WO2008064070A1 - Optical bonding composition for led light source - Google Patents
Optical bonding composition for led light source Download PDFInfo
- Publication number
- WO2008064070A1 WO2008064070A1 PCT/US2007/084806 US2007084806W WO2008064070A1 WO 2008064070 A1 WO2008064070 A1 WO 2008064070A1 US 2007084806 W US2007084806 W US 2007084806W WO 2008064070 A1 WO2008064070 A1 WO 2008064070A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- oxide
- light source
- led light
- metal oxide
- optical element
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nanotechnology (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/514,630 US8026115B2 (en) | 2006-11-17 | 2007-11-15 | Optical bonding composition for LED light source |
JP2009537362A JP2010510671A (en) | 2006-11-17 | 2007-11-15 | Optical adhesive composition for LED light source |
CN200780042714.7A CN101548397B (en) | 2006-11-17 | 2007-11-15 | optical bonding composition for LED light source |
EP07864450A EP2092576A1 (en) | 2006-11-17 | 2007-11-15 | Optical bonding composition for led light source |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US86628006P | 2006-11-17 | 2006-11-17 | |
US60/866,280 | 2006-11-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008064070A1 true WO2008064070A1 (en) | 2008-05-29 |
Family
ID=39430051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/084806 WO2008064070A1 (en) | 2006-11-17 | 2007-11-15 | Optical bonding composition for led light source |
Country Status (7)
Country | Link |
---|---|
US (1) | US8026115B2 (en) |
EP (1) | EP2092576A1 (en) |
JP (1) | JP2010510671A (en) |
KR (1) | KR20090089431A (en) |
CN (1) | CN101548397B (en) |
TW (1) | TW200835765A (en) |
WO (1) | WO2008064070A1 (en) |
Cited By (3)
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---|---|---|---|---|
EP2327745A1 (en) * | 2006-01-18 | 2011-06-01 | Sparkxis B.V. | Novel monomeric and polymeric materials |
US9368699B2 (en) | 2010-06-22 | 2016-06-14 | Osram Opto Semiconductors Gmbh | Semiconductor component containing a highly refractive polymer material |
US20210384391A1 (en) * | 2019-02-28 | 2021-12-09 | AGC Inc. | Optical member with adhesive layer and light emitting device |
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DE102008016487A1 (en) * | 2008-03-31 | 2009-10-01 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component |
JP5087672B2 (en) | 2010-12-13 | 2012-12-05 | 株式会社東芝 | Semiconductor light emitting device |
KR20120071960A (en) | 2010-12-23 | 2012-07-03 | 삼성모바일디스플레이주식회사 | Metal-glass contact bonding method using an optical contact bonding, manufacturing method of an display apparatus using the same, and the display apparatus manufactured by the method |
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US10043942B2 (en) * | 2013-10-17 | 2018-08-07 | Luminus Devices, Inc. | Vertical multi-junction light emitting diode |
EP2953176A1 (en) * | 2014-06-02 | 2015-12-09 | Swarovski Energy GmbH | Lighting device |
CN104531052A (en) * | 2015-01-06 | 2015-04-22 | 段志春 | Nanometer zirconium-niobium silicone sealant and preparation method thereof |
JP6668608B2 (en) * | 2015-04-27 | 2020-03-18 | 日亜化学工業株式会社 | Light emitting device manufacturing method |
US10466404B2 (en) | 2016-05-12 | 2019-11-05 | Lumileds Llc | Collimating on-die optic |
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US10290779B2 (en) * | 2016-12-15 | 2019-05-14 | Panasonic Intellectual Property Management Co., Ltd. | Light emitting element |
CN108864952A (en) * | 2018-04-26 | 2018-11-23 | 华中光电技术研究所(中国船舶重工集团有限公司第七七研究所) | Optical glass part adhesive glue and adhesive technology |
JP2022529878A (en) * | 2019-04-19 | 2022-06-27 | マテリオン プレシジョン オプティクス (シャンハイ) リミテッド | High temperature resistant reflective layer for wavelength converter |
KR102269020B1 (en) * | 2019-12-13 | 2021-06-25 | 한국전자기술연구원 | LED mounted display and manufacturing method thereof |
JP7011195B2 (en) | 2020-02-27 | 2022-01-26 | 日亜化学工業株式会社 | Luminescent device |
CN114368947B (en) * | 2022-01-11 | 2023-07-25 | 澳门大学 | Nano foam glass bead concrete for door plate and preparation method thereof |
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2007
- 2007-11-15 US US12/514,630 patent/US8026115B2/en not_active Expired - Fee Related
- 2007-11-15 JP JP2009537362A patent/JP2010510671A/en not_active Withdrawn
- 2007-11-15 KR KR1020097012446A patent/KR20090089431A/en not_active Application Discontinuation
- 2007-11-15 EP EP07864450A patent/EP2092576A1/en not_active Withdrawn
- 2007-11-15 CN CN200780042714.7A patent/CN101548397B/en not_active Expired - Fee Related
- 2007-11-15 WO PCT/US2007/084806 patent/WO2008064070A1/en active Application Filing
- 2007-11-16 TW TW096143625A patent/TW200835765A/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09296113A (en) * | 1996-04-26 | 1997-11-18 | Toray Dow Corning Silicone Co Ltd | Electroconductive silicone rubber composition, production of semiconductor apparatus and semiconductor apparatus therefor |
JP2001139894A (en) * | 1999-11-15 | 2001-05-22 | Dow Corning Toray Silicone Co Ltd | Adhesive silicone sheet and semiconductor device |
WO2004077580A2 (en) * | 2003-02-26 | 2004-09-10 | Cree, Inc. | White light source using emitting diode and phosphor and method of fabrication |
US6806509B2 (en) * | 2003-03-12 | 2004-10-19 | Shin-Etsu Chemical Co., Ltd. | Light-emitting semiconductor potting composition and light-emitting semiconductor device |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2327745A1 (en) * | 2006-01-18 | 2011-06-01 | Sparkxis B.V. | Novel monomeric and polymeric materials |
US8323594B2 (en) | 2006-01-18 | 2012-12-04 | Sparkxis B.V. | Method of making hybrid organic-inorganic monomeric materials |
US9368699B2 (en) | 2010-06-22 | 2016-06-14 | Osram Opto Semiconductors Gmbh | Semiconductor component containing a highly refractive polymer material |
US9634207B2 (en) | 2010-06-22 | 2017-04-25 | Osram Opto Semiconductors Gmbh | Semiconductor component and method of producing a semiconductor component |
DE102010024545B4 (en) | 2010-06-22 | 2022-01-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Semiconductor device and method of manufacturing a semiconductor device |
US20210384391A1 (en) * | 2019-02-28 | 2021-12-09 | AGC Inc. | Optical member with adhesive layer and light emitting device |
Also Published As
Publication number | Publication date |
---|---|
CN101548397B (en) | 2011-12-21 |
EP2092576A1 (en) | 2009-08-26 |
TW200835765A (en) | 2008-09-01 |
CN101548397A (en) | 2009-09-30 |
KR20090089431A (en) | 2009-08-21 |
JP2010510671A (en) | 2010-04-02 |
US20100059776A1 (en) | 2010-03-11 |
US8026115B2 (en) | 2011-09-27 |
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