WO2008030468A3 - Microphotonic waveguide including core/cladding interface layer - Google Patents
Microphotonic waveguide including core/cladding interface layer Download PDFInfo
- Publication number
- WO2008030468A3 WO2008030468A3 PCT/US2007/019356 US2007019356W WO2008030468A3 WO 2008030468 A3 WO2008030468 A3 WO 2008030468A3 US 2007019356 W US2007019356 W US 2007019356W WO 2008030468 A3 WO2008030468 A3 WO 2008030468A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- interface layer
- waveguide
- longitudinal
- microphotonic
- layer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/132—Integrated optical circuits characterised by the manufacturing method by deposition of thin films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1223—Basic optical elements, e.g. light-guiding paths high refractive index type, i.e. high-contrast waveguides
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12097—Ridge, rib or the like
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/121—Channel; buried or the like
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12166—Manufacturing methods
- G02B2006/12169—Annealing
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12166—Manufacturing methods
- G02B2006/12176—Etching
Abstract
The invention provides a waveguide with a waveguide core having longitudinal sidewall surfaces, a longitudinal top surface, and a longitudinal bottom surface that is disposed on a substrate. An interface layer is disposed on at least one longitudinal sidewall surface of the waveguide core. A waveguide cladding layer is disposed on at least the waveguide core sidewall and top surfaces, over the interface layer. The waveguide of the invention can be produced by forming a waveguide undercladding layer on a substrate, and then forming a waveguide core on the undercladding layer. An interface layer is then formed on at least a longitudinal sidewall surface of the waveguide core, and an upper cladding layer is formed on a longitudinal top surface and on longitudinal sidewall surfaces of the waveguide core, over the interface layer.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US84271506P | 2006-09-07 | 2006-09-07 | |
US60/842,715 | 2006-09-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008030468A2 WO2008030468A2 (en) | 2008-03-13 |
WO2008030468A3 true WO2008030468A3 (en) | 2008-06-05 |
Family
ID=39157809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/019356 WO2008030468A2 (en) | 2006-09-07 | 2007-09-05 | Microphotonic waveguide including core/cladding interface layer |
Country Status (2)
Country | Link |
---|---|
US (1) | US7831123B2 (en) |
WO (1) | WO2008030468A2 (en) |
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US9311935B2 (en) * | 2013-11-07 | 2016-04-12 | HGST Netherlands B.V. | Method and apparatus for magnetic recording head having a waveguide |
US9696487B2 (en) * | 2014-04-28 | 2017-07-04 | The Regents Of The University Of California | Reduction of thermo-optic effects in silicon photonics |
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Citations (4)
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JPH08304644A (en) * | 1995-04-28 | 1996-11-22 | Nippon Telegr & Teleph Corp <Ntt> | Polymer optical waveguide |
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WO2003060569A2 (en) * | 2002-01-09 | 2003-07-24 | Massachussetts Institute Of Technology | High density integrated optical chip |
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2007
- 2007-09-05 WO PCT/US2007/019356 patent/WO2008030468A2/en active Application Filing
- 2007-09-05 US US11/899,234 patent/US7831123B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0819956A2 (en) * | 1992-02-05 | 1998-01-21 | BRITISH TELECOMMUNICATIONS public limited company | Silica waveguide structure |
JPH08304644A (en) * | 1995-04-28 | 1996-11-22 | Nippon Telegr & Teleph Corp <Ntt> | Polymer optical waveguide |
US20010041027A1 (en) * | 1998-12-21 | 2001-11-15 | Hornbeck Verne C. | On-chip single layer horizontal deflecting waveguide and damascene method of fabricating the same |
WO2003060569A2 (en) * | 2002-01-09 | 2003-07-24 | Massachussetts Institute Of Technology | High density integrated optical chip |
Also Published As
Publication number | Publication date |
---|---|
WO2008030468A2 (en) | 2008-03-13 |
US20080253728A1 (en) | 2008-10-16 |
US7831123B2 (en) | 2010-11-09 |
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