WO2008023846A3 - Force sensor using a semiconductive substrate - Google Patents
Force sensor using a semiconductive substrate Download PDFInfo
- Publication number
- WO2008023846A3 WO2008023846A3 PCT/JP2007/066952 JP2007066952W WO2008023846A3 WO 2008023846 A3 WO2008023846 A3 WO 2008023846A3 JP 2007066952 W JP2007066952 W JP 2007066952W WO 2008023846 A3 WO2008023846 A3 WO 2008023846A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- force sensor
- glass
- disposed
- glass member
- sensor chip
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
- G01L5/161—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance
- G01L5/162—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance of piezoresistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2206—Special supports with preselected places to mount the resistance strain gauges; Mounting of supports
- G01L1/2231—Special supports with preselected places to mount the resistance strain gauges; Mounting of supports the supports being disc- or ring-shaped, adapted for measuring a force along a single direction
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49103—Strain gauge making
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07806429A EP2038628B1 (en) | 2006-08-24 | 2007-08-24 | Force sensor using a semiconductive substrate |
US12/310,197 US8113065B2 (en) | 2006-08-24 | 2007-08-24 | Force sensor |
CN200780031369.7A CN101506636B (en) | 2006-08-24 | 2007-08-24 | Force sensor using a semiconductive substrate |
DE602007005259T DE602007005259D1 (en) | 2006-08-24 | 2007-08-24 | FUEL SENSOR WITH A SEMICONDUCTIVE CARRIER |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-227467 | 2006-08-24 | ||
JP2006227467A JP5243704B2 (en) | 2006-08-24 | 2006-08-24 | Force sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008023846A2 WO2008023846A2 (en) | 2008-02-28 |
WO2008023846A3 true WO2008023846A3 (en) | 2008-04-17 |
Family
ID=38983721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/066952 WO2008023846A2 (en) | 2006-08-24 | 2007-08-24 | Force sensor using a semiconductive substrate |
Country Status (6)
Country | Link |
---|---|
US (1) | US8113065B2 (en) |
EP (1) | EP2038628B1 (en) |
JP (1) | JP5243704B2 (en) |
CN (1) | CN101506636B (en) |
DE (1) | DE602007005259D1 (en) |
WO (1) | WO2008023846A2 (en) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5243704B2 (en) * | 2006-08-24 | 2013-07-24 | 本田技研工業株式会社 | Force sensor |
JP5024358B2 (en) * | 2009-01-08 | 2012-09-12 | 株式会社日本自動車部品総合研究所 | Action force detector |
JP5243988B2 (en) * | 2009-02-10 | 2013-07-24 | 本田技研工業株式会社 | Multi-axis force sensor and acceleration sensor |
DE102011006344B4 (en) | 2010-03-31 | 2020-03-12 | Joyson Safety Systems Acquisition Llc | Occupant measurement system |
DE102011006448A1 (en) | 2010-03-31 | 2011-10-06 | Tk Holdings, Inc. | steering wheel sensors |
DE102011006649B4 (en) | 2010-04-02 | 2018-05-03 | Tk Holdings Inc. | Steering wheel with hand sensors |
EP2573534A1 (en) * | 2011-09-20 | 2013-03-27 | General Electric Company | Multi degree of freedom transducer |
WO2013154720A1 (en) | 2012-04-13 | 2013-10-17 | Tk Holdings Inc. | Pressure sensor including a pressure sensitive material for use with control systems and methods of using the same |
US9493342B2 (en) | 2012-06-21 | 2016-11-15 | Nextinput, Inc. | Wafer level MEMS force dies |
US9032818B2 (en) | 2012-07-05 | 2015-05-19 | Nextinput, Inc. | Microelectromechanical load sensor and methods of manufacturing the same |
WO2014043664A1 (en) | 2012-09-17 | 2014-03-20 | Tk Holdings Inc. | Single layer force sensor |
US9381647B2 (en) | 2013-02-19 | 2016-07-05 | Seiko Epson Corporation | Force detection device, robot, and moving object |
US10500471B2 (en) * | 2013-05-17 | 2019-12-10 | CNOWire, Inc. | Impedance-based impact determination and scoring |
WO2015106246A1 (en) | 2014-01-13 | 2015-07-16 | Nextinput, Inc. | Miniaturized and ruggedized wafer level mems force sensors |
DE102015104410B4 (en) * | 2015-03-24 | 2018-09-13 | Tdk-Micronas Gmbh | pressure sensor |
EP3307671B1 (en) | 2015-06-10 | 2022-06-15 | Nextinput, Inc. | Ruggedized wafer level mems force sensor with a tolerance trench |
WO2017006840A1 (en) * | 2015-07-07 | 2017-01-12 | 日立オートモティブシステムズ株式会社 | Semiconductor device, dynamic quantity measuring device and method for manufacturing semiconductor device |
WO2017212866A1 (en) * | 2016-06-08 | 2017-12-14 | 日立オートモティブシステムズ株式会社 | Force sensor |
JP6342971B2 (en) * | 2016-11-14 | 2018-06-13 | ファナック株式会社 | Force detection device and robot |
WO2018148510A1 (en) | 2017-02-09 | 2018-08-16 | Nextinput, Inc. | Integrated piezoresistive and piezoelectric fusion force sensor |
CN116907693A (en) | 2017-02-09 | 2023-10-20 | 触控解决方案股份有限公司 | Integrated digital force sensor and related manufacturing method |
WO2019018641A1 (en) | 2017-07-19 | 2019-01-24 | Nextinput, Inc. | Strain transfer stacking in a mems force sensor |
US11423686B2 (en) | 2017-07-25 | 2022-08-23 | Qorvo Us, Inc. | Integrated fingerprint and force sensor |
WO2019023552A1 (en) | 2017-07-27 | 2019-01-31 | Nextinput, Inc. | A wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture |
US11579028B2 (en) | 2017-10-17 | 2023-02-14 | Nextinput, Inc. | Temperature coefficient of offset compensation for force sensor and strain gauge |
WO2019090057A1 (en) | 2017-11-02 | 2019-05-09 | Nextinput, Inc. | Sealed force sensor with etch stop layer |
WO2019099821A1 (en) | 2017-11-16 | 2019-05-23 | Nextinput, Inc. | Force attenuator for force sensor |
JP2020012660A (en) * | 2018-07-13 | 2020-01-23 | 日本電産コパル電子株式会社 | Torque sensor |
EP3671141B1 (en) * | 2018-12-20 | 2022-08-03 | Bizerba SE & Co. KG | Load cell and weighing foot |
US10962427B2 (en) | 2019-01-10 | 2021-03-30 | Nextinput, Inc. | Slotted MEMS force sensor |
US11121096B2 (en) | 2019-03-21 | 2021-09-14 | International Business Machines Corporation | Active control of electronic package warpage |
JP2021071305A (en) * | 2019-10-29 | 2021-05-06 | ミネベアミツミ株式会社 | Force sensor device |
JP6771794B1 (en) * | 2020-02-25 | 2020-10-21 | 株式会社トライフォース・マネジメント | Force sensor |
CN112326076A (en) * | 2020-11-04 | 2021-02-05 | 重庆大学 | Pressure sensor and installation mechanism thereof |
JP2022101140A (en) * | 2020-12-24 | 2022-07-06 | ミネベアミツミ株式会社 | Distortion-generating body and force sensor device |
JP2022142116A (en) * | 2021-03-16 | 2022-09-30 | ミネベアミツミ株式会社 | Strain body and force sensor device |
CN115112286A (en) * | 2021-03-19 | 2022-09-27 | 美蓓亚三美株式会社 | Strain body and force sensor device |
CN115290232A (en) * | 2022-06-20 | 2022-11-04 | 无锡盛赛传感科技有限公司 | Annular microminiature force-sensitive ceramic tension sensor |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4454771A (en) * | 1980-11-07 | 1984-06-19 | Hitachi, Ltd. | Load cell |
US5526700A (en) * | 1995-09-29 | 1996-06-18 | Akeel; Hadi A. | Six component force gage |
EP1653208A2 (en) * | 2004-10-26 | 2006-05-03 | HONDA MOTOR CO., Ltd. | Multi-axis force sensor chip and multi-axis force sensor using same |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3985025A (en) * | 1975-01-20 | 1976-10-12 | Ormond Alfred N | Shear measuring flexure isolated load cells |
JPS61223626A (en) * | 1985-03-29 | 1986-10-04 | Nec Corp | Sensor |
US4905523A (en) * | 1987-04-24 | 1990-03-06 | Wacoh Corporation | Force detector and moment detector using resistance element |
JP2607096B2 (en) * | 1987-09-18 | 1997-05-07 | 株式会社エンプラス研究所 | Force / moment detector |
US5095762A (en) * | 1988-07-14 | 1992-03-17 | University Of Hawaii | Multidimensional force sensor |
JPH0320635A (en) * | 1989-06-17 | 1991-01-29 | Wako:Kk | Force detecting device |
US6314823B1 (en) * | 1991-09-20 | 2001-11-13 | Kazuhiro Okada | Force detector and acceleration detector and method of manufacturing the same |
JPH05215627A (en) * | 1992-02-04 | 1993-08-24 | Kazuhiro Okada | Device for detecting force, acceleration, and magnetism in multidimensional direction |
JP2587646Y2 (en) * | 1992-09-10 | 1998-12-24 | 株式会社エンプラス | 3D semiconductor force sensor |
JPH0783129B2 (en) * | 1992-10-20 | 1995-09-06 | 石塚硝子株式会社 | Force conversion element |
JPH07176766A (en) * | 1993-12-20 | 1995-07-14 | Ishizuka Glass Co Ltd | Orthogonal semiconductor pressure transducer |
CN2233081Y (en) * | 1995-02-12 | 1996-08-14 | 易秀芳 | Six index force and moment sensor |
JPH1073504A (en) * | 1996-08-29 | 1998-03-17 | Nippon Seiki Co Ltd | Pressure detector |
JP3757069B2 (en) * | 1998-11-12 | 2006-03-22 | アルプス電気株式会社 | Input device |
JP2001141744A (en) * | 1999-11-10 | 2001-05-25 | Hokuriku Electric Ind Co Ltd | Acceleration detector with piezoelectric acceleration sensor |
JP2001272295A (en) * | 2000-03-27 | 2001-10-05 | Tadahiro Kato | Pressure measuring sensor |
JP3870895B2 (en) * | 2002-01-10 | 2007-01-24 | 株式会社村田製作所 | Angular velocity sensor |
JP4011345B2 (en) | 2002-01-11 | 2007-11-21 | 本田技研工業株式会社 | Multi-axis force sensor chip |
JP3970640B2 (en) | 2002-03-05 | 2007-09-05 | 本田技研工業株式会社 | 6-axis force sensor |
EP1327870B1 (en) * | 2002-01-11 | 2013-05-08 | Honda Giken Kogyo Kabushiki Kaisha | Six-axis force sensor |
JP4007128B2 (en) * | 2002-03-22 | 2007-11-14 | 株式会社豊田中央研究所 | Pressure sensor and sensor unit |
CN1168964C (en) * | 2003-01-15 | 2004-09-29 | 东南大学 | Four dimensional force and moment sensor of direct output type robot |
JP4045979B2 (en) * | 2003-02-26 | 2008-02-13 | 株式会社デンソー | Pressure detection device |
JP4192084B2 (en) * | 2003-06-17 | 2008-12-03 | ニッタ株式会社 | Multi-axis sensor |
CN1220037C (en) * | 2003-09-19 | 2005-09-21 | 哈尔滨工业大学 | Miniature all-plane 6D force and moment sensor |
JP2005106679A (en) * | 2003-09-30 | 2005-04-21 | Nitta Ind Corp | Multiaxial sensor unit and multiaxial sensor using the same |
JP4203051B2 (en) * | 2005-06-28 | 2008-12-24 | 本田技研工業株式会社 | Force sensor |
JP5303101B2 (en) * | 2006-05-02 | 2013-10-02 | 本田技研工業株式会社 | Force sensor chip |
JP5007083B2 (en) * | 2006-08-08 | 2012-08-22 | 本田技研工業株式会社 | Force sensor chip |
JP5243704B2 (en) * | 2006-08-24 | 2013-07-24 | 本田技研工業株式会社 | Force sensor |
JP4210296B2 (en) * | 2006-08-24 | 2009-01-14 | 本田技研工業株式会社 | Method for manufacturing force sensor |
JP4958501B2 (en) * | 2006-08-30 | 2012-06-20 | 本田技研工業株式会社 | Force sensor chip and external force transmission mechanism |
JP2008058110A (en) * | 2006-08-30 | 2008-03-13 | Honda Motor Co Ltd | Chip for force sensor and force sensor |
JP5174343B2 (en) * | 2006-12-12 | 2013-04-03 | 本田技研工業株式会社 | Force sensor chip |
JP4909104B2 (en) * | 2007-01-31 | 2012-04-04 | 本田技研工業株式会社 | Force sensor |
JP5604035B2 (en) * | 2008-07-18 | 2014-10-08 | 本田技研工業株式会社 | Force sensor unit |
-
2006
- 2006-08-24 JP JP2006227467A patent/JP5243704B2/en not_active Expired - Fee Related
-
2007
- 2007-08-24 CN CN200780031369.7A patent/CN101506636B/en not_active Expired - Fee Related
- 2007-08-24 US US12/310,197 patent/US8113065B2/en not_active Expired - Fee Related
- 2007-08-24 EP EP07806429A patent/EP2038628B1/en not_active Expired - Fee Related
- 2007-08-24 DE DE602007005259T patent/DE602007005259D1/en active Active
- 2007-08-24 WO PCT/JP2007/066952 patent/WO2008023846A2/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4454771A (en) * | 1980-11-07 | 1984-06-19 | Hitachi, Ltd. | Load cell |
US5526700A (en) * | 1995-09-29 | 1996-06-18 | Akeel; Hadi A. | Six component force gage |
EP1653208A2 (en) * | 2004-10-26 | 2006-05-03 | HONDA MOTOR CO., Ltd. | Multi-axis force sensor chip and multi-axis force sensor using same |
Also Published As
Publication number | Publication date |
---|---|
EP2038628A2 (en) | 2009-03-25 |
JP5243704B2 (en) | 2013-07-24 |
US8113065B2 (en) | 2012-02-14 |
EP2038628B1 (en) | 2010-03-10 |
CN101506636A (en) | 2009-08-12 |
CN101506636B (en) | 2011-04-20 |
US20090320610A1 (en) | 2009-12-31 |
DE602007005259D1 (en) | 2010-04-22 |
WO2008023846A2 (en) | 2008-02-28 |
JP2008051625A (en) | 2008-03-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2008023846A3 (en) | Force sensor using a semiconductive substrate | |
WO2006012303A3 (en) | Optical fiber transmission system with noise loading | |
WO2007058415A3 (en) | Integrated gateway for distributed home network and software framework structure for the same | |
SG150540A1 (en) | A method and system for transferring an application state from a first electronic device to a second electronic device | |
WO2007062098A3 (en) | Display with image-guiding substrate | |
WO2007044900A3 (en) | Mobile device customizer | |
WO2008104862A8 (en) | Multi-state unified pie user interface | |
TW200704988A (en) | Manufacturing of optical waveguides | |
AU2003240747A1 (en) | Calibration device for an antenna array and method for calibrating said array | |
WO2008081303A3 (en) | Transparent layer application | |
WO2006023594A3 (en) | High strain glass/glass-ceramic containing semiconductor-on-insulator structures | |
TW200703938A (en) | Communication apparatus and method, and program | |
WO2008003071A8 (en) | Fiber optic sensor using a bragg fiber | |
WO2008002845A3 (en) | Multi-rate torsional coupling | |
TW200729700A (en) | Nested transimpedance amplifier | |
WO2007047639A3 (en) | Discovering network services | |
TW200717111A (en) | A display apparatus with a self-luminescing device and a non self-luminescing device | |
WO2008070334A8 (en) | Multi-wall structural components having enhanced radiation transmission capability | |
WO2007029168A3 (en) | Asynchronous ripple pipeline | |
EP1519206A3 (en) | Joined multi functional optical device | |
WO2009011919A3 (en) | Active blood vessel sleeve | |
WO2008081545A1 (en) | Optical transmission device and optical transmission method | |
WO2006102566A3 (en) | Apparatus for joining members and assembly thereof | |
DK1623116T3 (en) | Suspension arrangement for wind turbine tower | |
WO2008011582A3 (en) | Radiation attenuation device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200780031369.7 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 07806429 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2007806429 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12310197 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
NENP | Non-entry into the national phase |
Ref country code: RU |