WO2008115213A3 - Wafer level phosphor coating method and devices fabricated utilizing method - Google Patents

Wafer level phosphor coating method and devices fabricated utilizing method Download PDF

Info

Publication number
WO2008115213A3
WO2008115213A3 PCT/US2007/024367 US2007024367W WO2008115213A3 WO 2008115213 A3 WO2008115213 A3 WO 2008115213A3 US 2007024367 W US2007024367 W US 2007024367W WO 2008115213 A3 WO2008115213 A3 WO 2008115213A3
Authority
WO
WIPO (PCT)
Prior art keywords
leds
pedestals
coating
fabricating
led
Prior art date
Application number
PCT/US2007/024367
Other languages
French (fr)
Other versions
WO2008115213A2 (en
WO2008115213A8 (en
Inventor
Ashay Chitnis
James Ibbetson
Arpan Chakraborty
Eric J Tarsa
Bernd Keller
James Seruto
Yankun Fu
Original Assignee
Cree Inc
Ashay Chitnis
James Ibbetson
Arpan Chakraborty
Eric J Tarsa
Bernd Keller
James Seruto
Yankun Fu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc, Ashay Chitnis, James Ibbetson, Arpan Chakraborty, Eric J Tarsa, Bernd Keller, James Seruto, Yankun Fu filed Critical Cree Inc
Priority to JP2009547219A priority Critical patent/JP2010517290A/en
Priority to CN2007800501978A priority patent/CN101627481B/en
Priority to KR1020097017405A priority patent/KR101398655B1/en
Priority to EP07874432.3A priority patent/EP2111649B1/en
Publication of WO2008115213A2 publication Critical patent/WO2008115213A2/en
Publication of WO2008115213A3 publication Critical patent/WO2008115213A3/en
Publication of WO2008115213A8 publication Critical patent/WO2008115213A8/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/387—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Abstract

Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.
PCT/US2007/024367 2007-01-22 2007-11-20 Wafer level phosphor coating method and devices fabricated utilizing method WO2008115213A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009547219A JP2010517290A (en) 2007-01-22 2007-11-20 Wafer level phosphor coating method and apparatus fabricated using the method
CN2007800501978A CN101627481B (en) 2007-01-22 2007-11-20 Wafer level phosphor coating method and devices fabricated ultilizing method
KR1020097017405A KR101398655B1 (en) 2007-01-22 2007-11-20 Wafer level phosphor coating method and devices fabricated utilizing method
EP07874432.3A EP2111649B1 (en) 2007-01-22 2007-11-20 Wafer level phosphor coating method and devices fabricated utilizing said method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/656,759 US9024349B2 (en) 2007-01-22 2007-01-22 Wafer level phosphor coating method and devices fabricated utilizing method
US11/656,759 2007-01-22

Publications (3)

Publication Number Publication Date
WO2008115213A2 WO2008115213A2 (en) 2008-09-25
WO2008115213A3 true WO2008115213A3 (en) 2008-12-18
WO2008115213A8 WO2008115213A8 (en) 2009-04-30

Family

ID=39640364

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/024367 WO2008115213A2 (en) 2007-01-22 2007-11-20 Wafer level phosphor coating method and devices fabricated utilizing method

Country Status (7)

Country Link
US (1) US9024349B2 (en)
EP (1) EP2111649B1 (en)
JP (1) JP2010517290A (en)
KR (1) KR101398655B1 (en)
CN (3) CN101627481B (en)
TW (1) TWI485877B (en)
WO (1) WO2008115213A2 (en)

Families Citing this family (416)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8999736B2 (en) 2003-07-04 2015-04-07 Epistar Corporation Optoelectronic system
US7915085B2 (en) * 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9412926B2 (en) * 2005-06-10 2016-08-09 Cree, Inc. High power solid-state lamp
US8441179B2 (en) 2006-01-20 2013-05-14 Cree, Inc. Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources
USD738832S1 (en) 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
US8969908B2 (en) 2006-04-04 2015-03-03 Cree, Inc. Uniform emission LED package
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US9335006B2 (en) * 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US8232564B2 (en) 2007-01-22 2012-07-31 Cree, Inc. Wafer level phosphor coating technique for warm light emitting diodes
US9196799B2 (en) * 2007-01-22 2015-11-24 Cree, Inc. LED chips having fluorescent substrates with microholes and methods for fabricating
US9159888B2 (en) * 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
JP2008300665A (en) * 2007-05-31 2008-12-11 Toyoda Gosei Co Ltd Light emitting device
US7843060B2 (en) * 2007-06-11 2010-11-30 Cree, Inc. Droop-free high output light emitting devices and methods of fabricating and operating same
US10505083B2 (en) * 2007-07-11 2019-12-10 Cree, Inc. Coating method utilizing phosphor containment structure and devices fabricated using same
US9401461B2 (en) 2007-07-11 2016-07-26 Cree, Inc. LED chip design for white conversion
US7701049B2 (en) * 2007-08-03 2010-04-20 Stats Chippac Ltd. Integrated circuit packaging system for fine pitch substrates
US8362494B2 (en) * 2007-08-08 2013-01-29 Agency For Science, Technology And Research Electro-optic device with novel insulating structure and a method for manufacturing the same
TWI396298B (en) * 2007-08-29 2013-05-11 Everlight Electronics Co Ltd Phosphor coating method for light emmitting semiconductor device and applications thereof
US9172012B2 (en) 2007-10-31 2015-10-27 Cree, Inc. Multi-chip light emitter packages and related methods
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US9666762B2 (en) 2007-10-31 2017-05-30 Cree, Inc. Multi-chip light emitter packages and related methods
US9082921B2 (en) 2007-10-31 2015-07-14 Cree, Inc. Multi-die LED package
US7915629B2 (en) 2008-12-08 2011-03-29 Cree, Inc. Composite high reflectivity layer
US9461201B2 (en) 2007-11-14 2016-10-04 Cree, Inc. Light emitting diode dielectric mirror
US8167674B2 (en) 2007-12-14 2012-05-01 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
DE102007061261A1 (en) * 2007-12-19 2009-07-02 Bayer Materialscience Ag Luminaire with LED DIEs and their manufacture
US10008637B2 (en) 2011-12-06 2018-06-26 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
US20090221106A1 (en) * 2008-03-01 2009-09-03 Goldeneye, Inc. Article and method for color and intensity balanced solid state light sources
US8637883B2 (en) 2008-03-19 2014-01-28 Cree, Inc. Low index spacer layer in LED devices
US8329510B2 (en) * 2008-03-25 2012-12-11 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer
US8310043B2 (en) * 2008-03-25 2012-11-13 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader with ESD protection layer
US20110163348A1 (en) * 2008-03-25 2011-07-07 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base heat spreader and inverted cavity in bump
US8314438B2 (en) * 2008-03-25 2012-11-20 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base heat spreader and cavity in bump
US8129742B2 (en) * 2008-03-25 2012-03-06 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and plated through-hole
US8288792B2 (en) * 2008-03-25 2012-10-16 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base/post heat spreader
US8203167B2 (en) * 2008-03-25 2012-06-19 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal
US8207553B2 (en) * 2008-03-25 2012-06-26 Bridge Semiconductor Corporation Semiconductor chip assembly with base heat spreader and cavity in base
US8212279B2 (en) * 2008-03-25 2012-07-03 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader, signal post and cavity
US8378372B2 (en) * 2008-03-25 2013-02-19 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and horizontal signal routing
US8148747B2 (en) * 2008-03-25 2012-04-03 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base/cap heat spreader
US8354688B2 (en) 2008-03-25 2013-01-15 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump
US20110278638A1 (en) 2008-03-25 2011-11-17 Lin Charles W C Semiconductor chip assembly with post/dielectric/post heat spreader
US8193556B2 (en) * 2008-03-25 2012-06-05 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and cavity in post
US8415703B2 (en) * 2008-03-25 2013-04-09 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange
US20110156090A1 (en) * 2008-03-25 2011-06-30 Lin Charles W C Semiconductor chip assembly with post/base/post heat spreader and asymmetric posts
US8232576B1 (en) 2008-03-25 2012-07-31 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and ceramic block in post
US8525214B2 (en) 2008-03-25 2013-09-03 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader with thermal via
US8531024B2 (en) * 2008-03-25 2013-09-10 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
US8269336B2 (en) * 2008-03-25 2012-09-18 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and signal post
US9018667B2 (en) * 2008-03-25 2015-04-28 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and dual adhesives
US8324723B2 (en) * 2008-03-25 2012-12-04 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump
US8067784B2 (en) * 2008-03-25 2011-11-29 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and substrate
US8110446B2 (en) * 2008-03-25 2012-02-07 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace
US20090284932A1 (en) * 2008-03-25 2009-11-19 Bridge Semiconductor Corporation Thermally Enhanced Package with Embedded Metal Slug and Patterned Circuitry
US20100181594A1 (en) * 2008-03-25 2010-07-22 Lin Charles W C Semiconductor chip assembly with post/base heat spreader and cavity over post
US20100052005A1 (en) * 2008-03-25 2010-03-04 Lin Charles W C Semiconductor chip assembly with post/base heat spreader and conductive trace
US8877524B2 (en) 2008-03-31 2014-11-04 Cree, Inc. Emission tuning methods and devices fabricated utilizing methods
TWI416755B (en) * 2008-05-30 2013-11-21 Epistar Corp Light source module, related light bar and related liquid crystal display
KR20110039313A (en) * 2008-07-07 2011-04-15 글로 에이비 A nanostructured led
US8525200B2 (en) * 2008-08-18 2013-09-03 Taiwan Semiconductor Manufacturing Company, Ltd. Light-emitting diode with non-metallic reflector
TW201015743A (en) * 2008-10-01 2010-04-16 Formosa Epitaxy Inc LED and manufacturing method thereof
US8858032B2 (en) * 2008-10-24 2014-10-14 Cree, Inc. Lighting device, heat transfer structure and heat transfer element
US8853712B2 (en) 2008-11-18 2014-10-07 Cree, Inc. High efficacy semiconductor light emitting devices employing remote phosphor configurations
US8004172B2 (en) 2008-11-18 2011-08-23 Cree, Inc. Semiconductor light emitting apparatus including elongated hollow wavelength conversion tubes and methods of assembling same
US9052416B2 (en) 2008-11-18 2015-06-09 Cree, Inc. Ultra-high efficacy semiconductor light emitting devices
US8748905B2 (en) 2008-11-18 2014-06-10 Cree, Inc. High efficacy semiconductor light emitting devices employing remote phosphor configurations
US8017963B2 (en) * 2008-12-08 2011-09-13 Cree, Inc. Light emitting diode with a dielectric mirror having a lateral configuration
JP4799606B2 (en) 2008-12-08 2011-10-26 株式会社東芝 Optical semiconductor device and method for manufacturing optical semiconductor device
JP4724222B2 (en) * 2008-12-12 2011-07-13 株式会社東芝 Method for manufacturing light emitting device
KR101533817B1 (en) * 2008-12-31 2015-07-09 서울바이오시스 주식회사 Light emitting device having plurality of non-polar light emitting cells and method of fabricating the same
US8247886B1 (en) 2009-03-09 2012-08-21 Soraa, Inc. Polarization direction of optical devices using selected spatial configurations
TWI470766B (en) * 2009-03-10 2015-01-21 Advanced Semiconductor Eng Chip structure, wafer structure and process of fabricating chip
US7994531B2 (en) * 2009-04-02 2011-08-09 Visera Technologies Company Limited White-light light emitting diode chips and fabrication methods thereof
US8476668B2 (en) * 2009-04-06 2013-07-02 Cree, Inc. High voltage low current surface emitting LED
US8096671B1 (en) 2009-04-06 2012-01-17 Nmera, Llc Light emitting diode illumination system
US9093293B2 (en) 2009-04-06 2015-07-28 Cree, Inc. High voltage low current surface emitting light emitting diode
US8529102B2 (en) * 2009-04-06 2013-09-10 Cree, Inc. Reflector system for lighting device
US8791499B1 (en) 2009-05-27 2014-07-29 Soraa, Inc. GaN containing optical devices and method with ESD stability
US9035328B2 (en) 2011-02-04 2015-05-19 Cree, Inc. Light-emitting diode component
US7989824B2 (en) * 2009-06-03 2011-08-02 Koninklijke Philips Electronics N.V. Method of forming a dielectric layer on a semiconductor light emitting device
TWI392127B (en) * 2009-06-26 2013-04-01 Yu Nung Shen Light emitting diode package and its packaging method
JP2011009572A (en) * 2009-06-26 2011-01-13 Citizen Electronics Co Ltd Flip-chip packaging type led and method for manufacturing flip-chip packaging type led
US8547009B2 (en) 2009-07-10 2013-10-01 Cree, Inc. Lighting structures including diffuser particles comprising phosphor host materials
TWI591845B (en) * 2009-07-21 2017-07-11 晶元光電股份有限公司 Optoelectronic system
US8324653B1 (en) 2009-08-06 2012-12-04 Bridge Semiconductor Corporation Semiconductor chip assembly with ceramic/metal substrate
DE102009036621B4 (en) 2009-08-07 2023-12-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelectronic semiconductor component
CN103199023A (en) * 2009-08-17 2013-07-10 晶元光电股份有限公司 System-level photoelectric structure and manufacturing method thereof
US9000466B1 (en) 2010-08-23 2015-04-07 Soraa, Inc. Methods and devices for light extraction from a group III-nitride volumetric LED using surface and sidewall roughening
DE102009039890A1 (en) * 2009-09-03 2011-03-10 Osram Opto Semiconductors Gmbh Optoelectronic component with a semiconductor body, an insulating layer and a planar conductive structure and method for its production
DE102009042205A1 (en) * 2009-09-18 2011-03-31 Osram Opto Semiconductors Gmbh Optoelectronic module
US8933644B2 (en) 2009-09-18 2015-01-13 Soraa, Inc. LED lamps with improved quality of light
US9583678B2 (en) 2009-09-18 2017-02-28 Soraa, Inc. High-performance LED fabrication
US9293644B2 (en) 2009-09-18 2016-03-22 Soraa, Inc. Power light emitting diode and method with uniform current density operation
US8963178B2 (en) 2009-11-13 2015-02-24 Seoul Viosys Co., Ltd. Light emitting diode chip having distributed bragg reflector and method of fabricating the same
JP5349260B2 (en) 2009-11-19 2013-11-20 株式会社東芝 Semiconductor light emitting device and manufacturing method thereof
JP4991834B2 (en) 2009-12-17 2012-08-01 シャープ株式会社 Vehicle headlamp
US8511851B2 (en) * 2009-12-21 2013-08-20 Cree, Inc. High CRI adjustable color temperature lighting devices
US8227274B2 (en) * 2010-01-26 2012-07-24 Lightizer Korea Co. Light emitting diode (LED) and method of manufacture
US8587187B2 (en) 2010-12-06 2013-11-19 Byoung GU Cho Light diffusion of visible edge lines in a multi-dimensional modular display
US9006754B2 (en) 2010-01-26 2015-04-14 Lightizer Korea Co. Multichip light emitting diode (LED) and method of manufacture
US10147850B1 (en) 2010-02-03 2018-12-04 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US8905588B2 (en) 2010-02-03 2014-12-09 Sorra, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US20110186874A1 (en) * 2010-02-03 2011-08-04 Soraa, Inc. White Light Apparatus and Method
JP5232815B2 (en) * 2010-02-10 2013-07-10 シャープ株式会社 Vehicle headlamp
US8716038B2 (en) 2010-03-02 2014-05-06 Micron Technology, Inc. Microelectronic workpiece processing systems and associated methods of color correction
US9500325B2 (en) * 2010-03-03 2016-11-22 Cree, Inc. LED lamp incorporating remote phosphor with heat dissipation features
US8562161B2 (en) * 2010-03-03 2013-10-22 Cree, Inc. LED based pedestal-type lighting structure
US20110227102A1 (en) * 2010-03-03 2011-09-22 Cree, Inc. High efficacy led lamp with remote phosphor and diffuser configuration
US9062830B2 (en) 2010-03-03 2015-06-23 Cree, Inc. High efficiency solid state lamp and bulb
US8882284B2 (en) 2010-03-03 2014-11-11 Cree, Inc. LED lamp or bulb with remote phosphor and diffuser configuration with enhanced scattering properties
US8632196B2 (en) 2010-03-03 2014-01-21 Cree, Inc. LED lamp incorporating remote phosphor and diffuser with heat dissipation features
US9275979B2 (en) 2010-03-03 2016-03-01 Cree, Inc. Enhanced color rendering index emitter through phosphor separation
US9310030B2 (en) 2010-03-03 2016-04-12 Cree, Inc. Non-uniform diffuser to scatter light into uniform emission pattern
US9316361B2 (en) 2010-03-03 2016-04-19 Cree, Inc. LED lamp with remote phosphor and diffuser configuration
US9057511B2 (en) 2010-03-03 2015-06-16 Cree, Inc. High efficiency solid state lamp and bulb
US10359151B2 (en) * 2010-03-03 2019-07-23 Ideal Industries Lighting Llc Solid state lamp with thermal spreading elements and light directing optics
US9024517B2 (en) 2010-03-03 2015-05-05 Cree, Inc. LED lamp with remote phosphor and diffuser configuration utilizing red emitters
US8931933B2 (en) 2010-03-03 2015-01-13 Cree, Inc. LED lamp with active cooling element
US9625105B2 (en) * 2010-03-03 2017-04-18 Cree, Inc. LED lamp with active cooling element
US8508127B2 (en) * 2010-03-09 2013-08-13 Cree, Inc. High CRI lighting device with added long-wavelength blue color
CN103915381B (en) * 2010-03-18 2017-12-19 亿光电子工业股份有限公司 The preparation method of LED wafer with phosphor powder layer
TWI492422B (en) 2010-03-18 2015-07-11 Everlight Electronics Co Ltd Fabrication method of light emitting diode chip having phosphor coating layer
CN102194744B (en) * 2010-03-18 2014-05-07 亿光电子工业股份有限公司 Method for manufacturing LED (light emitting diode) wafers with fluorescent powder layer
US8017417B1 (en) 2010-03-31 2011-09-13 Lightizer Korea Co. Light emitting diode having a wavelength shift layer and method of manufacture
US9105824B2 (en) 2010-04-09 2015-08-11 Cree, Inc. High reflective board or substrate for LEDs
TWI476959B (en) 2010-04-11 2015-03-11 Achrolux Inc Method for transferring a uniform phosphor layer on an article and light-emitting structure fabricated by the method
US8232117B2 (en) 2010-04-30 2012-07-31 Koninklijke Philips Electronics N.V. LED wafer with laminated phosphor layer
US8329482B2 (en) 2010-04-30 2012-12-11 Cree, Inc. White-emitting LED chips and method for making same
CN104482477A (en) * 2010-05-17 2015-04-01 夏普株式会社 Illuminant and light-emitting device
US8733996B2 (en) 2010-05-17 2014-05-27 Sharp Kabushiki Kaisha Light emitting device, illuminating device, and vehicle headlamp
WO2011145794A1 (en) * 2010-05-18 2011-11-24 서울반도체 주식회사 Light emitting diode chip having wavelength conversion layer and manufacturing method thereof, and package including same and manufacturing method thereof
KR101230619B1 (en) * 2010-05-18 2013-02-06 서울반도체 주식회사 Light emitting diode chip having wavelength converting layer, method of fabricating the same and package having the same
CN103003966B (en) * 2010-05-18 2016-08-10 首尔半导体株式会社 There is light emitting diode chip and the manufacture method thereof of wavelength conversion layer, and include its packaging part and manufacture method thereof
CN102263181B (en) * 2010-05-29 2014-04-30 比亚迪股份有限公司 Substrate, light-emitting diode (LED) epitaxial wafer with substrate, chip and luminous device
JP5390472B2 (en) 2010-06-03 2014-01-15 株式会社東芝 Semiconductor light emitting device and manufacturing method thereof
JP5414627B2 (en) * 2010-06-07 2014-02-12 株式会社東芝 Semiconductor light emitting device and manufacturing method thereof
JP5449039B2 (en) * 2010-06-07 2014-03-19 株式会社東芝 Semiconductor light emitting device and manufacturing method thereof
JP5759790B2 (en) * 2010-06-07 2015-08-05 株式会社東芝 Manufacturing method of semiconductor light emitting device
JP5426484B2 (en) * 2010-06-07 2014-02-26 株式会社東芝 Manufacturing method of semiconductor light emitting device
US9450143B2 (en) 2010-06-18 2016-09-20 Soraa, Inc. Gallium and nitrogen containing triangular or diamond-shaped configuration for optical devices
US20110309393A1 (en) * 2010-06-21 2011-12-22 Micron Technology, Inc. Packaged leds with phosphor films, and associated systems and methods
TW201201419A (en) * 2010-06-29 2012-01-01 Semileds Optoelectronics Co Wafer-type light emitting device having precisely coated wavelength-converting layer
TW201201409A (en) * 2010-06-29 2012-01-01 Semileds Optoelectronics Co Chip-type light emitting device having precisely coated wavelength-converting layer and packaged structure thereof
CN203260631U (en) * 2010-07-01 2013-10-30 西铁城控股株式会社 Led light source device
US10546846B2 (en) * 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
US9831393B2 (en) 2010-07-30 2017-11-28 Cree Hong Kong Limited Water resistant surface mount device package
US10451251B2 (en) 2010-08-02 2019-10-22 Ideal Industries Lighting, LLC Solid state lamp with light directing optics and diffuser
US8764224B2 (en) 2010-08-12 2014-07-01 Cree, Inc. Luminaire with distributed LED sources
CN102376848A (en) * 2010-08-27 2012-03-14 璨圆光电股份有限公司 Manufacturing method of light-emitting device
JP5486688B2 (en) * 2010-09-15 2014-05-07 ライタイザー コリア カンパニー リミテッド Light emitting diode and manufacturing method thereof
KR101028612B1 (en) * 2010-09-15 2011-04-11 (주)더리즈 Light-emitting device
DE102010046257A1 (en) * 2010-09-22 2012-03-22 Osram Opto Semiconductors Gmbh Method for manufacturing LED chip mounted on circuit board, involves providing carrier with adhesive surface, applying molding material on adhesive film, and cutting molding material between semiconductor chips
TWI446590B (en) 2010-09-30 2014-07-21 Everlight Electronics Co Ltd Light emitting diode package structure and manufacturing method thereof
US9627361B2 (en) 2010-10-07 2017-04-18 Cree, Inc. Multiple configuration light emitting devices and methods
US9816677B2 (en) 2010-10-29 2017-11-14 Sharp Kabushiki Kaisha Light emitting device, vehicle headlamp, illumination device, and laser element
KR101767100B1 (en) * 2010-11-10 2017-08-10 삼성전자주식회사 Light emitting device and manufacturing method of the same
US8896235B1 (en) 2010-11-17 2014-11-25 Soraa, Inc. High temperature LED system using an AC power source
US8564000B2 (en) 2010-11-22 2013-10-22 Cree, Inc. Light emitting devices for light emitting diodes (LEDs)
USD712850S1 (en) 2010-11-18 2014-09-09 Cree, Inc. Light emitter device
USD721339S1 (en) 2010-12-03 2015-01-20 Cree, Inc. Light emitter device
USD707192S1 (en) 2010-11-18 2014-06-17 Cree, Inc. Light emitting device
US8624271B2 (en) 2010-11-22 2014-01-07 Cree, Inc. Light emitting devices
US9300062B2 (en) 2010-11-22 2016-03-29 Cree, Inc. Attachment devices and methods for light emitting devices
US9000470B2 (en) 2010-11-22 2015-04-07 Cree, Inc. Light emitter devices
US8575639B2 (en) 2011-02-16 2013-11-05 Cree, Inc. Light emitting devices for light emitting diodes (LEDs)
US9490235B2 (en) 2010-11-22 2016-11-08 Cree, Inc. Light emitting devices, systems, and methods
US10267506B2 (en) 2010-11-22 2019-04-23 Cree, Inc. Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same
JP5733961B2 (en) * 2010-11-26 2015-06-10 株式会社ディスコ Processing method of optical device wafer
US20120138874A1 (en) * 2010-12-02 2012-06-07 Intematix Corporation Solid-state light emitting devices and signage with photoluminescence wavelength conversion and photoluminescent compositions therefor
KR20120061376A (en) * 2010-12-03 2012-06-13 삼성엘이디 주식회사 Method of applying phosphor on semiconductor light emitting device
USD706231S1 (en) 2010-12-03 2014-06-03 Cree, Inc. Light emitting device
US9822951B2 (en) 2010-12-06 2017-11-21 Cree, Inc. LED retrofit lens for fluorescent tube
US10309627B2 (en) 2012-11-08 2019-06-04 Cree, Inc. Light fixture retrofit kit with integrated light bar
US8556469B2 (en) 2010-12-06 2013-10-15 Cree, Inc. High efficiency total internal reflection optic for solid state lighting luminaires
KR101883839B1 (en) * 2010-12-07 2018-08-30 엘지이노텍 주식회사 Light emitting device module and bcklight unit including the same
KR101769075B1 (en) * 2010-12-24 2017-08-18 서울바이오시스 주식회사 Light emitting diode chip and method of fabricating the same
KR101748334B1 (en) 2011-01-17 2017-06-16 삼성전자 주식회사 Apparatus and method of fabricating white light emitting device
US8786053B2 (en) 2011-01-24 2014-07-22 Soraa, Inc. Gallium-nitride-on-handle substrate materials and devices and method of manufacture
US9166126B2 (en) * 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
US9068701B2 (en) 2012-01-26 2015-06-30 Cree, Inc. Lamp structure with remote LED light source
WO2012109225A1 (en) 2011-02-07 2012-08-16 Cree, Inc. Components and methods for light emitting diode (led) lighting
US9234655B2 (en) 2011-02-07 2016-01-12 Cree, Inc. Lamp with remote LED light source and heat dissipating elements
US9583681B2 (en) 2011-02-07 2017-02-28 Cree, Inc. Light emitter device packages, modules and methods
KR20120092000A (en) * 2011-02-09 2012-08-20 서울반도체 주식회사 Light emitting device having wavelength converting layer
US8809880B2 (en) 2011-02-16 2014-08-19 Cree, Inc. Light emitting diode (LED) chips and devices for providing failure mitigation in LED arrays
US8455908B2 (en) 2011-02-16 2013-06-04 Cree, Inc. Light emitting devices
USD702653S1 (en) 2011-10-26 2014-04-15 Cree, Inc. Light emitting device component
US8729589B2 (en) 2011-02-16 2014-05-20 Cree, Inc. High voltage array light emitting diode (LED) devices and fixtures
US10098197B2 (en) 2011-06-03 2018-10-09 Cree, Inc. Lighting devices with individually compensating multi-color clusters
US11251164B2 (en) 2011-02-16 2022-02-15 Creeled, Inc. Multi-layer conversion material for down conversion in solid state lighting
US9041046B2 (en) 2011-03-15 2015-05-26 Avago Technologies General Ip (Singapore) Pte. Ltd. Method and apparatus for a light source
US10147853B2 (en) 2011-03-18 2018-12-04 Cree, Inc. Encapsulant with index matched thixotropic agent
US8680556B2 (en) 2011-03-24 2014-03-25 Cree, Inc. Composite high reflectivity layer
US8957438B2 (en) 2011-04-07 2015-02-17 Cree, Inc. Methods of fabricating light emitting devices including multiple sequenced luminophoric layers
JP5670249B2 (en) * 2011-04-14 2015-02-18 日東電工株式会社 Light emitting element transfer sheet manufacturing method, light emitting device manufacturing method, light emitting element transfer sheet, and light emitting device
US9263636B2 (en) 2011-05-04 2016-02-16 Cree, Inc. Light-emitting diode (LED) for achieving an asymmetric light output
US8921875B2 (en) 2011-05-10 2014-12-30 Cree, Inc. Recipient luminophoric mediums having narrow spectrum luminescent materials and related semiconductor light emitting devices and methods
CN102208499A (en) * 2011-05-12 2011-10-05 深圳市瑞丰光电子股份有限公司 Manufacturing process of white-light LED chip and product thereof
CN102231378B (en) * 2011-05-25 2013-05-29 映瑞光电科技(上海)有限公司 Light-emitting diode (LED) packaging structure and preparation method thereof
US9269878B2 (en) 2011-05-27 2016-02-23 Lg Innotek Co., Ltd. Light emitting device and light emitting apparatus
US8906263B2 (en) 2011-06-03 2014-12-09 Cree, Inc. Red nitride phosphors
US8729790B2 (en) 2011-06-03 2014-05-20 Cree, Inc. Coated phosphors and light emitting devices including the same
US8814621B2 (en) 2011-06-03 2014-08-26 Cree, Inc. Methods of determining and making red nitride compositions
US8747697B2 (en) 2011-06-07 2014-06-10 Cree, Inc. Gallium-substituted yttrium aluminum garnet phosphor and light emitting devices including the same
CN102299234A (en) * 2011-06-13 2011-12-28 协鑫光电科技（张家港）有限公司 Light emitting diode (LED) and manufacturing method thereof
US8686429B2 (en) 2011-06-24 2014-04-01 Cree, Inc. LED structure with enhanced mirror reflectivity
US9728676B2 (en) 2011-06-24 2017-08-08 Cree, Inc. High voltage monolithic LED chip
US10243121B2 (en) 2011-06-24 2019-03-26 Cree, Inc. High voltage monolithic LED chip with improved reliability
USD700584S1 (en) 2011-07-06 2014-03-04 Cree, Inc. LED component
US8684569B2 (en) 2011-07-06 2014-04-01 Cree, Inc. Lens and trim attachment structure for solid state downlights
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
TW201312807A (en) 2011-07-21 2013-03-16 Cree Inc Light emitter device packages, components, and methods for improved chemical resistance and related methods
US10686107B2 (en) 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
US10211380B2 (en) 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
US8952395B2 (en) 2011-07-26 2015-02-10 Micron Technology, Inc. Wafer-level solid state transducer packaging transducers including separators and associated systems and methods
US20140198528A1 (en) * 2011-08-17 2014-07-17 Samsung Electronics Co., Ltd. Wavelength conversion chip for a light emitting diode, and method for manufacturing same
US8686431B2 (en) 2011-08-22 2014-04-01 Soraa, Inc. Gallium and nitrogen containing trilateral configuration for optical devices
US8497146B2 (en) 2011-08-25 2013-07-30 Micron Technology, Inc. Vertical solid-state transducers having backside terminals and associated systems and methods
US8558252B2 (en) 2011-08-26 2013-10-15 Cree, Inc. White LEDs with emission wavelength correction
US9897276B2 (en) * 2011-08-26 2018-02-20 Cree, Inc. Reduced phosphor lighting devices
US9488324B2 (en) 2011-09-02 2016-11-08 Soraa, Inc. Accessories for LED lamp systems
WO2013036481A2 (en) 2011-09-06 2013-03-14 Cree, Inc. Light emitter packages and devices having improved wire bonding and related methods
WO2013036561A2 (en) * 2011-09-07 2013-03-14 Cooledge Lighting, Inc. Broad-area lighting systems
USD705181S1 (en) 2011-10-26 2014-05-20 Cree, Inc. Light emitting device component
KR20130052825A (en) * 2011-11-14 2013-05-23 삼성전자주식회사 Light emitting device
US10043960B2 (en) 2011-11-15 2018-08-07 Cree, Inc. Light emitting diode (LED) packages and related methods
US8912025B2 (en) 2011-11-23 2014-12-16 Soraa, Inc. Method for manufacture of bright GaN LEDs using a selective removal process
US9496466B2 (en) 2011-12-06 2016-11-15 Cree, Inc. Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
KR101719645B1 (en) * 2011-12-21 2017-03-24 서울반도체 주식회사 Light emitting diode chip having wavelength converting layer, method of fabricating the same and package having the same
EP2607449B1 (en) * 2011-12-22 2014-04-02 Shin-Etsu Chemical Co., Ltd. Preparation of yttrium-cerium-aluminum garnet phosphor
US9335531B2 (en) 2011-12-30 2016-05-10 Cree, Inc. LED lighting using spectral notching
US9318669B2 (en) 2012-01-30 2016-04-19 Cree, Inc. Methods of determining and making red nitride compositions
US9786825B2 (en) 2012-02-07 2017-10-10 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
US8895998B2 (en) 2012-03-30 2014-11-25 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components and methods
US9806246B2 (en) 2012-02-07 2017-10-31 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
US9240530B2 (en) 2012-02-13 2016-01-19 Cree, Inc. Light emitter devices having improved chemical and physical resistance and related methods
US9343441B2 (en) 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
US8803185B2 (en) * 2012-02-21 2014-08-12 Peiching Ling Light emitting diode package and method of fabricating the same
EP2823515A4 (en) 2012-03-06 2015-08-19 Soraa Inc Light emitting diodes with low refractive index material layers to reduce light guiding effects
CN102593332A (en) * 2012-03-09 2012-07-18 晶科电子（广州）有限公司 LED (light-emitting diode) luminescent device and manufacturing method thereof
CN102544329A (en) * 2012-03-14 2012-07-04 连云港陆亿建材有限公司 Wafer level light emitting diode encapsulation structure and manufacturing process thereof
CN102593327A (en) * 2012-03-19 2012-07-18 连云港陆亿建材有限公司 Inverted packaging technology for wafer-level LED
US9488359B2 (en) 2012-03-26 2016-11-08 Cree, Inc. Passive phase change radiators for LED lamps and fixtures
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US9538590B2 (en) 2012-03-30 2017-01-03 Cree, Inc. Solid state lighting apparatuses, systems, and related methods
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US9188290B2 (en) 2012-04-10 2015-11-17 Cree, Inc. Indirect linear fixture
US8985794B1 (en) 2012-04-17 2015-03-24 Soraa, Inc. Providing remote blue phosphors in an LED lamp
US8878204B2 (en) 2012-05-04 2014-11-04 Cree, Inc. Submount based light emitter components and methods
US9166116B2 (en) 2012-05-29 2015-10-20 Formosa Epitaxy Incorporation Light emitting device
CN203277485U (en) 2012-05-29 2013-11-06 璨圆光电股份有限公司 Light-emitting device, light-emitting diode chip for forming multi-directional light emission and sapphire substrate thereof
USD749051S1 (en) 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
US9590155B2 (en) 2012-06-06 2017-03-07 Cree, Inc. Light emitting devices and substrates with improved plating
US9147816B2 (en) 2012-08-24 2015-09-29 Luminus Devices, Inc. Wavelength converting material deposition methods and associated articles
JP6003402B2 (en) * 2012-08-28 2016-10-05 住友大阪セメント株式会社 Optical semiconductor light emitting device, lighting fixture, and display device
KR101350159B1 (en) * 2012-08-31 2014-02-13 한국광기술원 Method for manufacturing white light emitting diode
DE102012109460B4 (en) 2012-10-04 2024-03-07 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Method for producing a light-emitting diode display and light-emitting diode display
US9978904B2 (en) 2012-10-16 2018-05-22 Soraa, Inc. Indium gallium nitride light emitting devices
KR101977278B1 (en) * 2012-10-29 2019-09-10 엘지이노텍 주식회사 A light emitting device
US9441818B2 (en) 2012-11-08 2016-09-13 Cree, Inc. Uplight with suspended fixture
US10788176B2 (en) 2013-02-08 2020-09-29 Ideal Industries Lighting Llc Modular LED lighting system
US9482396B2 (en) 2012-11-08 2016-11-01 Cree, Inc. Integrated linear light engine
US9494304B2 (en) 2012-11-08 2016-11-15 Cree, Inc. Recessed light fixture retrofit kit
US9437788B2 (en) 2012-12-19 2016-09-06 Cree, Inc. Light emitting diode (LED) component comprising a phosphor with improved excitation properties
US9761763B2 (en) 2012-12-21 2017-09-12 Soraa, Inc. Dense-luminescent-materials-coated violet LEDs
US8802471B1 (en) 2012-12-21 2014-08-12 Soraa, Inc. Contacts for an n-type gallium and nitrogen substrate for optical devices
KR20140092127A (en) 2013-01-15 2014-07-23 삼성전자주식회사 Semiconductor light emitting device and the method of the same
US9316382B2 (en) 2013-01-31 2016-04-19 Cree, Inc. Connector devices, systems, and related methods for connecting light emitting diode (LED) modules
US9030103B2 (en) 2013-02-08 2015-05-12 Cree, Inc. Solid state light emitting devices including adjustable scotopic / photopic ratio
US9039746B2 (en) 2013-02-08 2015-05-26 Cree, Inc. Solid state light emitting devices including adjustable melatonin suppression effects
US9345091B2 (en) 2013-02-08 2016-05-17 Cree, Inc. Light emitting device (LED) light fixture control systems and related methods
US9565782B2 (en) 2013-02-15 2017-02-07 Ecosense Lighting Inc. Field replaceable power supply cartridge
US8916896B2 (en) 2013-02-22 2014-12-23 Cree, Inc. Light emitter components and methods having improved performance
US10295124B2 (en) 2013-02-27 2019-05-21 Cree, Inc. Light emitter packages and methods
US8876312B2 (en) * 2013-03-05 2014-11-04 Avago Technologies General Ip (Singapore) Pte. Ltd. Lighting device and apparatus with spectral converter within a casing
US8928219B2 (en) 2013-03-05 2015-01-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Lighting device with spectral converter
US9874333B2 (en) 2013-03-14 2018-01-23 Cree, Inc. Surface ambient wrap light fixture
USD738026S1 (en) 2013-03-14 2015-09-01 Cree, Inc. Linear wrap light fixture
US10584860B2 (en) 2013-03-14 2020-03-10 Ideal Industries, Llc Linear light fixture with interchangeable light engine unit
US9435492B2 (en) 2013-03-15 2016-09-06 Cree, Inc. LED luminaire with improved thermal management and novel LED interconnecting architecture
USD733952S1 (en) 2013-03-15 2015-07-07 Cree, Inc. Indirect linear fixture
US9215792B2 (en) 2013-03-15 2015-12-15 Cree, Inc. Connector devices, systems, and related methods for light emitter components
US9897267B2 (en) 2013-03-15 2018-02-20 Cree, Inc. Light emitter components, systems, and related methods
DE102013103226A1 (en) * 2013-03-28 2014-10-02 Osram Opto Semiconductors Gmbh Semiconductor device and method for manufacturing a semiconductor device
US9219202B2 (en) 2013-04-19 2015-12-22 Cree, Inc. Semiconductor light emitting devices including red phosphors that exhibit good color rendering properties and related red phosphors
USD738542S1 (en) 2013-04-19 2015-09-08 Cree, Inc. Light emitting unit
JP6273945B2 (en) * 2013-04-26 2018-02-07 日亜化学工業株式会社 Light emitting device
USD740453S1 (en) 2013-06-27 2015-10-06 Cree, Inc. Light emitter unit
USD739565S1 (en) 2013-06-27 2015-09-22 Cree, Inc. Light emitter unit
US8994033B2 (en) 2013-07-09 2015-03-31 Soraa, Inc. Contacts for an n-type gallium and nitrogen substrate for optical devices
CN103367606B (en) * 2013-07-09 2016-06-01 北京半导体照明科技促进中心 Manufacture the method for light-emitting diode chip for backlight unit
JP5837006B2 (en) * 2013-07-16 2015-12-24 株式会社東芝 Manufacturing method of optical semiconductor device
US9589852B2 (en) * 2013-07-22 2017-03-07 Cree, Inc. Electrostatic phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating
CN105580144B (en) * 2013-07-24 2019-08-02 晶元光电股份有限公司 Luminous die and correlation technique comprising wavelength conversion material
US9461024B2 (en) 2013-08-01 2016-10-04 Cree, Inc. Light emitter devices and methods for light emitting diode (LED) chips
KR102075749B1 (en) * 2013-08-08 2020-03-02 엘지이노텍 주식회사 Light emitting device package
USD758976S1 (en) 2013-08-08 2016-06-14 Cree, Inc. LED package
US10074781B2 (en) 2013-08-29 2018-09-11 Cree, Inc. Semiconductor light emitting devices including multiple red phosphors that exhibit good color rendering properties with increased brightness
TWI570350B (en) * 2013-08-29 2017-02-11 晶元光電股份有限公司 Illumination device
US9206958B2 (en) 2013-09-16 2015-12-08 Osram Sylvania Inc. Thin film wavelength converters and methods for making the same
US9240528B2 (en) 2013-10-03 2016-01-19 Cree, Inc. Solid state lighting apparatus with high scotopic/photopic (S/P) ratio
US10900653B2 (en) 2013-11-01 2021-01-26 Cree Hong Kong Limited LED mini-linear light engine
US9419189B1 (en) 2013-11-04 2016-08-16 Soraa, Inc. Small LED source with high brightness and high efficiency
US10612747B2 (en) 2013-12-16 2020-04-07 Ideal Industries Lighting Llc Linear shelf light fixture with gap filler elements
USD750308S1 (en) 2013-12-16 2016-02-23 Cree, Inc. Linear shelf light fixture
US10100988B2 (en) 2013-12-16 2018-10-16 Cree, Inc. Linear shelf light fixture with reflectors
CN104752571A (en) * 2013-12-31 2015-07-01 晶能光电（江西）有限公司 Cutting method of wafer grade white-light LED chip
CN105874618A (en) * 2014-01-08 2016-08-17 皇家飞利浦有限公司 Wavelength converted semiconductor light emitting device
US9360188B2 (en) 2014-02-20 2016-06-07 Cree, Inc. Remote phosphor element filled with transparent material and method for forming multisection optical elements
CN103805196B (en) * 2014-02-27 2016-09-28 昆山开威电子有限公司 A kind of composite construction based on Ce:YAG wafer and manufacture method
US10234119B2 (en) 2014-03-24 2019-03-19 Cree, Inc. Multiple voltage light emitter packages, systems, and related methods
USD757324S1 (en) 2014-04-14 2016-05-24 Cree, Inc. Linear shelf light fixture with reflectors
US9960322B2 (en) 2014-04-23 2018-05-01 Cree, Inc. Solid state lighting devices incorporating notch filtering materials
US9241384B2 (en) 2014-04-23 2016-01-19 Cree, Inc. Solid state lighting devices with adjustable color point
US9685101B2 (en) 2014-04-23 2017-06-20 Cree, Inc. Solid state light-emitting devices with improved contrast
US9593812B2 (en) 2014-04-23 2017-03-14 Cree, Inc. High CRI solid state lighting devices with enhanced vividness
US9215761B2 (en) 2014-05-15 2015-12-15 Cree, Inc. Solid state lighting devices with color point non-coincident with blackbody locus
US9691949B2 (en) 2014-05-30 2017-06-27 Cree, Inc. Submount based light emitter components and methods
US9534741B2 (en) 2014-07-23 2017-01-03 Cree, Inc. Lighting devices with illumination regions having different gamut properties
KR102209036B1 (en) * 2014-08-26 2021-01-28 엘지이노텍 주식회사 Light emitting device package
JP6430630B2 (en) * 2014-09-02 2018-11-28 フィリップス ライティング ホールディング ビー ヴィ Method for applying illumination devices to surfaces and illumination surfaces
USD790486S1 (en) 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
KR102224848B1 (en) * 2014-10-06 2021-03-08 삼성전자주식회사 Method for fabricating light emitting device package
US10477636B1 (en) 2014-10-28 2019-11-12 Ecosense Lighting Inc. Lighting systems having multiple light sources
US9219201B1 (en) 2014-10-31 2015-12-22 Cree, Inc. Blue light emitting devices that include phosphor-converted blue light emitting diodes
US10453825B2 (en) 2014-11-11 2019-10-22 Cree, Inc. Light emitting diode (LED) components and methods
US9826581B2 (en) 2014-12-05 2017-11-21 Cree, Inc. Voltage configurable solid state lighting apparatuses, systems, and related methods
US10431568B2 (en) 2014-12-18 2019-10-01 Cree, Inc. Light emitting diodes, components and related methods
KR102309670B1 (en) * 2014-12-24 2021-10-07 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Light emitting device, light emitting package and lighting system
KR102345751B1 (en) 2015-01-05 2022-01-03 삼성전자주식회사 Semiconductor light emitting device package and method for manufacturing the same
US10658546B2 (en) 2015-01-21 2020-05-19 Cree, Inc. High efficiency LEDs and methods of manufacturing
US9869450B2 (en) 2015-02-09 2018-01-16 Ecosense Lighting Inc. Lighting systems having a truncated parabolic- or hyperbolic-conical light reflector, or a total internal reflection lens; and having another light reflector
US11306897B2 (en) 2015-02-09 2022-04-19 Ecosense Lighting Inc. Lighting systems generating partially-collimated light emissions
USD777122S1 (en) 2015-02-27 2017-01-24 Cree, Inc. LED package
US9651216B2 (en) 2015-03-03 2017-05-16 Ecosense Lighting Inc. Lighting systems including asymmetric lens modules for selectable light distribution
US9746159B1 (en) 2015-03-03 2017-08-29 Ecosense Lighting Inc. Lighting system having a sealing system
US9568665B2 (en) 2015-03-03 2017-02-14 Ecosense Lighting Inc. Lighting systems including lens modules for selectable light distribution
US9651227B2 (en) 2015-03-03 2017-05-16 Ecosense Lighting Inc. Low-profile lighting system having pivotable lighting enclosure
CN113130725A (en) 2015-03-31 2021-07-16 科锐Led公司 Light emitting diode with encapsulation and method
WO2016176625A1 (en) 2015-04-30 2016-11-03 Cree, Inc. Solid state lighting components
USD783547S1 (en) 2015-06-04 2017-04-11 Cree, Inc. LED package
DE102015109413A1 (en) * 2015-06-12 2016-12-15 Osram Opto Semiconductors Gmbh Process for the production of optoelectronic conversion semiconductor chips and combination of conversion semiconductor chips
US9780266B2 (en) 2015-06-30 2017-10-03 Cree, Inc. Stabilized quantum dot structure and method of making a stabilized quantum dot structure
USD785218S1 (en) 2015-07-06 2017-04-25 Ecosense Lighting Inc. LED luminaire having a mounting system
US10074635B2 (en) 2015-07-17 2018-09-11 Cree, Inc. Solid state light emitter devices and methods
USD782093S1 (en) 2015-07-20 2017-03-21 Ecosense Lighting Inc. LED luminaire having a mounting system
USD782094S1 (en) 2015-07-20 2017-03-21 Ecosense Lighting Inc. LED luminaire having a mounting system
US9651232B1 (en) 2015-08-03 2017-05-16 Ecosense Lighting Inc. Lighting system having a mounting device
CN105185774A (en) * 2015-09-15 2015-12-23 华南师范大学 High-response-rate communication light-emitting device
CN105679890A (en) * 2016-02-29 2016-06-15 中山大学 Preparation method for semiconductor thin film type device
US10193031B2 (en) * 2016-03-11 2019-01-29 Rohinni, LLC Method for applying phosphor to light emitting diodes and apparatus thereof
KR101874876B1 (en) * 2016-04-27 2018-08-09 루미마이크로 주식회사 Lighting device
EP3467584B1 (en) * 2016-05-24 2021-12-22 Sony Group Corporation Light source device and projection display device
WO2018022456A1 (en) 2016-07-26 2018-02-01 Cree, Inc. Light emitting diodes, components and related methods
WO2018052902A1 (en) 2016-09-13 2018-03-22 Cree, Inc. Light emitting diodes, components and related methods
FR3055948B1 (en) * 2016-09-15 2018-09-07 Valeo Vision METHOD FOR MOUNTING A MATRIX ELECTROLUMINESCENT COMPONENT ON A SUPPORT
USD823492S1 (en) 2016-10-04 2018-07-17 Cree, Inc. Light emitting device
US10804251B2 (en) 2016-11-22 2020-10-13 Cree, Inc. Light emitting diode (LED) devices, components and methods
US10847553B2 (en) * 2017-01-13 2020-11-24 Massachusetts Institute Of Technology Method of forming a multilayer structure for a pixelated display and a multilayer structure for a pixelated display
TWI646651B (en) 2017-01-26 2019-01-01 宏碁股份有限公司 Light-emitting diode display and manufacturing method thereof
TWI663724B (en) * 2017-01-26 2019-06-21 宏碁股份有限公司 Light emitting diode display and fabricating method thereof
CN108428713A (en) * 2017-02-13 2018-08-21 宏碁股份有限公司 Light emitting diode indicator and its manufacturing method
US10439114B2 (en) 2017-03-08 2019-10-08 Cree, Inc. Substrates for light emitting diodes and related methods
WO2018183341A1 (en) 2017-03-27 2018-10-04 Firouzeh Sabri Light weight flexible temperature sensor kit
JP6297741B1 (en) 2017-03-31 2018-03-20 旭化成エレクトロニクス株式会社 Optical device and manufacturing method thereof
US10410997B2 (en) 2017-05-11 2019-09-10 Cree, Inc. Tunable integrated optics LED components and methods
US10672957B2 (en) 2017-07-19 2020-06-02 Cree, Inc. LED apparatuses and methods for high lumen output density
US11107857B2 (en) 2017-08-18 2021-08-31 Creeled, Inc. Light emitting diodes, components and related methods
US11101248B2 (en) 2017-08-18 2021-08-24 Creeled, Inc. Light emitting diodes, components and related methods
EP3545561B1 (en) 2017-08-25 2022-10-26 Cree Huizhou Solid State Lighting Company Ltd. Multiple led light source integrated package
US10361349B2 (en) 2017-09-01 2019-07-23 Cree, Inc. Light emitting diodes, components and related methods
US10546843B2 (en) 2017-11-03 2020-01-28 Ideal Industries Lighting Llc White light emitting devices having high luminous efficiency and improved color rendering that include pass-through violet emissions
US10541353B2 (en) 2017-11-10 2020-01-21 Cree, Inc. Light emitting devices including narrowband converters for outdoor lighting applications
US10347799B2 (en) 2017-11-10 2019-07-09 Cree, Inc. Stabilized quantum dot composite and method of making a stabilized quantum dot composite
US10741730B2 (en) 2017-11-10 2020-08-11 Cree, Inc. Stabilized luminescent nanoparticles comprising a perovskite semiconductor and method of fabrication
CN107731864B (en) * 2017-11-20 2020-06-12 开发晶照明（厦门）有限公司 Micro light emitting diode display and method of manufacture
US10734560B2 (en) 2017-11-29 2020-08-04 Cree, Inc. Configurable circuit layout for LEDs
US20190189682A1 (en) * 2017-12-20 2019-06-20 Lumileds Llc Monolithic segmented led array architecture with transparent common n-contact
US10957736B2 (en) 2018-03-12 2021-03-23 Cree, Inc. Light emitting diode (LED) components and methods
US10573543B2 (en) 2018-04-30 2020-02-25 Cree, Inc. Apparatus and methods for mass transfer of electronic die
CN208385406U (en) * 2018-05-25 2019-01-15 深圳市瑞丰光电子股份有限公司 A kind of LED module
US11121298B2 (en) 2018-05-25 2021-09-14 Creeled, Inc. Light-emitting diode packages with individually controllable light-emitting diode chips
US10453827B1 (en) 2018-05-30 2019-10-22 Cree, Inc. LED apparatuses and methods
US11101410B2 (en) 2018-05-30 2021-08-24 Creeled, Inc. LED systems, apparatuses, and methods
US10608148B2 (en) 2018-05-31 2020-03-31 Cree, Inc. Stabilized fluoride phosphor for light emitting diode (LED) applications
CN112236875A (en) 2018-06-04 2021-01-15 科锐公司 LED apparatus and method
US10964866B2 (en) 2018-08-21 2021-03-30 Cree, Inc. LED device, system, and method with adaptive patterns
DE102018120584A1 (en) * 2018-08-23 2020-02-27 Osram Opto Semiconductors Gmbh OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT
US11335833B2 (en) 2018-08-31 2022-05-17 Creeled, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
US11233183B2 (en) 2018-08-31 2022-01-25 Creeled, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
KR20200106695A (en) * 2019-03-05 2020-09-15 주식회사 루멘스 Led array package and manufacturing method thereof
JP7004948B2 (en) 2019-04-27 2022-01-21 日亜化学工業株式会社 Manufacturing method of light emitting module
US11101411B2 (en) 2019-06-26 2021-08-24 Creeled, Inc. Solid-state light emitting devices including light emitting diodes in package structures
CN110484129B (en) * 2019-07-02 2022-01-25 昆山联滔电子有限公司 Product with protective coating and preparation method thereof
US11777059B2 (en) * 2019-11-20 2023-10-03 Lumileds Llc Pixelated light-emitting diode for self-aligned photoresist patterning
US11569415B2 (en) 2020-03-11 2023-01-31 Lumileds Llc Light emitting diode devices with defined hard mask opening
US11735695B2 (en) 2020-03-11 2023-08-22 Lumileds Llc Light emitting diode devices with current spreading layer
US11848402B2 (en) 2020-03-11 2023-12-19 Lumileds Llc Light emitting diode devices with multilayer composite film including current spreading layer
US11942507B2 (en) 2020-03-11 2024-03-26 Lumileds Llc Light emitting diode devices
TWI719866B (en) * 2020-03-25 2021-02-21 矽品精密工業股份有限公司 Electronic package, supporting structure and manufacturing method thereof
JP7119283B2 (en) 2020-03-30 2022-08-17 日亜化学工業株式会社 Method for manufacturing light emitting device
US11626538B2 (en) 2020-10-29 2023-04-11 Lumileds Llc Light emitting diode device with tunable emission
US11901491B2 (en) 2020-10-29 2024-02-13 Lumileds Llc Light emitting diode devices
US11955583B2 (en) 2020-12-01 2024-04-09 Lumileds Llc Flip chip micro light emitting diodes
US11705534B2 (en) 2020-12-01 2023-07-18 Lumileds Llc Methods of making flip chip micro light emitting diodes
US11600656B2 (en) 2020-12-14 2023-03-07 Lumileds Llc Light emitting diode device
CN112635630B (en) * 2020-12-31 2022-05-03 深圳第三代半导体研究院 Light emitting diode and manufacturing method thereof
WO2023146765A1 (en) * 2022-01-28 2023-08-03 Lumileds Llc Phosphor-converted light emitting diodes (leds) color tuning
WO2023192370A1 (en) * 2022-03-30 2023-10-05 Lumileds Llc Semiconductor structure and methods of manufacturing the same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2704690A1 (en) * 1993-04-27 1994-11-04 Thomson Csf Method for encapsulating semiconductor wafers, device obtained by this process and application to the interconnection of wafers in three dimensions.
US6153448A (en) * 1997-05-14 2000-11-28 Kabushiki Kaisha Toshiba Semiconductor device manufacturing method
WO2001024283A1 (en) * 1999-09-27 2001-04-05 Lumileds Lighting, U.S., Llc Light emitting diode comprising a thin phosphor-conversion film
US20040012958A1 (en) * 2001-04-23 2004-01-22 Takuma Hashimoto Light emitting device comprising led chip
EP1385215A2 (en) * 2002-07-08 2004-01-28 Nichia Corporation Nitride semiconductor device comprising bonded substrate and fabrication method of the same
US20050265404A1 (en) * 2004-05-28 2005-12-01 Ian Ashdown Luminance enhancement apparatus and method
EP1724848A2 (en) * 2005-05-17 2006-11-22 LG Electronics Inc. Light emitting device package and method for manufacturing the same

Family Cites Families (275)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US34861A (en) * 1862-04-01 Improved washing-machine
US3780357A (en) 1973-02-16 1973-12-18 Hewlett Packard Co Electroluminescent semiconductor display apparatus and method of fabricating the same
JPS5939124A (en) 1982-08-27 1984-03-03 Toshiba Corp Cmos logical circuit
US4576796A (en) 1984-01-18 1986-03-18 Pelam, Inc. Centrifugal tissue processor
US4733335A (en) 1984-12-28 1988-03-22 Koito Manufacturing Co., Ltd. Vehicular lamp
US4866005A (en) 1987-10-26 1989-09-12 North Carolina State University Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
US4935665A (en) 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
CA1337918C (en) 1988-03-16 1996-01-16 Norihisa Osaka Phosphor paste compositions and phosphor coatings obtained therefrom
US5027168A (en) 1988-12-14 1991-06-25 Cree Research, Inc. Blue light emitting diode formed in silicon carbide
US4918497A (en) 1988-12-14 1990-04-17 Cree Research, Inc. Blue light emitting diode formed in silicon carbide
JPH0286150U (en) 1988-12-22 1990-07-09
US4966862A (en) 1989-08-28 1990-10-30 Cree Research, Inc. Method of production of light emitting diodes
US4946547A (en) 1989-10-13 1990-08-07 Cree Research, Inc. Method of preparing silicon carbide surfaces for crystal growth
US5210051A (en) 1990-03-27 1993-05-11 Cree Research, Inc. High efficiency light emitting diodes from bipolar gallium nitride
US5200022A (en) 1990-10-03 1993-04-06 Cree Research, Inc. Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
US5416342A (en) 1993-06-23 1995-05-16 Cree Research, Inc. Blue light-emitting diode with high external quantum efficiency
US5338944A (en) 1993-09-22 1994-08-16 Cree Research, Inc. Blue light-emitting diode with degenerate junction structure
US5393993A (en) 1993-12-13 1995-02-28 Cree Research, Inc. Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices
US5604135A (en) 1994-08-12 1997-02-18 Cree Research, Inc. Method of forming green light emitting diode in silicon carbide
US5523589A (en) 1994-09-20 1996-06-04 Cree Research, Inc. Vertical geometry light emitting diode with group III nitride active layer and extended lifetime
US5631190A (en) 1994-10-07 1997-05-20 Cree Research, Inc. Method for producing high efficiency light-emitting diodes and resulting diode structures
DE19509262C2 (en) 1995-03-15 2001-11-29 Siemens Ag Semiconductor component with plastic sheathing and method for its production
US5614131A (en) 1995-05-01 1997-03-25 Motorola, Inc. Method of making an optoelectronic device
US5739554A (en) 1995-05-08 1998-04-14 Cree Research, Inc. Double heterojunction light emitting diode with gallium nitride active layer
US6056421A (en) 1995-08-25 2000-05-02 Michael Brian Johnson Architectural lighting devices with photosensitive lens
US5766987A (en) 1995-09-22 1998-06-16 Tessera, Inc. Microelectronic encapsulation methods and equipment
DE19536438A1 (en) 1995-09-29 1997-04-03 Siemens Ag Semiconductor device and manufacturing process
TW412744B (en) 1996-02-13 2000-11-21 Dainippon Printing Co Ltd Device with display portion capable of rewriting
JP2947156B2 (en) 1996-02-29 1999-09-13 双葉電子工業株式会社 Phosphor manufacturing method
US6001671A (en) 1996-04-18 1999-12-14 Tessera, Inc. Methods for manufacturing a semiconductor package having a sacrificial layer
US5803579A (en) 1996-06-13 1998-09-08 Gentex Corporation Illuminator assembly incorporating light emitting diodes
DE19638667C2 (en) 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mixed-color light-emitting semiconductor component with luminescence conversion element
KR100662955B1 (en) * 1996-06-26 2006-12-28 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 Light-emitting semiconductor component with luminescence conversion element
JP3751587B2 (en) 1996-07-12 2006-03-01 富士通株式会社 Manufacturing method of semiconductor device
TW383508B (en) 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
JP3065258B2 (en) 1996-09-30 2000-07-17 日亜化学工業株式会社 Light emitting device and display device using the same
JP3448441B2 (en) 1996-11-29 2003-09-22 三洋電機株式会社 Light emitting device
US5833903A (en) 1996-12-10 1998-11-10 Great American Gumball Corporation Injection molding encapsulation for an electronic device directly onto a substrate
US6274890B1 (en) 1997-01-15 2001-08-14 Kabushiki Kaisha Toshiba Semiconductor light emitting device and its manufacturing method
JP3492178B2 (en) 1997-01-15 2004-02-03 株式会社東芝 Semiconductor light emitting device and method of manufacturing the same
US6333522B1 (en) * 1997-01-31 2001-12-25 Matsushita Electric Industrial Co., Ltd. Light-emitting element, semiconductor light-emitting device, and manufacturing methods therefor
US6583444B2 (en) 1997-02-18 2003-06-24 Tessera, Inc. Semiconductor packages having light-sensitive chips
JP3246386B2 (en) 1997-03-05 2002-01-15 日亜化学工業株式会社 Light emitting diode and color conversion mold member for light emitting diode
US5813753A (en) 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
FR2764111A1 (en) 1997-06-03 1998-12-04 Sgs Thomson Microelectronics METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGES INCLUDING AN INTEGRATED CIRCUIT
JPH1126741A (en) * 1997-07-04 1999-01-29 Toshiba Corp Solid-state image pick-up device
JP3920461B2 (en) 1998-06-15 2007-05-30 大日本印刷株式会社 Lens and manufacturing method thereof
US6340824B1 (en) 1997-09-01 2002-01-22 Kabushiki Kaisha Toshiba Semiconductor light emitting device including a fluorescent material
JPH1187778A (en) 1997-09-02 1999-03-30 Toshiba Corp Semiconductor light emitting element, semiconductor light emitting device and manufacture thereof
CN2310925Y (en) 1997-09-26 1999-03-17 陈兴 Structure of light emitting diode
US6201262B1 (en) 1997-10-07 2001-03-13 Cree, Inc. Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlay structure
US6495083B2 (en) 1997-10-29 2002-12-17 Hestia Technologies, Inc. Method of underfilling an integrated circuit chip
TW408497B (en) 1997-11-25 2000-10-11 Matsushita Electric Works Ltd LED illuminating apparatus
DE69839300T2 (en) 1997-12-15 2009-04-16 Philips Lumileds Lighting Company, LLC, San Jose Light-emitting device
US6252254B1 (en) 1998-02-06 2001-06-26 General Electric Company Light emitting device with phosphor composition
US6580097B1 (en) 1998-02-06 2003-06-17 General Electric Company Light emitting device with phosphor composition
JPH11276932A (en) 1998-03-30 1999-10-12 Japan Tobacco Inc Centrifugal separator
US6329224B1 (en) 1998-04-28 2001-12-11 Tessera, Inc. Encapsulation of microelectronic assemblies
US6504180B1 (en) 1998-07-28 2003-01-07 Imec Vzw And Vrije Universiteit Method of manufacturing surface textured high-efficiency radiating devices and devices obtained therefrom
US5959316A (en) 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US20030054406A1 (en) * 1998-09-01 2003-03-20 Genentech, Inc. Secreted and transmembrane polypeptides and nucleic acids encoding the same
JP3724620B2 (en) 1998-09-29 2005-12-07 シャープ株式会社 Manufacturing method of light emitting diode
US6366018B1 (en) 1998-10-21 2002-04-02 Sarnoff Corporation Apparatus for performing wavelength-conversion using phosphors with light emitting diodes
US6404125B1 (en) 1998-10-21 2002-06-11 Sarnoff Corporation Method and apparatus for performing wavelength-conversion using phosphors with light emitting diodes
US5988925A (en) * 1998-10-26 1999-11-23 Baggett; R. Sherman Stacked paper fastener
US6184465B1 (en) 1998-11-12 2001-02-06 Micron Technology, Inc. Semiconductor package
US6307218B1 (en) 1998-11-20 2001-10-23 Lumileds Lighting, U.S., Llc Electrode structures for light emitting devices
JP3775081B2 (en) 1998-11-27 2006-05-17 松下電器産業株式会社 Semiconductor light emitting device
US6429583B1 (en) 1998-11-30 2002-08-06 General Electric Company Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors
JP4256968B2 (en) 1999-01-14 2009-04-22 スタンレー電気株式会社 Manufacturing method of light emitting diode
JP3494586B2 (en) 1999-03-26 2004-02-09 アピックヤマダ株式会社 Resin sealing device and resin sealing method
US6627997B1 (en) 1999-03-26 2003-09-30 Hitachi, Ltd. Semiconductor module and method of mounting
JP2000299334A (en) 1999-04-14 2000-10-24 Apic Yamada Corp Resin-sealing apparatus
DE19918370B4 (en) 1999-04-22 2006-06-08 Osram Opto Semiconductors Gmbh LED white light source with lens
US6257737B1 (en) 1999-05-20 2001-07-10 Philips Electronics Na Low-profile luminaire having a reflector for mixing light from a multi-color linear array of LEDs
JP3337000B2 (en) 1999-06-07 2002-10-21 サンケン電気株式会社 Semiconductor light emitting device
EP1059678A2 (en) 1999-06-09 2000-12-13 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
JP3675234B2 (en) 1999-06-28 2005-07-27 豊田合成株式会社 Manufacturing method of semiconductor light emitting device
US6338813B1 (en) 1999-10-15 2002-01-15 Advanced Semiconductor Engineering, Inc. Molding method for BGA semiconductor chip package
KR20010044907A (en) 1999-11-01 2001-06-05 김순택 Phosphor screen representing high brightness in a low voltage and manufacturing method thereof
DE19955747A1 (en) * 1999-11-19 2001-05-23 Osram Opto Semiconductors Gmbh Optical semiconductor device with multiple quantum well structure, e.g. LED, has alternate well layers and barrier layers forming super-lattices
US6406991B2 (en) * 1999-12-27 2002-06-18 Hoya Corporation Method of manufacturing a contact element and a multi-layered wiring substrate, and wafer batch contact board
DE19963806C2 (en) 1999-12-30 2002-02-07 Osram Opto Semiconductors Gmbh Process for producing a light-emitting diode white light source, use of a plastic molding compound for producing a light-emitting diode white light source and surface-mountable light-emitting diode white light source
DE10010638A1 (en) 2000-03-03 2001-09-13 Osram Opto Semiconductors Gmbh Making light emitting semiconducting body with luminescence conversion element involves applying suspension with solvent, adhesive, luminescent material
US6793371B2 (en) 2000-03-09 2004-09-21 Mongo Light Co. Inc. LED lamp assembly
US6522065B1 (en) 2000-03-27 2003-02-18 General Electric Company Single phosphor for creating white light with high luminosity and high CRI in a UV led device
US7121925B2 (en) 2000-03-31 2006-10-17 Toyoda Gosei Co., Ltd. Method for dicing semiconductor wafer into chips
JP4810746B2 (en) 2000-03-31 2011-11-09 豊田合成株式会社 Group III nitride compound semiconductor device
US6653765B1 (en) 2000-04-17 2003-11-25 General Electric Company Uniform angular light distribution from LEDs
JP4403631B2 (en) 2000-04-24 2010-01-27 ソニー株式会社 Manufacturing method of chip-shaped electronic component and manufacturing method of pseudo wafer used for manufacturing the same
US6621211B1 (en) 2000-05-15 2003-09-16 General Electric Company White light emitting phosphor blends for LED devices
US6501100B1 (en) 2000-05-15 2002-12-31 General Electric Company White light emitting phosphor blend for LED devices
GB0013394D0 (en) 2000-06-01 2000-07-26 Microemissive Displays Ltd A method of creating a color optoelectronic device
JP2002009097A (en) 2000-06-22 2002-01-11 Oki Electric Ind Co Ltd Semiconductor device and method of manufacturing the same
DE10033502A1 (en) 2000-07-10 2002-01-31 Osram Opto Semiconductors Gmbh Optoelectronic module, process for its production and its use
US6468832B1 (en) 2000-07-19 2002-10-22 National Semiconductor Corporation Method to encapsulate bumped integrated circuit to create chip scale package
JP3589187B2 (en) * 2000-07-31 2004-11-17 日亜化学工業株式会社 Method for forming light emitting device
JP2002050799A (en) 2000-08-04 2002-02-15 Stanley Electric Co Ltd Led lamp and manufacturing method therefor
JP2002076196A (en) 2000-08-25 2002-03-15 Nec Kansai Ltd Chip type semiconductor device and its manufacturing method
US6614103B1 (en) 2000-09-01 2003-09-02 General Electric Company Plastic packaging of LED arrays
JP2002076445A (en) 2000-09-01 2002-03-15 Sanken Electric Co Ltd Semiconductor light emitting device
JP2002101147A (en) 2000-09-26 2002-04-05 Hitachi Kokusai Electric Inc Communication system
US6650044B1 (en) 2000-10-13 2003-11-18 Lumileds Lighting U.S., Llc Stenciling phosphor layers on light emitting diodes
DE10051242A1 (en) 2000-10-17 2002-04-25 Philips Corp Intellectual Pty Light-emitting device with coated phosphor
US20020063520A1 (en) 2000-11-29 2002-05-30 Huei-Che Yu Pre-formed fluorescent plate - LED device
JP3614776B2 (en) 2000-12-19 2005-01-26 シャープ株式会社 Chip component type LED and its manufacturing method
JP5110744B2 (en) 2000-12-21 2012-12-26 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー Light emitting device and manufacturing method thereof
JP2002280607A (en) 2001-01-10 2002-09-27 Toyoda Gosei Co Ltd Light emitting device
US6734571B2 (en) 2001-01-23 2004-05-11 Micron Technology, Inc. Semiconductor assembly encapsulation mold
MY145695A (en) 2001-01-24 2012-03-30 Nichia Corp Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
US6891200B2 (en) 2001-01-25 2005-05-10 Matsushita Electric Industrial Co., Ltd. Light-emitting unit, light-emitting unit assembly, and lighting apparatus produced using a plurality of light-emitting units
US6791119B2 (en) 2001-02-01 2004-09-14 Cree, Inc. Light emitting diodes including modifications for light extraction
TW516247B (en) 2001-02-26 2003-01-01 Arima Optoelectronics Corp Light emitting diode with light conversion using scattering optical media
JP4081985B2 (en) 2001-03-02 2008-04-30 日亜化学工業株式会社 Light emitting device and manufacturing method thereof
US6661167B2 (en) 2001-03-14 2003-12-09 Gelcore Llc LED devices
JP2002319704A (en) 2001-04-23 2002-10-31 Matsushita Electric Works Ltd Led chip
IE20020300A1 (en) 2001-04-23 2003-03-19 Plasma Ireland Ltd An Illuminator
US6686676B2 (en) 2001-04-30 2004-02-03 General Electric Company UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same
US6958497B2 (en) 2001-05-30 2005-10-25 Cree, Inc. Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures
US6642652B2 (en) 2001-06-11 2003-11-04 Lumileds Lighting U.S., Llc Phosphor-converted light emitting device
JP4114331B2 (en) 2001-06-15 2008-07-09 豊田合成株式会社 Light emitting device
EP2034530B1 (en) 2001-06-15 2015-01-21 Cree, Inc. GaN based LED formed on a SiC substrate
JP4010299B2 (en) 2001-06-20 2007-11-21 日亜化学工業株式会社 Semiconductor light emitting device and method for forming the same
JP4529319B2 (en) 2001-06-27 2010-08-25 日亜化学工業株式会社 Semiconductor chip and manufacturing method thereof
DE10131698A1 (en) * 2001-06-29 2003-01-30 Osram Opto Semiconductors Gmbh Surface-mountable radiation-emitting component and method for its production
JP4147755B2 (en) 2001-07-31 2008-09-10 日亜化学工業株式会社 Light emitting device and manufacturing method thereof
TW511303B (en) 2001-08-21 2002-11-21 Wen-Jr He A light mixing layer and method
JPWO2003021668A1 (en) 2001-08-31 2004-12-24 日立化成工業株式会社 Wiring board, semiconductor device, and manufacturing method thereof
US7169280B2 (en) 2001-08-31 2007-01-30 Semitool, Inc. Apparatus and method for deposition of an electrophoretic emulsion
JP2006080565A (en) 2001-09-03 2006-03-23 Matsushita Electric Ind Co Ltd Method of manufacturing semiconductor light emitting device
EP2017901A1 (en) 2001-09-03 2009-01-21 Panasonic Corporation Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting DEV
US6759266B1 (en) 2001-09-04 2004-07-06 Amkor Technology, Inc. Quick sealing glass-lidded package fabrication method
JP3925137B2 (en) 2001-10-03 2007-06-06 日亜化学工業株式会社 Method for manufacturing light emitting device
TW517356B (en) 2001-10-09 2003-01-11 Delta Optoelectronics Inc Package structure of display device and its packaging method
JP3948650B2 (en) 2001-10-09 2007-07-25 アバゴ・テクノロジーズ・イーシービーユー・アイピー（シンガポール）プライベート・リミテッド Light emitting diode and manufacturing method thereof
US6531328B1 (en) 2001-10-11 2003-03-11 Solidlite Corporation Packaging of light-emitting diode
EP1437776B1 (en) * 2001-10-12 2011-09-21 Nichia Corporation Light emitting device and method for manufacture thereof
ATE324387T1 (en) 2001-11-27 2006-05-15 Basell Poliolefine Srl CLEAR AND FLEXIBLE POLYPROPENE COMPOSITIONS
JP4055405B2 (en) 2001-12-03 2008-03-05 ソニー株式会社 Electronic component and manufacturing method thereof
JP2003170465A (en) 2001-12-04 2003-06-17 Matsushita Electric Ind Co Ltd Method for manufacturing semiconductor package and sealing mold therefor
TW518775B (en) 2002-01-29 2003-01-21 Chi-Hsing Hsu Immersion cooling type light emitting diode and its packaging method
JP2003234511A (en) 2002-02-06 2003-08-22 Toshiba Corp Semiconductor light-emitting device and manufacturing method thereof
JP4269709B2 (en) 2002-02-19 2009-05-27 日亜化学工業株式会社 Light emitting device and manufacturing method thereof
US6924514B2 (en) 2002-02-19 2005-08-02 Nichia Corporation Light-emitting device and process for producing thereof
JP3801931B2 (en) 2002-03-05 2006-07-26 ローム株式会社 Structure and manufacturing method of light emitting device using LED chip
US6756186B2 (en) 2002-03-22 2004-06-29 Lumileds Lighting U.S., Llc Producing self-aligned and self-exposed photoresist patterns on light emitting devices
JP3823870B2 (en) * 2002-04-22 2006-09-20 セイコーエプソン株式会社 Wiring board manufacturing method and electronic device manufacturing method
US6949389B2 (en) 2002-05-02 2005-09-27 Osram Opto Semiconductors Gmbh Encapsulation for organic light emitting diodes devices
US6841802B2 (en) 2002-06-26 2005-01-11 Oriol, Inc. Thin film light emitting diode
JP2004031856A (en) 2002-06-28 2004-01-29 Sumitomo Electric Ind Ltd ZnSe-BASED LIGHT EMITTING DEVICE AND ITS MANUFACTURING METHOD
DE10237084A1 (en) 2002-08-05 2004-02-19 Osram Opto Semiconductors Gmbh Electrically conductive frame with a semiconductor light diode, to illuminate a mobile telephone keypad, has a layered structure with the electrical connections and an encapsulated diode chip in very small dimensions
KR20040017926A (en) 2002-08-22 2004-03-02 웬-치 호 Light-mixing layer and method
US20040038442A1 (en) 2002-08-26 2004-02-26 Kinsman Larry D. Optically interactive device packages and methods of assembly
EP1892764B1 (en) 2002-08-29 2016-03-09 Seoul Semiconductor Co., Ltd. Light-emitting device having light-emitting diodes
JP2004095765A (en) 2002-08-30 2004-03-25 Nichia Chem Ind Ltd Light emitting device and method for manufacturing the same
US7078737B2 (en) * 2002-09-02 2006-07-18 Matsushita Electric Industrial Co., Ltd. Light-emitting device
US7264378B2 (en) 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
CA2495149A1 (en) 2002-09-19 2004-04-01 Cree, Inc. Phosphor-coated light emitting diodes including tapered sidewalls, and fabrication methods therefor
JP2004134699A (en) 2002-10-15 2004-04-30 Toyoda Gosei Co Ltd Light emitting device
US20060003477A1 (en) * 2002-10-30 2006-01-05 Bert Braune Method for producing a light source provided with electroluminescent diodes and comprising a luminescence conversion element
JP4072632B2 (en) 2002-11-29 2008-04-09 豊田合成株式会社 Light emitting device and light emitting method
JP4292794B2 (en) 2002-12-04 2009-07-08 日亜化学工業株式会社 Light emitting device, method for manufacturing light emitting device, and method for adjusting chromaticity of light emitting device
US6744196B1 (en) * 2002-12-11 2004-06-01 Oriol, Inc. Thin film LED
DE10258193B4 (en) 2002-12-12 2014-04-10 Osram Opto Semiconductors Gmbh Method for producing light-emitting diode light sources with luminescence conversion element
US6917057B2 (en) 2002-12-31 2005-07-12 Gelcore Llc Layered phosphor coatings for LED devices
JP3858829B2 (en) 2003-02-06 2006-12-20 日亜化学工業株式会社 Method for forming light emitting diode
US7042020B2 (en) 2003-02-14 2006-05-09 Cree, Inc. Light emitting device incorporating a luminescent material
JP4254266B2 (en) 2003-02-20 2009-04-15 豊田合成株式会社 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE MANUFACTURING METHOD
US7423296B2 (en) 2003-02-26 2008-09-09 Avago Technologies Ecbu Ip Pte Ltd Apparatus for producing a spectrally-shifted light output from a light emitting device utilizing thin-film luminescent layers
JP4131178B2 (en) 2003-02-28 2008-08-13 豊田合成株式会社 Light emitting device
JP4303550B2 (en) 2003-09-30 2009-07-29 豊田合成株式会社 Light emitting device
JP3900093B2 (en) 2003-03-11 2007-04-04 日立電線株式会社 Mold and method for manufacturing semiconductor device using the same
US7038370B2 (en) 2003-03-17 2006-05-02 Lumileds Lighting, U.S., Llc Phosphor converted light emitting device
WO2004099342A1 (en) 2003-05-12 2004-11-18 Luxpia Co., Ltd. Tb,b-based yellow phosphor, its preparation method, and white semiconductor light emitting device incorporating the same
US7286296B2 (en) 2004-04-23 2007-10-23 Light Prescriptions Innovators, Llc Optical manifold for light-emitting diodes
JP2004363380A (en) 2003-06-05 2004-12-24 Sanyo Electric Co Ltd Optical semiconductor device and its fabricating process
JP4415572B2 (en) 2003-06-05 2010-02-17 日亜化学工業株式会社 Semiconductor light emitting device and manufacturing method thereof
US6921929B2 (en) 2003-06-27 2005-07-26 Lockheed Martin Corporation Light-emitting diode (LED) with amorphous fluoropolymer encapsulant and lens
US7200009B2 (en) 2003-07-01 2007-04-03 Nokia Corporation Integrated electromechanical arrangement and method of production
JP4277617B2 (en) 2003-08-08 2009-06-10 日立電線株式会社 Manufacturing method of semiconductor light emitting device
WO2005022654A2 (en) 2003-08-28 2005-03-10 Matsushita Electric Industrial Co.,Ltd. Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device
US7183587B2 (en) 2003-09-09 2007-02-27 Cree, Inc. Solid metal block mounting substrates for semiconductor light emitting devices
US7029935B2 (en) 2003-09-09 2006-04-18 Cree, Inc. Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same
US7915085B2 (en) 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
KR100587328B1 (en) 2003-10-16 2006-06-08 엘지전자 주식회사 Light Emitting Diode a front optical source
KR101127314B1 (en) 2003-11-19 2012-03-29 니치아 카가쿠 고교 가부시키가이샤 Semiconductor device
JP2005167079A (en) 2003-12-04 2005-06-23 Toyoda Gosei Co Ltd Light emitting device
CN1317775C (en) 2003-12-10 2007-05-23 玄基光电半导体股份有限公司 Packaging structure of LED and packaging method thereof
JP2005197369A (en) 2004-01-05 2005-07-21 Toshiba Corp Optical semiconductor device
JP2005252222A (en) 2004-02-03 2005-09-15 Matsushita Electric Ind Co Ltd Semiconductor light-emitting device, lighting module, lighting device, display device, and method of manufacturing semiconductor light-emitting device
JP4357311B2 (en) 2004-02-04 2009-11-04 シチズン電子株式会社 Light emitting diode chip
US7246923B2 (en) 2004-02-11 2007-07-24 3M Innovative Properties Company Reshaping light source modules and illumination systems using the same
CN1918263A (en) 2004-02-18 2007-02-21 昭和电工株式会社 Phosphor, production method thereof and light-emitting device using the phosphor
US7569863B2 (en) 2004-02-19 2009-08-04 Panasonic Corporation Semiconductor light emitting device
US7250715B2 (en) 2004-02-23 2007-07-31 Philips Lumileds Lighting Company, Llc Wavelength converted semiconductor light emitting devices
US6924233B1 (en) 2004-03-19 2005-08-02 Agilent Technologies, Inc. Phosphor deposition methods
KR100486177B1 (en) 2004-03-25 2005-05-06 에피밸리 주식회사 Ⅲ-Nitride Compound Semiconductor Light Emitting Device
JP4516337B2 (en) 2004-03-25 2010-08-04 シチズン電子株式会社 Semiconductor light emitting device
US20050211991A1 (en) 2004-03-26 2005-09-29 Kyocera Corporation Light-emitting apparatus and illuminating apparatus
US7517728B2 (en) 2004-03-31 2009-04-14 Cree, Inc. Semiconductor light emitting devices including a luminescent conversion element
US7419912B2 (en) 2004-04-01 2008-09-02 Cree, Inc. Laser patterning of light emitting devices
US20050280894A1 (en) 2004-04-02 2005-12-22 David Hartkop Apparatus for creating a scanning-column backlight in a scanning aperture display device
US7868343B2 (en) 2004-04-06 2011-01-11 Cree, Inc. Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same
EP1738385A1 (en) 2004-04-15 2007-01-03 Koninklijke Philips Electronics N.V. Electrically controllable color conversion cell
WO2005103199A1 (en) 2004-04-27 2005-11-03 Matsushita Electric Industrial Co., Ltd. Phosphor composition and method for producing the same, and light-emitting device using the same
JP4471729B2 (en) 2004-04-30 2010-06-02 シチズン電子株式会社 Light emitting device with liquid crystal lens
TWI241034B (en) 2004-05-20 2005-10-01 Lighthouse Technology Co Ltd Light emitting diode package
US7278760B2 (en) 2004-05-24 2007-10-09 Osram Opto Semiconductor Gmbh Light-emitting electronic component
EP1601030B1 (en) 2004-05-24 2019-04-03 OSRAM OLED GmbH Light-emitting electronic component
WO2005121641A1 (en) 2004-06-11 2005-12-22 Koninklijke Philips Electronics N.V. Illumination system
DE102004031603B4 (en) * 2004-06-30 2008-04-17 Eads Deutschland Gmbh Method for shaping signal spectra and circuit for carrying out the method
US7534633B2 (en) 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
US7271420B2 (en) * 2004-07-07 2007-09-18 Cao Group, Inc. Monolitholic LED chip to emit multiple colors
JP4932144B2 (en) 2004-07-12 2012-05-16 株式会社朝日ラバー LED lamp
JP4747726B2 (en) 2004-09-09 2011-08-17 豊田合成株式会社 Light emitting device
JP3802911B2 (en) 2004-09-13 2006-08-02 ローム株式会社 Semiconductor light emitting device
US7217583B2 (en) 2004-09-21 2007-05-15 Cree, Inc. Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension
US8174037B2 (en) 2004-09-22 2012-05-08 Cree, Inc. High efficiency group III nitride LED with lenticular surface
US8513686B2 (en) 2004-09-22 2013-08-20 Cree, Inc. High output small area group III nitride LEDs
US7737459B2 (en) 2004-09-22 2010-06-15 Cree, Inc. High output group III nitride light emitting diodes
US7259402B2 (en) 2004-09-22 2007-08-21 Cree, Inc. High efficiency group III nitride-silicon carbide light emitting diode
US7372198B2 (en) 2004-09-23 2008-05-13 Cree, Inc. Semiconductor light emitting devices including patternable films comprising transparent silicone and phosphor
JP4756841B2 (en) 2004-09-29 2011-08-24 スタンレー電気株式会社 Manufacturing method of semiconductor light emitting device
DE102004060358A1 (en) 2004-09-30 2006-04-13 Osram Opto Semiconductors Gmbh Method for producing luminescence diode chips and luminescence diode chip
JP2006114637A (en) 2004-10-13 2006-04-27 Toshiba Corp Semiconductor light-emitting device
US20070257335A1 (en) 2004-10-29 2007-11-08 O'brien Peter Illuminator and Manufacturing Method
US8134292B2 (en) 2004-10-29 2012-03-13 Ledengin, Inc. Light emitting device with a thermal insulating and refractive index matching material
JP4802533B2 (en) 2004-11-12 2011-10-26 日亜化学工業株式会社 Semiconductor device
JP2006165416A (en) 2004-12-10 2006-06-22 Stanley Electric Co Ltd White-color displaying device, and manufacturing method thereof
US7671529B2 (en) 2004-12-10 2010-03-02 Philips Lumileds Lighting Company, Llc Phosphor converted light emitting device
KR100646093B1 (en) 2004-12-17 2006-11-15 엘지이노텍 주식회사 Light emitting device package
US8288942B2 (en) 2004-12-28 2012-10-16 Cree, Inc. High efficacy white LED
KR100638666B1 (en) * 2005-01-03 2006-10-30 삼성전기주식회사 Nitride based semiconductor light emitting device
US7195944B2 (en) * 2005-01-11 2007-03-27 Semileds Corporation Systems and methods for producing white-light emitting diodes
US7221044B2 (en) 2005-01-21 2007-05-22 Ac Led Lighting, L.L.C. Heterogeneous integrated high voltage DC/AC light emitter
US7932111B2 (en) 2005-02-23 2011-04-26 Cree, Inc. Substrate removal process for high light extraction LEDs
JP2006245020A (en) 2005-02-28 2006-09-14 Sharp Corp Light emitting diode element and manufacturing method thereof
JP4601464B2 (en) 2005-03-10 2010-12-22 株式会社沖データ Semiconductor device, print head, and image forming apparatus using the same
JP4961799B2 (en) 2005-04-08 2012-06-27 日亜化学工業株式会社 Light emitting device having a silicone resin layer formed by screen printing
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US20070001182A1 (en) * 2005-06-30 2007-01-04 3M Innovative Properties Company Structured phosphor tape article
KR100665219B1 (en) 2005-07-14 2007-01-09 삼성전기주식회사 Wavelengt-converted light emitting diode package
JP2007063538A (en) 2005-08-03 2007-03-15 Shin Etsu Chem Co Ltd Addition curing-type silicone resin composition for light emitting diode
US7365371B2 (en) 2005-08-04 2008-04-29 Cree, Inc. Packages for semiconductor light emitting devices utilizing dispensed encapsulants
US8563339B2 (en) * 2005-08-25 2013-10-22 Cree, Inc. System for and method for closed loop electrophoretic deposition of phosphor materials on semiconductor devices
JP2007087973A (en) 2005-09-16 2007-04-05 Rohm Co Ltd Manufacture of nitride semiconductor device, method for manufacturing nitride semiconductor device, and nitride semiconductor light-emitting device obtained by the same
DE102005062514A1 (en) 2005-09-28 2007-03-29 Osram Opto Semiconductors Gmbh Multi-purpose light emitting diode incorporates selective wavelength trap
WO2007050483A2 (en) 2005-10-24 2007-05-03 3M Innovative Properties Company Method of making light emitting device having a molded encapsulant
US7344952B2 (en) 2005-10-28 2008-03-18 Philips Lumileds Lighting Company, Llc Laminating encapsulant film containing phosphor over LEDs
US7564070B2 (en) 2005-11-23 2009-07-21 Visteon Global Technologies, Inc. Light emitting diode device having a shield and/or filter
DE102005058127A1 (en) 2005-11-30 2007-06-06 Schefenacker Vision Systems Germany Gmbh Vehicle lamp e.g. motor vehicle rear lamp, has translucent mediums that are nontransparent in radiating direction of light which is transmitted from illuminants in translucent manner and in opposite direction of light
KR100732849B1 (en) 2005-12-21 2007-06-27 삼성에스디아이 주식회사 Organic light emitting display device
KR100723247B1 (en) 2006-01-10 2007-05-29 삼성전기주식회사 Chip coating type light emitting diode package and fabrication method thereof
KR200412776Y1 (en) 2006-01-19 2006-03-31 주식회사 닥터코리아 Cotton for Bedclothes Containing Wormwood
US7682850B2 (en) 2006-03-17 2010-03-23 Philips Lumileds Lighting Company, Llc White LED for backlight with phosphor plates
KR200417926Y1 (en) 2006-03-21 2006-06-02 황성민 a boundary stone for No entering
WO2007107903A1 (en) 2006-03-23 2007-09-27 Koninklijke Philips Electronics N.V. Led-based lighting device with colour control
US20070269586A1 (en) 2006-05-17 2007-11-22 3M Innovative Properties Company Method of making light emitting device with silicon-containing composition
TWI308401B (en) 2006-07-04 2009-04-01 Epistar Corp High efficient phosphor-converted light emitting diode
BRPI0714026A2 (en) 2006-07-06 2012-12-18 Tir Technology Lp lighting device packaging
KR200429313Y1 (en) 2006-08-03 2006-10-20 (주)에코청진 A revetment block for staircase type
US7714348B2 (en) 2006-10-06 2010-05-11 Ac-Led Lighting, L.L.C. AC/DC light emitting diodes with integrated protection mechanism
JP2008129043A (en) 2006-11-16 2008-06-05 Toyoda Gosei Co Ltd Led light emission display device
US20080121911A1 (en) 2006-11-28 2008-05-29 Cree, Inc. Optical preforms for solid state light emitting dice, and methods and systems for fabricating and assembling same
EP1935452A1 (en) 2006-12-19 2008-06-25 Koninklijke Philips Electronics N.V. Electrochromic device and photodynamic treatment device comprising such an electrochromic device
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
JP2008218511A (en) 2007-02-28 2008-09-18 Toyoda Gosei Co Ltd Semiconductor light emitting device and method formanufacturing the same
DE102007022090A1 (en) 2007-05-11 2008-11-13 Osram Opto Semiconductors Gmbh Light emitting component for lamp, has light source e.g. organic LED, emitting electromagnetic radiation of specific wavelength range, and adjustable transparent element arranged between light source and conversion unit
US7588351B2 (en) 2007-09-27 2009-09-15 Osram Sylvania Inc. LED lamp with heat sink optic
US7915627B2 (en) 2007-10-17 2011-03-29 Intematix Corporation Light emitting device with phosphor wavelength conversion
CN105020681B (en) 2007-11-09 2019-01-01 飞利浦照明控股有限公司 Light output device
US20090268461A1 (en) 2008-04-28 2009-10-29 Deak David G Photon energy conversion structure
US8159131B2 (en) 2008-06-30 2012-04-17 Bridgelux, Inc. Light emitting device having a transparent thermally conductive layer
WO2010035171A2 (en) 2008-09-23 2010-04-01 Koninklijke Philips Electronics N.V. Lighting device with thermally variable reflecting element
US20120043886A1 (en) 2010-08-18 2012-02-23 Hua Ji Integrated Heat Conductive Light Emitting Diode (LED) White Light Source Module

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2704690A1 (en) * 1993-04-27 1994-11-04 Thomson Csf Method for encapsulating semiconductor wafers, device obtained by this process and application to the interconnection of wafers in three dimensions.
US6153448A (en) * 1997-05-14 2000-11-28 Kabushiki Kaisha Toshiba Semiconductor device manufacturing method
WO2001024283A1 (en) * 1999-09-27 2001-04-05 Lumileds Lighting, U.S., Llc Light emitting diode comprising a thin phosphor-conversion film
US20040012958A1 (en) * 2001-04-23 2004-01-22 Takuma Hashimoto Light emitting device comprising led chip
EP1385215A2 (en) * 2002-07-08 2004-01-28 Nichia Corporation Nitride semiconductor device comprising bonded substrate and fabrication method of the same
US20050265404A1 (en) * 2004-05-28 2005-12-01 Ian Ashdown Luminance enhancement apparatus and method
EP1724848A2 (en) * 2005-05-17 2006-11-22 LG Electronics Inc. Light emitting device package and method for manufacturing the same

Also Published As

Publication number Publication date
CN101663767A (en) 2010-03-03
TWI485877B (en) 2015-05-21
WO2008115213A2 (en) 2008-09-25
US20080173884A1 (en) 2008-07-24
CN101627481A (en) 2010-01-13
CN102544267A (en) 2012-07-04
CN102544267B (en) 2015-01-28
CN101627481B (en) 2012-03-21
TW200840092A (en) 2008-10-01
WO2008115213A8 (en) 2009-04-30
US9024349B2 (en) 2015-05-05
EP2111649B1 (en) 2017-09-27
KR20090115156A (en) 2009-11-04
EP2111649A2 (en) 2009-10-28
JP2010517290A (en) 2010-05-20
KR101398655B1 (en) 2014-06-19

Similar Documents

Publication Publication Date Title
WO2008115213A8 (en) Wafer level phosphor coating method and devices fabricated utilizing method
WO2008091319A3 (en) Wafer level phosphor coating method and devices fabricated utilizing method
US11715730B2 (en) Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements
JP6824307B2 (en) Methods for manufacturing semiconductor components and semiconductor components
US9171995B2 (en) Flip chip type light emitting diode and manufacturing method thereof
WO2010144213A3 (en) Integrated circuit light emission device, module and fabrication process
TWI436458B (en) Wafer level package structure and method for manufacturing the same
US10283684B2 (en) Light emitting device and manufacturing method thereof
TWI413285B (en) Method for forming light-emitting device (led) package component
SG151166A1 (en) Semiconductor wafer having through-hole vias on saw streets with backside redistibution layer
TW200703706A (en) Light emitting diode and manufacturing method thereof
US7811843B1 (en) Method of manufacturing light-emitting diode
KR20140010521A (en) Light emitting device package and method of manufacturing the same
US8598611B2 (en) Vertical solid-state transducers and solid-state transducer arrays having backside terminals and associated systems and methods
EP2519982A4 (en) Epitaxial wafer, method for manufacturing the same and method for manufacturing led chip
TW200837978A (en) Light-emitting diode chip package and packaging method thereof
US20130234184A1 (en) Light emitting diode package and method of manufacturing the same
TW201532316A (en) Package structure and manufacturing method thereof
TW200616246A (en) Method of manufacturing light emitting diode package and structure of the same
TW200623448A (en) Light emitting diode and manufacturing method thereof
TW200735398A (en) Light emitting diode and the method for manufacturing the same
CN102339819A (en) Light-emitting diode package structure and method for forming same
TW200640036A (en) Light emitting diode and manufacturing method thereof
TW200623449A (en) Light emitting diode and manufacturing method thereof
TW201210077A (en) LED package and method for manufacturing the same

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200780050197.8

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07874432

Country of ref document: EP

Kind code of ref document: A2

ENP Entry into the national phase

Ref document number: 2009547219

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1020097017405

Country of ref document: KR

REEP Request for entry into the european phase

Ref document number: 2007874432

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2007874432

Country of ref document: EP

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)