a second position and then the first substrate is transferred from the second position to a third position using a first robot. A second substrate is transferred from a first position to a second position and then the second substrate is transferred from the second position to a third position using a second robot. The movement of the first and second robots is synchronized so that the movement from the first position to the second position by the first and second robot is performed within a first time interval.
PCT/US2007/073055 2006-07-10 2007-07-09 Scheduling method for processing equipment WO2008008727A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US80690606P 2006-07-10 2006-07-10
US60/806,906 2006-07-10

Publications (2)

Publication Number Publication Date
WO2008008727A2 WO2008008727A2 (en) 2008-01-17
WO2008008727A3 true WO2008008727A3 (en) 2008-07-03

Family

ID=38924064

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/073055 WO2008008727A2 (en) 2006-07-10 2007-07-09 Scheduling method for processing equipment

Country Status (3)

Country Link
US (1) US8019467B2 (en)
TW (1) TWI427731B (en)
WO (1) WO2008008727A2 (en)

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US8822810B2 (en) 2006-04-13 2014-09-02 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US8729385B2 (en) 2006-04-13 2014-05-20 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
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TWI523134B (en) * 2011-09-22 2016-02-21 東京威力科創股份有限公司 Substrate treatment system, substrate transfer method and computer-readable storage medium
JP5598734B2 (en) * 2012-01-06 2014-10-01 株式会社ダイフク Goods storage facility
JP6105982B2 (en) * 2012-09-21 2017-03-29 株式会社Ｓｃｒｅｅｎホールディングス Schedule creation device, substrate processing device, schedule creation program, schedule creation method, and substrate processing method
US9841749B2 (en) 2014-04-01 2017-12-12 Bot & Dolly, Llc Runtime controller for robotic manufacturing system
US9701018B2 (en) 2014-04-01 2017-07-11 Bot & Dolly, Llc Software interface for authoring robotic manufacturing process
US9555545B2 (en) 2014-05-21 2017-01-31 Bot & Dolly, Llc Systems and methods for time-based parallel robotic operation
US9278449B1 (en) 2014-05-21 2016-03-08 Bot & Dolly, Llc Closed-loop control system for robotic operation
US9308647B2 (en) 2014-06-03 2016-04-12 Bot & Dolly, Llc Systems and methods for instructing robotic operation
JP6217611B2 (en) * 2014-12-02 2017-10-25 株式会社ダイフク Goods storage facility
US10157741B1 (en) * 2017-07-31 2018-12-18 Taiwan Semiconductor Manufacturing Company Ltd. Method of manufacturing a semiconductor structure
US20190138623A1 (en) * 2017-11-03 2019-05-09 Drishti Technologies, Inc. Automated birth certificate systems and methods
JP7181068B2 (en) * 2018-11-30 2022-11-30 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment
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Also Published As

Publication number Publication date
US8019467B2 (en) 2011-09-13
TW200822273A (en) 2008-05-16
US20080014058A1 (en) 2008-01-17
TWI427731B (en) 2014-02-21
WO2008008727A2 (en) 2008-01-17

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