WO2008086366A3 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- WO2008086366A3 WO2008086366A3 PCT/US2008/050532 US2008050532W WO2008086366A3 WO 2008086366 A3 WO2008086366 A3 WO 2008086366A3 US 2008050532 W US2008050532 W US 2008050532W WO 2008086366 A3 WO2008086366 A3 WO 2008086366A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- region
- regions
- dielectric regions
- pair
- dielectric
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000012535 impurity Substances 0.000 abstract 1
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
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- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
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Abstract
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JP2009545646A JP5479915B2 (en) | 2007-01-09 | 2008-01-08 | Semiconductor device |
EP08727446A EP2109892A4 (en) | 2007-01-09 | 2008-01-08 | Semiconductor device |
CN2008800019458A CN101689562B (en) | 2007-01-09 | 2008-01-08 | Semiconductor device |
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US87943407P | 2007-01-09 | 2007-01-09 | |
US60/879,434 | 2007-01-09 |
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WO2008086366A3 true WO2008086366A3 (en) | 2008-09-18 |
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PCT/US2008/050532 WO2008086366A2 (en) | 2007-01-09 | 2008-01-08 | Semiconductor device |
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Families Citing this family (184)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6838722B2 (en) * | 2002-03-22 | 2005-01-04 | Siliconix Incorporated | Structures of and methods of fabricating trench-gated MIS devices |
US8093621B2 (en) | 2008-12-23 | 2012-01-10 | Power Integrations, Inc. | VTS insulated gate bipolar transistor |
US9437729B2 (en) * | 2007-01-08 | 2016-09-06 | Vishay-Siliconix | High-density power MOSFET with planarized metalization |
CN101641763B (en) * | 2007-01-09 | 2012-07-04 | 威力半导体有限公司 | Semiconductor device and method of manufacturing the same |
JP2008235788A (en) * | 2007-03-23 | 2008-10-02 | Sanyo Electric Co Ltd | Insulated-gate semiconductor device |
US9947770B2 (en) * | 2007-04-03 | 2018-04-17 | Vishay-Siliconix | Self-aligned trench MOSFET and method of manufacture |
JP2009026809A (en) * | 2007-07-17 | 2009-02-05 | Toyota Motor Corp | Semiconductor apparatus and manufacturing method thereof |
US9484451B2 (en) | 2007-10-05 | 2016-11-01 | Vishay-Siliconix | MOSFET active area and edge termination area charge balance |
US8710568B2 (en) * | 2007-10-24 | 2014-04-29 | Denso Corporation | Semiconductor device having a plurality of elements on one semiconductor substrate and method of manufacturing the same |
JP2011517061A (en) | 2008-03-13 | 2011-05-26 | エス.オー.アイ.テック シリコン オン インシュレータ テクノロジーズ | Substrate having a charged region in an insulating buried layer |
WO2009148695A2 (en) * | 2008-06-02 | 2009-12-10 | Maxpower Semiconductor Inc. | Edge termination for semiconductor devices |
US8310001B2 (en) * | 2008-07-15 | 2012-11-13 | Maxpower Semiconductor Inc. | MOSFET switch with embedded electrostatic charge |
EP2308095A1 (en) | 2008-07-25 | 2011-04-13 | Nxp B.V. | A trench-gate semiconductor device |
US7960783B2 (en) * | 2008-08-25 | 2011-06-14 | Maxpower Semiconductor Inc. | Devices containing permanent charge |
US8022474B2 (en) | 2008-09-30 | 2011-09-20 | Infineon Technologies Austria Ag | Semiconductor device |
TWI387106B (en) * | 2008-10-16 | 2013-02-21 | Vanguard Int Semiconduct Corp | Insulated gate bipolar transistor (igbt) electrostatic discharge (esd) protection devices |
US8378416B2 (en) * | 2008-12-01 | 2013-02-19 | Maxpower Semiconductor, Inc. | MOS-gated power devices, methods, and integrated circuits |
JP2010135594A (en) * | 2008-12-05 | 2010-06-17 | Toyota Central R&D Labs Inc | Diode |
US8278691B2 (en) * | 2008-12-11 | 2012-10-02 | Micron Technology, Inc. | Low power memory device with JFET device structures |
US7871882B2 (en) | 2008-12-20 | 2011-01-18 | Power Integrations, Inc. | Method of fabricating a deep trench insulated gate bipolar transistor |
US20100155831A1 (en) * | 2008-12-20 | 2010-06-24 | Power Integrations, Inc. | Deep trench insulated gate bipolar transistor |
US8049307B2 (en) | 2009-01-23 | 2011-11-01 | Vanguard International Semiconductor Corporation | Insulated gate bipolar transistor (IGBT) electrostatic discharge (ESD) protection devices |
US8319278B1 (en) | 2009-03-31 | 2012-11-27 | Maxpower Semiconductor, Inc. | Power device structures and methods using empty space zones |
US8847307B2 (en) | 2010-04-13 | 2014-09-30 | Maxpower Semiconductor, Inc. | Power semiconductor devices, methods, and structures with embedded dielectric layers containing permanent charges |
FR2945672A1 (en) * | 2009-05-18 | 2010-11-19 | St Microelectronics Sa | PHOTODIODE WITH INTERFACE LOAD CONTROL BY IMPLANTATION AND ASSOCIATED METHOD. |
FR2945671A1 (en) * | 2009-05-18 | 2010-11-19 | St Microelectronics Sa | PHOTODIODE WITH INTERFACE LOAD CONTROL AND ASSOCIATED METHOD. |
US8330214B2 (en) * | 2009-05-28 | 2012-12-11 | Maxpower Semiconductor, Inc. | Power semiconductor device |
US10205017B2 (en) * | 2009-06-17 | 2019-02-12 | Alpha And Omega Semiconductor Incorporated | Bottom source NMOS triggered Zener clamp for configuring an ultra-low voltage transient voltage suppressor (TVS) |
WO2011008717A2 (en) * | 2009-07-13 | 2011-01-20 | Maxpower Semiconductor Inc. | Integrated power supplies and combined high-side plus low-side switches |
US9443974B2 (en) | 2009-08-27 | 2016-09-13 | Vishay-Siliconix | Super junction trench power MOSFET device fabrication |
US9425305B2 (en) | 2009-10-20 | 2016-08-23 | Vishay-Siliconix | Structures of and methods of fabricating split gate MIS devices |
US9431530B2 (en) * | 2009-10-20 | 2016-08-30 | Vishay-Siliconix | Super-high density trench MOSFET |
US9419129B2 (en) | 2009-10-21 | 2016-08-16 | Vishay-Siliconix | Split gate semiconductor device with curved gate oxide profile |
US10026835B2 (en) * | 2009-10-28 | 2018-07-17 | Vishay-Siliconix | Field boosted metal-oxide-semiconductor field effect transistor |
DE102009051745B4 (en) | 2009-11-03 | 2017-09-21 | Austriamicrosystems Ag | High-voltage transistor with multiple dielectric and manufacturing process |
US8198678B2 (en) | 2009-12-09 | 2012-06-12 | Infineon Technologies Austria Ag | Semiconductor device with improved on-resistance |
US8546893B2 (en) * | 2010-01-12 | 2013-10-01 | Mohamed N. Darwish | Devices, components and methods combining trench field plates with immobile electrostatic charge |
EP2543072B1 (en) | 2010-03-02 | 2021-10-06 | Vishay-Siliconix | Structures and methods of fabricating dual gate devices |
JP2011233701A (en) * | 2010-04-27 | 2011-11-17 | Toshiba Corp | Power semiconductor device |
WO2012006261A2 (en) * | 2010-07-06 | 2012-01-12 | Maxpower Semiconductor Inc. | Power semiconductor devices, structures, and related methods |
US8786012B2 (en) | 2010-07-26 | 2014-07-22 | Infineon Technologies Austria Ag | Power semiconductor device and a method for forming a semiconductor device |
US8614478B2 (en) | 2010-07-26 | 2013-12-24 | Infineon Technologies Austria Ag | Method for protecting a semiconductor device against degradation, a semiconductor device protected against hot charge carriers and a manufacturing method therefor |
CN102403354A (en) * | 2010-09-15 | 2012-04-04 | 无锡华润上华半导体有限公司 | CoolMOS device and manufacturing method for same |
CN102130182B (en) * | 2010-11-03 | 2012-11-21 | 绍兴旭昌科技企业有限公司 | Current regulation diode chip and manufacturing method thereof |
CN102569384B (en) * | 2010-12-17 | 2015-07-01 | 无锡华润上华半导体有限公司 | Groove MOSFET (metal-oxide-semiconductor field-effect transistor) device and manufacturing method thereof |
US8841664B2 (en) * | 2011-03-04 | 2014-09-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8754472B2 (en) * | 2011-03-10 | 2014-06-17 | O2Micro, Inc. | Methods for fabricating transistors including one or more circular trenches |
US8598654B2 (en) * | 2011-03-16 | 2013-12-03 | Fairchild Semiconductor Corporation | MOSFET device with thick trench bottom oxide |
TW201240087A (en) * | 2011-03-30 | 2012-10-01 | Anpec Electronics Corp | Power device with boundary trench structure |
JP5729331B2 (en) * | 2011-04-12 | 2015-06-03 | 株式会社デンソー | Semiconductor device manufacturing method and semiconductor device |
CN102191563B (en) * | 2011-04-22 | 2012-09-19 | 中国科学院半导体研究所 | Preparation method of codoped silicon-base impurity intermediate belt material |
US8692318B2 (en) * | 2011-05-10 | 2014-04-08 | Nanya Technology Corp. | Trench MOS structure and method for making the same |
US8912595B2 (en) * | 2011-05-12 | 2014-12-16 | Nanya Technology Corp. | Trench MOS structure and method for forming the same |
JP2014518017A (en) | 2011-05-18 | 2014-07-24 | ビシャイ‐シリコニックス | Semiconductor device |
JP5874893B2 (en) * | 2011-05-23 | 2016-03-02 | サンケン電気株式会社 | Semiconductor device |
CN102420117A (en) * | 2011-06-07 | 2012-04-18 | 上海华力微电子有限公司 | Method for improving negative bias temperature instability of gate-last positive channel metal oxide semiconductor (PMOS) |
US8680607B2 (en) * | 2011-06-20 | 2014-03-25 | Maxpower Semiconductor, Inc. | Trench gated power device with multiple trench width and its fabrication process |
US9984894B2 (en) * | 2011-08-03 | 2018-05-29 | Cree, Inc. | Forming SiC MOSFETs with high channel mobility by treating the oxide interface with cesium ions |
US9818859B2 (en) * | 2011-08-26 | 2017-11-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Quasi-vertical power MOSFET and methods of forming the same |
CN102569091B (en) * | 2011-08-29 | 2014-07-23 | 上海华力微电子有限公司 | Preparation method of Gate-last 1TDRAM |
US8816503B2 (en) | 2011-08-29 | 2014-08-26 | Infineon Technologies Austria Ag | Semiconductor device with buried electrode |
CN103021853B (en) * | 2011-09-23 | 2015-11-11 | 北大方正集团有限公司 | The method of process semiconductor device and semiconductor device |
JP5849882B2 (en) * | 2011-09-27 | 2016-02-03 | 株式会社デンソー | Semiconductor device provided with vertical semiconductor element |
JP2013093560A (en) * | 2011-10-06 | 2013-05-16 | Denso Corp | Semiconductor device including vertical semiconductor element |
US9431249B2 (en) | 2011-12-01 | 2016-08-30 | Vishay-Siliconix | Edge termination for super junction MOSFET devices |
US9614043B2 (en) | 2012-02-09 | 2017-04-04 | Vishay-Siliconix | MOSFET termination trench |
CN104106142B (en) * | 2012-02-10 | 2016-03-09 | 松下知识产权经营株式会社 | Semiconductor device and manufacture method thereof |
US9024379B2 (en) * | 2012-02-13 | 2015-05-05 | Maxpower Semiconductor Inc. | Trench transistors and methods with low-voltage-drop shunt to body diode |
CN102569411B (en) * | 2012-03-02 | 2014-12-03 | 成都芯源系统有限公司 | Semiconductor device and method for manufacturing the same |
CN103325685A (en) * | 2012-03-23 | 2013-09-25 | 无锡维赛半导体有限公司 | Deep groove power semiconductor field effect transistor and manufacturing method thereof |
TWM439885U (en) * | 2012-04-13 | 2012-10-21 | Taiwan Semiconductor Co Ltd | Semiconductor component trench structure |
TWM435716U (en) * | 2012-04-13 | 2012-08-11 | Taiwan Semiconductor Co Ltd | The active region of the trench distributed arrangement of the semiconductor device structure |
WO2013166079A1 (en) * | 2012-04-30 | 2013-11-07 | Vishay-Siliconix | Integrated circuit design |
US9099519B2 (en) * | 2012-05-23 | 2015-08-04 | Great Wall Semiconductor Corporation | Semiconductor device and method of forming junction enhanced trench power MOSFET |
US9842911B2 (en) | 2012-05-30 | 2017-12-12 | Vishay-Siliconix | Adaptive charge balanced edge termination |
JP2013251397A (en) * | 2012-05-31 | 2013-12-12 | Denso Corp | Semiconductor device |
US8921931B2 (en) * | 2012-06-04 | 2014-12-30 | Infineon Technologies Austria Ag | Semiconductor device with trench structures including a recombination structure and a fill structure |
JP6061504B2 (en) * | 2012-06-07 | 2017-01-18 | ルネサスエレクトロニクス株式会社 | Semiconductor device and manufacturing method of semiconductor device |
US9293357B2 (en) * | 2012-07-02 | 2016-03-22 | Texas Instruments Incorporated | Sinker with a reduced width |
US8669611B2 (en) * | 2012-07-11 | 2014-03-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for power MOS transistor |
US9130060B2 (en) | 2012-07-11 | 2015-09-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit having a vertical power MOS transistor |
US8829562B2 (en) * | 2012-07-24 | 2014-09-09 | Infineon Technologies Ag | Semiconductor device including a dielectric structure in a trench |
US8598655B1 (en) * | 2012-08-03 | 2013-12-03 | Infineon Technologies Dresden Gmbh | Semiconductor device and method for manufacturing a semiconductor device |
KR101920247B1 (en) * | 2012-09-17 | 2018-11-20 | 삼성전자 주식회사 | Semiconductor device and fabricating method thereof |
US9941403B2 (en) * | 2012-09-26 | 2018-04-10 | Infineon Technologies Ag | Semiconductor device and method for manufacturing a semiconductor device |
CN103854979B (en) * | 2012-11-28 | 2017-03-29 | 上海华虹宏力半导体制造有限公司 | A kind of super junction extension CMP method |
US9799762B2 (en) | 2012-12-03 | 2017-10-24 | Infineon Technologies Ag | Semiconductor device and method of manufacturing a semiconductor device |
US9853140B2 (en) * | 2012-12-31 | 2017-12-26 | Vishay-Siliconix | Adaptive charge balanced MOSFET techniques |
CN103035745B (en) * | 2012-12-31 | 2016-01-20 | 杭州士兰集成电路有限公司 | The current regulator diode adopting cutting technique to be formed and manufacture method thereof |
US9245994B2 (en) * | 2013-02-07 | 2016-01-26 | Texas Instruments Incorporated | MOSFET with curved trench feature coupling termination trench to active trench |
US8748976B1 (en) * | 2013-03-06 | 2014-06-10 | Texas Instruments Incorporated | Dual RESURF trench field plate in vertical MOSFET |
US9306061B2 (en) | 2013-03-13 | 2016-04-05 | Cree, Inc. | Field effect transistor devices with protective regions |
US9240476B2 (en) | 2013-03-13 | 2016-01-19 | Cree, Inc. | Field effect transistor devices with buried well regions and epitaxial layers |
US9142668B2 (en) | 2013-03-13 | 2015-09-22 | Cree, Inc. | Field effect transistor devices with buried well protection regions |
US9012984B2 (en) * | 2013-03-13 | 2015-04-21 | Cree, Inc. | Field effect transistor devices with regrown p-layers |
CN103219386B (en) * | 2013-04-22 | 2016-01-20 | 南京邮电大学 | A kind of lateral power with high K insulation layer |
JP2014216573A (en) * | 2013-04-26 | 2014-11-17 | 株式会社東芝 | Semiconductor device |
US9000515B2 (en) * | 2013-05-22 | 2015-04-07 | Force Mos Technology Co., Ltd. | Super-junction trench MOSFETs with short terminations |
US9620637B2 (en) * | 2013-05-24 | 2017-04-11 | Infineon Technologies Ag | Semiconductor device comprising a gate electrode connected to a source terminal |
US9269713B2 (en) * | 2013-06-04 | 2016-02-23 | Infineon Technologies Austria Ag | Semiconductor device and method for producing the same |
US20150035002A1 (en) * | 2013-07-31 | 2015-02-05 | Infineon Technologies Austria Ag | Super Junction Semiconductor Device and Manufacturing Method |
US9224768B2 (en) * | 2013-08-05 | 2015-12-29 | Raytheon Company | Pin diode structure having surface charge suppression |
US9111766B2 (en) * | 2013-09-24 | 2015-08-18 | Infineon Technologies Austria Ag | Transistor device with a field electrode |
US9306058B2 (en) | 2013-10-02 | 2016-04-05 | Infineon Technologies Ag | Integrated circuit and method of manufacturing an integrated circuit |
US9287404B2 (en) | 2013-10-02 | 2016-03-15 | Infineon Technologies Austria Ag | Semiconductor device and method of manufacturing a semiconductor device with lateral FET cells and field plates |
US9401399B2 (en) | 2013-10-15 | 2016-07-26 | Infineon Technologies Ag | Semiconductor device |
US20150118810A1 (en) * | 2013-10-24 | 2015-04-30 | Madhur Bobde | Buried field ring field effect transistor (buf-fet) integrated with cells implanted with hole supply path |
CN203659877U (en) * | 2013-10-30 | 2014-06-18 | 英飞凌科技奥地利有限公司 | Super junction device and semiconductor structure comprising same |
KR20150051067A (en) * | 2013-11-01 | 2015-05-11 | 삼성전기주식회사 | Power semiconductor device and method of fabricating the same |
US10395970B2 (en) * | 2013-12-05 | 2019-08-27 | Vishay-Siliconix | Dual trench structure |
US9543389B2 (en) * | 2013-12-11 | 2017-01-10 | Infineon Technologies Ag | Semiconductor device with recombination region |
US9543396B2 (en) * | 2013-12-13 | 2017-01-10 | Power Integrations, Inc. | Vertical transistor device structure with cylindrically-shaped regions |
JP5989689B2 (en) * | 2014-01-27 | 2016-09-07 | トヨタ自動車株式会社 | Semiconductor device |
US9761702B2 (en) | 2014-02-04 | 2017-09-12 | MaxPower Semiconductor | Power MOSFET having planar channel, vertical current path, and top drain electrode |
US9634128B2 (en) | 2014-03-17 | 2017-04-25 | Kabushiki Kaisha Toshiba | Semiconductor device |
KR20150108291A (en) * | 2014-03-17 | 2015-09-25 | 가부시끼가이샤 도시바 | Semiconductor device |
JP6226786B2 (en) * | 2014-03-19 | 2017-11-08 | 三菱電機株式会社 | Semiconductor device and manufacturing method thereof |
US9524960B2 (en) | 2014-04-01 | 2016-12-20 | Empire Technoogy Development Llc | Vertical transistor with flashover protection |
KR102242580B1 (en) * | 2014-04-23 | 2021-04-22 | 삼성전자주식회사 | Image sensor and method of forming the same |
US9385187B2 (en) * | 2014-04-25 | 2016-07-05 | Texas Instruments Incorporated | High breakdown N-type buried layer |
DE102014107325B4 (en) * | 2014-05-23 | 2023-08-10 | Infineon Technologies Ag | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE |
US9245754B2 (en) | 2014-05-28 | 2016-01-26 | Mark E. Granahan | Simplified charge balance in a semiconductor device |
US9508596B2 (en) | 2014-06-20 | 2016-11-29 | Vishay-Siliconix | Processes used in fabricating a metal-insulator-semiconductor field effect transistor |
US9887259B2 (en) | 2014-06-23 | 2018-02-06 | Vishay-Siliconix | Modulated super junction power MOSFET devices |
EP3183754A4 (en) | 2014-08-19 | 2018-05-02 | Vishay-Siliconix | Super-junction metal oxide semiconductor field effect transistor |
KR102026543B1 (en) | 2014-08-19 | 2019-09-27 | 비쉐이-실리코닉스 | Electronic circuit |
CN104201194B (en) * | 2014-08-26 | 2016-10-05 | 电子科技大学 | A kind of high voltage power device with Ultra-low Specific on-resistance characteristics |
JP2016058679A (en) * | 2014-09-12 | 2016-04-21 | 株式会社東芝 | Semiconductor device and method of manufacturing the same |
JP6763779B2 (en) | 2014-11-18 | 2020-09-30 | ローム株式会社 | Semiconductor devices and methods for manufacturing semiconductor devices |
US9406750B2 (en) | 2014-11-19 | 2016-08-02 | Empire Technology Development Llc | Output capacitance reduction in power transistors |
US9443973B2 (en) * | 2014-11-26 | 2016-09-13 | Infineon Technologies Austria Ag | Semiconductor device with charge compensation region underneath gate trench |
CN105826195B (en) * | 2015-01-07 | 2018-12-04 | 北大方正集团有限公司 | A kind of super junction power device and preparation method thereof |
DE102015100390B4 (en) * | 2015-01-13 | 2021-02-11 | Infineon Technologies Austria Ag | SEMI-CONDUCTOR DEVICE WITH FIELD PLATE STRUCTURES AND GATE ELECTRODE STRUCTURES BETWEEN THE FIELD PLATE STRUCTURES AND MANUFACTURING METHOD |
JP2016134546A (en) * | 2015-01-21 | 2016-07-25 | トヨタ自動車株式会社 | Semiconductor device and manufacturing method of the same |
JP6126150B2 (en) * | 2015-03-06 | 2017-05-10 | トヨタ自動車株式会社 | Semiconductor device |
US10854761B1 (en) * | 2015-03-30 | 2020-12-01 | Southern Methodist University | Electronic switch and active artificial dielectric |
US9299830B1 (en) | 2015-05-07 | 2016-03-29 | Texas Instruments Incorporated | Multiple shielding trench gate fet |
DE102015109545B4 (en) * | 2015-06-15 | 2021-10-21 | Infineon Technologies Ag | Transistor with field electrodes and improved avalanche breakdown behavior |
US9673314B2 (en) | 2015-07-08 | 2017-06-06 | Vishay-Siliconix | Semiconductor device with non-uniform trench oxide layer |
DE102015111210A1 (en) * | 2015-07-10 | 2017-01-12 | Infineon Technologies Dresden Gmbh | METHOD FOR FILLING A DIG AND SEMICONDUCTOR ELEMENT |
US9786753B2 (en) * | 2015-07-13 | 2017-10-10 | Diodes Incorporated | Self-aligned dual trench device |
WO2017019074A1 (en) * | 2015-07-30 | 2017-02-02 | Diodes Incorporated | Multi-trench semiconductor devices |
US10020362B2 (en) * | 2015-09-04 | 2018-07-10 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
CN105070760B (en) * | 2015-09-06 | 2017-12-19 | 电子科技大学 | A kind of power MOS (Metal Oxide Semiconductor) device |
US20170077292A1 (en) * | 2015-09-10 | 2017-03-16 | Kabushiki Kaisha Toyota Jidoshokki | Trench-gate semiconductor device and manufacturing method thereof |
JP2017054958A (en) * | 2015-09-10 | 2017-03-16 | 株式会社東芝 | Semiconductor device |
JP6551156B2 (en) * | 2015-10-29 | 2019-07-31 | 富士電機株式会社 | Super junction MOSFET device and semiconductor chip |
DE102015122804B4 (en) | 2015-12-23 | 2020-10-15 | Infineon Technologies Ag | A semiconductor device including a heat sink structure |
JP6701789B2 (en) | 2016-02-19 | 2020-05-27 | 富士電機株式会社 | RB-IGBT |
JP6523997B2 (en) * | 2016-03-14 | 2019-06-05 | 株式会社東芝 | Semiconductor device manufacturing method |
DE102016109555A1 (en) * | 2016-05-24 | 2017-11-30 | Infineon Technologies Austria Ag | POWER SEMICONDUCTOR ELEMENT AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR COMPONENT |
DE102016112721B4 (en) * | 2016-07-12 | 2022-02-03 | Infineon Technologies Ag | N-channel power semiconductor device with p-layer in drift volume |
JP6583169B2 (en) * | 2016-07-19 | 2019-10-02 | 株式会社豊田自動織機 | Trench gate type semiconductor device |
CN106098781B (en) * | 2016-08-17 | 2018-10-26 | 电子科技大学 | A kind of VDMOS of groove structure |
WO2018034818A1 (en) * | 2016-08-18 | 2018-02-22 | Maxpower Semiconductor Inc. | Power mosfet having planar channel, vertical current path, and top drain electrode |
US9985092B2 (en) * | 2016-09-13 | 2018-05-29 | Nexperia B.V. | PowerMOS |
JP6626021B2 (en) * | 2017-02-15 | 2019-12-25 | トヨタ自動車株式会社 | Nitride semiconductor device |
US10355072B2 (en) * | 2017-02-24 | 2019-07-16 | Globalfoundries Singapore Pte. Ltd. | Power trench capacitor compatible with deep trench isolation process |
EP3545556A4 (en) * | 2017-03-30 | 2020-10-14 | INTEL Corporation | Vertically stacked transistors in a fin |
JP6869791B2 (en) * | 2017-04-21 | 2021-05-12 | 三菱電機株式会社 | Semiconductor switching elements and their manufacturing methods |
US10177044B2 (en) * | 2017-05-05 | 2019-01-08 | Newport Fab, Llc | Bulk CMOS RF switch with reduced parasitic capacitance |
CN109216256B (en) * | 2017-07-03 | 2021-01-05 | 无锡华润上华科技有限公司 | Trench isolation structure and manufacturing method thereof |
KR102192651B1 (en) * | 2017-08-23 | 2020-12-17 | 노을 주식회사 | Storage medium storing reagent and test method and test module using the storage medium |
KR102417367B1 (en) * | 2017-12-14 | 2022-07-05 | 현대자동차 주식회사 | Semiconductor device |
CN108550621A (en) * | 2018-04-28 | 2018-09-18 | 重庆大学 | It is a kind of that there is the superjunction silicon carbide VDMOS device for becoming K media slots |
JP6626929B1 (en) * | 2018-06-29 | 2019-12-25 | 京セラ株式会社 | Semiconductor devices and electrical equipment |
JP7210182B2 (en) * | 2018-07-26 | 2023-01-23 | 株式会社東芝 | Semiconductor devices, inverter circuits, drive devices, vehicles, and elevators |
JP2019050434A (en) * | 2019-01-04 | 2019-03-28 | 株式会社東芝 | Semiconductor device |
CN113396482B (en) * | 2019-02-07 | 2023-12-19 | 罗姆股份有限公司 | Semiconductor device with a semiconductor device having a plurality of semiconductor chips |
US11217541B2 (en) | 2019-05-08 | 2022-01-04 | Vishay-Siliconix, LLC | Transistors with electrically active chip seal ring and methods of manufacture |
US11171206B2 (en) * | 2019-07-11 | 2021-11-09 | Micron Technology, Inc. | Channel conduction in semiconductor devices |
US20210072304A1 (en) * | 2019-09-09 | 2021-03-11 | Analog Devices International Unlimited Company | Semiconductor device configured for gate dielectric monitoring |
US11218144B2 (en) | 2019-09-12 | 2022-01-04 | Vishay-Siliconix, LLC | Semiconductor device with multiple independent gates |
TWI739252B (en) * | 2019-12-25 | 2021-09-11 | 杰力科技股份有限公司 | Trench mosfet and manufacturing method of the same |
US11316042B2 (en) * | 2020-01-31 | 2022-04-26 | Power Integrations, Inc. | Process and structure for a superjunction device |
US11610982B2 (en) * | 2020-09-15 | 2023-03-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Void elimination for gap-filling in high-aspect ratio trenches |
US20220085192A1 (en) * | 2020-09-16 | 2022-03-17 | Kabushiki Kaisha Toshiba | Semiconductor device |
US11569353B2 (en) | 2021-02-02 | 2023-01-31 | Micron Technology, Inc. | Apparatuses including passing word lines comprising a band offset material, and related methods and systems |
JP7447038B2 (en) | 2021-03-09 | 2024-03-11 | 株式会社東芝 | semiconductor equipment |
CN115312586B (en) * | 2022-09-01 | 2023-10-17 | 江苏长晶科技股份有限公司 | Silicon carbide power device |
CN115241277B (en) * | 2022-09-22 | 2023-01-10 | 深圳芯能半导体技术有限公司 | Isolated trench MOS device and preparation method thereof |
CN115775823B (en) * | 2022-11-29 | 2023-07-21 | 上海功成半导体科技有限公司 | Shielding grid power device and preparation method thereof |
CN116313809B (en) * | 2023-03-14 | 2024-02-23 | 深圳市至信微电子有限公司 | Preparation method and application of groove type MOS field effect transistor |
CN117374125A (en) * | 2023-12-06 | 2024-01-09 | 无锡锡产微芯半导体有限公司 | Trench MOSFET device and preparation process thereof |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6184555B1 (en) * | 1996-02-05 | 2001-02-06 | Siemens Aktiengesellschaft | Field effect-controlled semiconductor component |
US6201291B1 (en) * | 1997-12-10 | 2001-03-13 | U.S. Philips Corporation | Semiconductor device and method of manufacturing such a device |
US6608350B2 (en) * | 2000-12-07 | 2003-08-19 | International Rectifier Corporation | High voltage vertical conduction superjunction semiconductor device |
US6724042B2 (en) * | 2000-02-09 | 2004-04-20 | Fuji Electric Co., Ltd. | Super-junction semiconductor device |
US6812525B2 (en) * | 2002-06-25 | 2004-11-02 | International Rectifier Corporation | Trench fill process |
US20070158740A1 (en) * | 2005-11-28 | 2007-07-12 | Fuji Electric Holdings Co., Ltd. | Semiconductor device and manufacturing method of the semiconductor device |
Family Cites Families (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6021A (en) * | 1849-01-09 | Cast-iron cab-wheel | ||
US203576A (en) * | 1878-05-14 | Improvement in book-clamps | ||
US41407A (en) * | 1864-01-26 | Improvement in plows | ||
US60916A (en) * | 1867-01-01 | Theophiltjs f | ||
GB2028582A (en) | 1978-08-17 | 1980-03-05 | Plessey Co Ltd | Field effect structure |
US4978631A (en) * | 1986-07-25 | 1990-12-18 | Siliconix Incorporated | Current source with a process selectable temperature coefficient |
US5243212A (en) * | 1987-12-22 | 1993-09-07 | Siliconix Incorporated | Transistor with a charge induced drain extension |
JPH01185936A (en) | 1988-01-21 | 1989-07-25 | Fujitsu Ltd | Semiconductor device |
JPH0834242B2 (en) | 1988-12-08 | 1996-03-29 | 日本電気株式会社 | Semiconductor device and manufacturing method thereof |
US5282018A (en) * | 1991-01-09 | 1994-01-25 | Kabushiki Kaisha Toshiba | Power semiconductor device having gate structure in trench |
CN1019720B (en) * | 1991-03-19 | 1992-12-30 | 电子科技大学 | Power semiconductor device |
DE4333661C1 (en) | 1993-10-01 | 1995-02-16 | Daimler Benz Ag | Semiconductor component with high breakdown voltage |
JP3307785B2 (en) * | 1994-12-13 | 2002-07-24 | 三菱電機株式会社 | Insulated gate semiconductor device |
US6078090A (en) * | 1997-04-02 | 2000-06-20 | Siliconix Incorporated | Trench-gated Schottky diode with integral clamping diode |
US5637898A (en) * | 1995-12-22 | 1997-06-10 | North Carolina State University | Vertical field effect transistors having improved breakdown voltage capability and low on-state resistance |
JPH09283754A (en) * | 1996-04-16 | 1997-10-31 | Toshiba Corp | High withstand voltage semiconductor device |
JPH10256550A (en) * | 1997-01-09 | 1998-09-25 | Toshiba Corp | Semiconductor device |
JP3938964B2 (en) * | 1997-02-10 | 2007-06-27 | 三菱電機株式会社 | High voltage semiconductor device and manufacturing method thereof |
JP3191747B2 (en) | 1997-11-13 | 2001-07-23 | 富士電機株式会社 | MOS type semiconductor device |
US6069372A (en) * | 1998-01-22 | 2000-05-30 | Mitsubishi Denki Kabushiki Kaisha | Insulated gate type semiconductor device with potential detection gate for overvoltage protection |
KR100295063B1 (en) * | 1998-06-30 | 2001-08-07 | 김덕중 | Power semiconductor device having trench gate structure and method for fabricating thereof |
GB9815021D0 (en) * | 1998-07-11 | 1998-09-09 | Koninkl Philips Electronics Nv | Semiconductor power device manufacture |
US5998833A (en) * | 1998-10-26 | 1999-12-07 | North Carolina State University | Power semiconductor devices having improved high frequency switching and breakdown characteristics |
US6351018B1 (en) * | 1999-02-26 | 2002-02-26 | Fairchild Semiconductor Corporation | Monolithically integrated trench MOSFET and Schottky diode |
US6191447B1 (en) * | 1999-05-28 | 2001-02-20 | Micro-Ohm Corporation | Power semiconductor devices that utilize tapered trench-based insulating regions to improve electric field profiles in highly doped drift region mesas and methods of forming same |
JP3971062B2 (en) * | 1999-07-29 | 2007-09-05 | 株式会社東芝 | High voltage semiconductor device |
GB0003186D0 (en) | 2000-02-12 | 2000-04-05 | Koninkl Philips Electronics Nv | A semiconductor device |
JP4363736B2 (en) * | 2000-03-01 | 2009-11-11 | 新電元工業株式会社 | Transistor and manufacturing method thereof |
GB0006957D0 (en) * | 2000-03-23 | 2000-05-10 | Koninkl Philips Electronics Nv | A semiconductor device |
US6541820B1 (en) | 2000-03-28 | 2003-04-01 | International Rectifier Corporation | Low voltage planar power MOSFET with serpentine gate pattern |
JP2003533889A (en) * | 2000-05-13 | 2003-11-11 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Trench gate semiconductor device |
US6391699B1 (en) * | 2000-06-05 | 2002-05-21 | Fairchild Semiconductor Corporation | Method of manufacturing a trench MOSFET using selective growth epitaxy |
US6445035B1 (en) * | 2000-07-24 | 2002-09-03 | Fairchild Semiconductor Corporation | Power MOS device with buried gate and groove |
US6696726B1 (en) * | 2000-08-16 | 2004-02-24 | Fairchild Semiconductor Corporation | Vertical MOSFET with ultra-low resistance and low gate charge |
JP4764987B2 (en) * | 2000-09-05 | 2011-09-07 | 富士電機株式会社 | Super junction semiconductor device |
US6509233B2 (en) * | 2000-10-13 | 2003-01-21 | Siliconix Incorporated | Method of making trench-gated MOSFET having cesium gate oxide layer |
US6525372B2 (en) | 2000-11-16 | 2003-02-25 | Silicon Wireless Corporation | Vertical power devices having insulated source electrodes in discontinuous deep trenches |
US7345342B2 (en) * | 2001-01-30 | 2008-03-18 | Fairchild Semiconductor Corporation | Power semiconductor devices and methods of manufacture |
US6710403B2 (en) * | 2002-07-30 | 2004-03-23 | Fairchild Semiconductor Corporation | Dual trench power MOSFET |
US6677641B2 (en) * | 2001-10-17 | 2004-01-13 | Fairchild Semiconductor Corporation | Semiconductor structure with improved smaller forward voltage loss and higher blocking capability |
WO2002084745A2 (en) * | 2001-04-11 | 2002-10-24 | Silicon Wireless Corporation | Power semiconductor devices and methods of forming same |
US20020179968A1 (en) | 2001-05-30 | 2002-12-05 | Frank Pfirsch | Power semiconductor component, compensation component, power transistor, and method for producing power semiconductor components |
US6555873B2 (en) * | 2001-09-07 | 2003-04-29 | Power Integrations, Inc. | High-voltage lateral transistor with a multi-layered extended drain structure |
DE10144268B4 (en) * | 2001-09-08 | 2015-03-05 | Robert Bosch Gmbh | Device for measuring the strength of a vector component of a magnetic field |
CN1181559C (en) | 2001-11-21 | 2004-12-22 | 同济大学 | Voltage-withstanding layer consisting of high dielectric coefficient medium and semiconductor |
WO2003065459A1 (en) | 2002-01-28 | 2003-08-07 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US7384854B2 (en) | 2002-03-08 | 2008-06-10 | International Business Machines Corporation | Method of forming low capacitance ESD robust diodes |
US6686244B2 (en) * | 2002-03-21 | 2004-02-03 | General Semiconductor, Inc. | Power semiconductor device having a voltage sustaining region that includes doped columns formed with a single ion implantation step |
JP2004047599A (en) | 2002-07-10 | 2004-02-12 | Renesas Technology Corp | Semiconductor device and its manufacture |
JP4265201B2 (en) * | 2002-10-25 | 2009-05-20 | 富士電機デバイステクノロジー株式会社 | Super junction semiconductor device |
DE10313712B4 (en) * | 2003-03-27 | 2008-04-03 | Infineon Technologies Ag | Lateral field-controllable semiconductor device for RF applications |
US7638841B2 (en) * | 2003-05-20 | 2009-12-29 | Fairchild Semiconductor Corporation | Power semiconductor devices and methods of manufacture |
JP4194890B2 (en) * | 2003-06-24 | 2008-12-10 | 株式会社豊田中央研究所 | Semiconductor device and manufacturing method thereof |
DE10334780B3 (en) * | 2003-07-30 | 2005-04-21 | Infineon Technologies Ag | Semiconductor device with a MOSFET structure and a Zenier device and method for producing the same |
JP4096838B2 (en) * | 2003-08-20 | 2008-06-04 | 富士電機デバイステクノロジー株式会社 | Semiconductor device and manufacturing method thereof |
DE10339488B3 (en) * | 2003-08-27 | 2005-04-14 | Infineon Technologies Ag | Lateral semiconductor component with at least one field electrode formed in drift zone extending laterally between doped terminal regions |
EP1536463A1 (en) * | 2003-11-28 | 2005-06-01 | STMicroelectronics S.r.l. | Method for manufacturing a power device with insulated trench-gate having controlled channel length and corresponding device |
JP4928947B2 (en) * | 2003-12-19 | 2012-05-09 | サード ディメンジョン (スリーディ) セミコンダクタ インコーポレイテッド | Manufacturing method of super junction device |
US7368777B2 (en) * | 2003-12-30 | 2008-05-06 | Fairchild Semiconductor Corporation | Accumulation device with charge balance structure and method of forming the same |
US7535056B2 (en) | 2004-03-11 | 2009-05-19 | Yokogawa Electric Corporation | Semiconductor device having a low concentration layer formed outside a drift layer |
US20050199918A1 (en) * | 2004-03-15 | 2005-09-15 | Daniel Calafut | Optimized trench power MOSFET with integrated schottky diode |
US7465986B2 (en) * | 2004-08-27 | 2008-12-16 | International Rectifier Corporation | Power semiconductor device including insulated source electrodes inside trenches |
US7355238B2 (en) * | 2004-12-06 | 2008-04-08 | Asahi Glass Company, Limited | Nonvolatile semiconductor memory device having nanoparticles for charge retention |
KR20120127677A (en) * | 2005-04-06 | 2012-11-22 | 페어차일드 세미컨덕터 코포레이션 | Trenched-gate field effect transistors and methods of forming the same |
US7473976B2 (en) * | 2006-02-16 | 2009-01-06 | Fairchild Semiconductor Corporation | Lateral power transistor with self-biasing electrodes |
US7535621B2 (en) * | 2006-12-27 | 2009-05-19 | Qualcomm Mems Technologies, Inc. | Aluminum fluoride films for microelectromechanical system applications |
CN101641763B (en) * | 2007-01-09 | 2012-07-04 | 威力半导体有限公司 | Semiconductor device and method of manufacturing the same |
-
2008
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6184555B1 (en) * | 1996-02-05 | 2001-02-06 | Siemens Aktiengesellschaft | Field effect-controlled semiconductor component |
US6201291B1 (en) * | 1997-12-10 | 2001-03-13 | U.S. Philips Corporation | Semiconductor device and method of manufacturing such a device |
US6724042B2 (en) * | 2000-02-09 | 2004-04-20 | Fuji Electric Co., Ltd. | Super-junction semiconductor device |
US6608350B2 (en) * | 2000-12-07 | 2003-08-19 | International Rectifier Corporation | High voltage vertical conduction superjunction semiconductor device |
US6812525B2 (en) * | 2002-06-25 | 2004-11-02 | International Rectifier Corporation | Trench fill process |
US20070158740A1 (en) * | 2005-11-28 | 2007-07-12 | Fuji Electric Holdings Co., Ltd. | Semiconductor device and manufacturing method of the semiconductor device |
Non-Patent Citations (1)
Title |
---|
See also references of EP2109892A4 * |
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