WO2008023846A3 - Force sensor using a semiconductive substrate - Google Patents

Force sensor using a semiconductive substrate Download PDF

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Publication number
WO2008023846A3
WO2008023846A3 PCT/JP2007/066952 JP2007066952W WO2008023846A3 WO 2008023846 A3 WO2008023846 A3 WO 2008023846A3 JP 2007066952 W JP2007066952 W JP 2007066952W WO 2008023846 A3 WO2008023846 A3 WO 2008023846A3
Authority
WO
WIPO (PCT)
Prior art keywords
force sensor
glass
disposed
glass member
sensor chip
Prior art date
Application number
PCT/JP2007/066952
Other languages
French (fr)
Other versions
WO2008023846A2 (en
Inventor
Takeshi Ohsato
Shigenori Yasuie
Yusuke Hirabayashi
Hiroshi Yokobayashi
Original Assignee
Honda Motor Co Ltd
Takeshi Ohsato
Shigenori Yasuie
Yusuke Hirabayashi
Hiroshi Yokobayashi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd, Takeshi Ohsato, Shigenori Yasuie, Yusuke Hirabayashi, Hiroshi Yokobayashi filed Critical Honda Motor Co Ltd
Priority to EP07806429A priority Critical patent/EP2038628B1/en
Priority to US12/310,197 priority patent/US8113065B2/en
Priority to CN200780031369.7A priority patent/CN101506636B/en
Priority to DE602007005259T priority patent/DE602007005259D1/en
Publication of WO2008023846A2 publication Critical patent/WO2008023846A2/en
Publication of WO2008023846A3 publication Critical patent/WO2008023846A3/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/16Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
    • G01L5/161Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance
    • G01L5/162Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance of piezoresistors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/18Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/20Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2206Special supports with preselected places to mount the resistance strain gauges; Mounting of supports
    • G01L1/2231Special supports with preselected places to mount the resistance strain gauges; Mounting of supports the supports being disc- or ring-shaped, adapted for measuring a force along a single direction
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • Y10T29/49103Strain gauge making

Abstract

A force sensor 1 includes: a force sensor chip 2 including an action portion 21, a connecting portion 23 on which strain resistive elements are disposed, and a support portion 22 for supporting the action portion 21 and the connecting portion 23; an attenuator 3 including an input portion 30 to which an external force is input, a fixing portion 32 for fixing the force sensor chip 2, and a transmission portion 31 for attenuating the external force and transmitting the attenuated external force to the action portion 21; a first glass member 11 disposed between the action portion 21 and the transmission portion 31 and a second glass member 12 disposed between the support portion 22 and the fixing portion 32, through which glass members 11, 12 the force sensor chip 2 and the attenuator 3 are joined. A single or more glass beams 13 joins the first glass member 11 and the second glass member 12 together as a single member.
PCT/JP2007/066952 2006-08-24 2007-08-24 Force sensor using a semiconductive substrate WO2008023846A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP07806429A EP2038628B1 (en) 2006-08-24 2007-08-24 Force sensor using a semiconductive substrate
US12/310,197 US8113065B2 (en) 2006-08-24 2007-08-24 Force sensor
CN200780031369.7A CN101506636B (en) 2006-08-24 2007-08-24 Force sensor using a semiconductive substrate
DE602007005259T DE602007005259D1 (en) 2006-08-24 2007-08-24 FUEL SENSOR WITH A SEMICONDUCTIVE CARRIER

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-227467 2006-08-24
JP2006227467A JP5243704B2 (en) 2006-08-24 2006-08-24 Force sensor

Publications (2)

Publication Number Publication Date
WO2008023846A2 WO2008023846A2 (en) 2008-02-28
WO2008023846A3 true WO2008023846A3 (en) 2008-04-17

Family

ID=38983721

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/066952 WO2008023846A2 (en) 2006-08-24 2007-08-24 Force sensor using a semiconductive substrate

Country Status (6)

Country Link
US (1) US8113065B2 (en)
EP (1) EP2038628B1 (en)
JP (1) JP5243704B2 (en)
CN (1) CN101506636B (en)
DE (1) DE602007005259D1 (en)
WO (1) WO2008023846A2 (en)

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US9493342B2 (en) 2012-06-21 2016-11-15 Nextinput, Inc. Wafer level MEMS force dies
US9032818B2 (en) 2012-07-05 2015-05-19 Nextinput, Inc. Microelectromechanical load sensor and methods of manufacturing the same
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US9381647B2 (en) 2013-02-19 2016-07-05 Seiko Epson Corporation Force detection device, robot, and moving object
US10500471B2 (en) * 2013-05-17 2019-12-10 CNOWire, Inc. Impedance-based impact determination and scoring
WO2015106246A1 (en) 2014-01-13 2015-07-16 Nextinput, Inc. Miniaturized and ruggedized wafer level mems force sensors
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EP3307671B1 (en) 2015-06-10 2022-06-15 Nextinput, Inc. Ruggedized wafer level mems force sensor with a tolerance trench
WO2017006840A1 (en) * 2015-07-07 2017-01-12 日立オートモティブシステムズ株式会社 Semiconductor device, dynamic quantity measuring device and method for manufacturing semiconductor device
WO2017212866A1 (en) * 2016-06-08 2017-12-14 日立オートモティブシステムズ株式会社 Force sensor
JP6342971B2 (en) * 2016-11-14 2018-06-13 ファナック株式会社 Force detection device and robot
WO2018148510A1 (en) 2017-02-09 2018-08-16 Nextinput, Inc. Integrated piezoresistive and piezoelectric fusion force sensor
CN116907693A (en) 2017-02-09 2023-10-20 触控解决方案股份有限公司 Integrated digital force sensor and related manufacturing method
WO2019018641A1 (en) 2017-07-19 2019-01-24 Nextinput, Inc. Strain transfer stacking in a mems force sensor
US11423686B2 (en) 2017-07-25 2022-08-23 Qorvo Us, Inc. Integrated fingerprint and force sensor
WO2019023552A1 (en) 2017-07-27 2019-01-31 Nextinput, Inc. A wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture
US11579028B2 (en) 2017-10-17 2023-02-14 Nextinput, Inc. Temperature coefficient of offset compensation for force sensor and strain gauge
WO2019090057A1 (en) 2017-11-02 2019-05-09 Nextinput, Inc. Sealed force sensor with etch stop layer
WO2019099821A1 (en) 2017-11-16 2019-05-23 Nextinput, Inc. Force attenuator for force sensor
JP2020012660A (en) * 2018-07-13 2020-01-23 日本電産コパル電子株式会社 Torque sensor
EP3671141B1 (en) * 2018-12-20 2022-08-03 Bizerba SE & Co. KG Load cell and weighing foot
US10962427B2 (en) 2019-01-10 2021-03-30 Nextinput, Inc. Slotted MEMS force sensor
US11121096B2 (en) 2019-03-21 2021-09-14 International Business Machines Corporation Active control of electronic package warpage
JP2021071305A (en) * 2019-10-29 2021-05-06 ミネベアミツミ株式会社 Force sensor device
JP6771794B1 (en) * 2020-02-25 2020-10-21 株式会社トライフォース・マネジメント Force sensor
CN112326076A (en) * 2020-11-04 2021-02-05 重庆大学 Pressure sensor and installation mechanism thereof
JP2022101140A (en) * 2020-12-24 2022-07-06 ミネベアミツミ株式会社 Distortion-generating body and force sensor device
JP2022142116A (en) * 2021-03-16 2022-09-30 ミネベアミツミ株式会社 Strain body and force sensor device
CN115112286A (en) * 2021-03-19 2022-09-27 美蓓亚三美株式会社 Strain body and force sensor device
CN115290232A (en) * 2022-06-20 2022-11-04 无锡盛赛传感科技有限公司 Annular microminiature force-sensitive ceramic tension sensor

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Also Published As

Publication number Publication date
EP2038628A2 (en) 2009-03-25
JP5243704B2 (en) 2013-07-24
US8113065B2 (en) 2012-02-14
EP2038628B1 (en) 2010-03-10
CN101506636A (en) 2009-08-12
CN101506636B (en) 2011-04-20
US20090320610A1 (en) 2009-12-31
DE602007005259D1 (en) 2010-04-22
WO2008023846A2 (en) 2008-02-28
JP2008051625A (en) 2008-03-06

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