WO2008116230A2 - Side stacking apparatus and method - Google Patents
Side stacking apparatus and method Download PDFInfo
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- WO2008116230A2 WO2008116230A2 PCT/US2008/064136 US2008064136W WO2008116230A2 WO 2008116230 A2 WO2008116230 A2 WO 2008116230A2 US 2008064136 W US2008064136 W US 2008064136W WO 2008116230 A2 WO2008116230 A2 WO 2008116230A2
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Definitions
- the present invention relates to semiconductors and, more particularly, to stacking of device-bearing semiconductors.
- ICs whether chips or dies (hereafter “ICs”) that avoids the requirement of using purely passive ancillary elements like mini circuit boards, interposers or flexible circuits.
- One aspect involves a module that has at least two ICs electrically and physically connected to each other such that they lie in different planes and are arranged as a first stack of ICs, a third IC electrically and physically connected to at least one of the at least two ICs, wherein the third IC is off plane from both of the at least two ICs, and at least one electrical connection exists between the third IC and the at least one of the at least two ICs.
- This electrical connection can be a post an penetration connection or some other form of connection.
- FIGS. 1 through 4 illustrate, in overly simplified form, a first generic example of the approach
- FIG. 5 illustrates, in overly simplified form, one example of a module where the chips include a mixture of rigid posts and malleable contacts;
- FIG. 6 illustrates, in overly simplified form, how one or more of the ICs can include additional features to augment the approach
- FIGS. 7 through 10 illustrate, in overly simplified form, a variant of the approach of FIGS. 1 through 4;
- FIG. 1 IA through 1 IH illustrate, in simplified form, various IC shapes suitable for use with the approach described herein;
- FIG. 12 illustrates, in overly simplified form, a module where the ICs that are bridged to each other have a commonly aligned edge
- FIG. 13 illustrates, in overly simplified form, a module where the ICs that are bridged to each other are offset from each other;
- FIGS. 14 through 17 illustrate, in overly simplified form, some example modules employing the approach described herein;
- FIG. 18 and FIG. 19 illustrate, in overly simplified form, how the approach described herein can be used with conventional passive elements.
- our approach can leverage a solder connection or a post and penetration type connection as well as the various attachment approaches in the above- incorporated applications, like a well or reverse well approach, to facilitate attaching of one element to another element, irrespective of whether each is a chip, die, or passive element such as a re-direction layered ("RDL") element or even an interposer or flexible circuitry on a ribbon- like material.
- RDL re-direction layered
- our approach removes an orientation limit present in the conventional approach of vertically stacking chips in parallel planes. With our approach, the stacking can occur in substantially perpendicular as well as parallel planes.
- FIGS. 1 through 4 illustrate a first generic example of the approach.
- a module 100 made up of multiple ICs have been configured to be stacked on each other, for example, in the manner of the aforementioned applications or some other manner.
- FIG. 1 shows, in overly simplified form, a cross section of four ICs 102, 104, 106, 108 that are both physically and optionally electrically connected to each other in a stack. This can be done using a post and penetration approach, a solder process, an epoxy, spin on glass, photoresist or other adhesive material whether conductive or not.
- the ICs can be temporarily held in a stacked arrangement (for example, by tooling or even via gravity) with a subsequent process being used to permanently maintain the stacked arrangement through mechanical and/or electrical connection to one or more elements that are connected off plane to the stack.
- IC-to-IC connections are not shown, but should be presumed to exist as required. Such connections could be between the ICs as well as, optionally, on the bottom of the lowest IC 102 and/or the top of the uppermost IC 108.
- some of the ICs include connection points 1 10, and are shown, that are located near the periphery of the ICs.
- connection points 110 can be located directly at, for example, a contact pad, or can be located on a connection trace that extends between two or more locations or simply reroutes a connection point to the periphery of the IC.
- each of these connection points 110 is configured as a malleable contact of a post and penetration connection as described in each of incorporated U.S. Patent Applications, Serial Nos.
- FIG. 2 illustrates, in overly simplified form, a side view of a further IC 200 that is configured to interconnect with the IC stack 100 of FIG. 1.
- this IC 200 includes a series of outwardly-extending posts 112 that are configured as rigid contacts and positioned to both align and mate with their respective malleable contacts at the connection points 110.
- numerous rigid posts are described in detail in the above- incorporated U.S. Patent Applications.
- FIG. 3 illustrates, in overly simplified form, the stack of ICs 100 of FIG. 1 and the
- the IC 200 of FIG. 2 immediately before joining them together to form a module.
- the IC 200 is now substantially perpendicular to the stack of ICs 100 and the posts 112 are aligned with their malleable counterparts 302
- the ICs in the stack 100 and the IC 200 need not be absolutely perpendicular.
- the ICs in the stack 100 also need not be in perfect alignment with each other. Instead, the connections can tolerate as much offset as the contact size and post length allows.
- perpendicular and substantially perpendicular should be understood to be identical in meaning and used interchangeably with each other, with the meaning being simply as close to perpendicular as is necessary to effect the desired connections which, as will be understood from one of the examples below, can actually be a substantial deviation from a mathematical definition of perpendicular (i.e. 90°).
- perpendicular i.e. 90°
- off plane will sometimes be used herein to generically refer to an IC that is substantially perpendicular to another IC.
- the use of a tight-geometry post and penetration, covalent bonding, metal-to-metal fusion or other close-fit connection processes allow the individual ICs 102, 104, 106, 108 to be stacked much closer together and the individual ICs to be thinned very small so that the structure or structural support can be provided by one or more off plane pieces, for example, the IC 200 and the overall height of the stack can be far shorter than if an interposer were used.
- two ICs in a stack can be spaced apart from each other by lOO ⁇ m or less and an off plane IC can be connected to it and, itself, be spaced from one or both of the ICs by lOO ⁇ m or less.
- the height of a stack of four chips could be slightly more than lOO ⁇ m.
- ICs could even be thinned so that an off plane IC with post and penetration connections on a 5 ⁇ m pitch would result in a stack that is slightly more than 20 ⁇ m high.
- each of the interposers would likely be lOO ⁇ m thick.
- the resultant stack involving the interposers would be many times thicker and include half the number of ICs of the stack 100.
- connections 112 on the IC are then brought into contact forming the connection between the IC 200 and the stack 100. If post and penetration connections are used, then the connections 112 would be posts which connect, under the appropriate pressure, with the corresponding malleable contacts 302 thereby forming the post and penetration connection between the IC 200 and the stack 100, as shown in FIG. 4.
- the off plane element can, itself, be an integrated circuit bearing chip (or a portion thereof) or can be a passive element (whether rigid or flexible) or some other element, for example, a packaging element that contains RDLs but no circuitry.
- the off plane pieces are described as ICs, it should be understood that the term "ICs" herein are not restricted to integrated circuits but could instead be (and are intended to encompass) any of the above passive elements as well.
- the post and penetration connection can optionally be augmented by use of our tack and fuse process, which is described in detail in the above-incorporated U.S. Patent Applications.
- a tack connection can be used to initially join the chips in a non-permanent connection.
- the chips can undergo a fuse process to make the connections "permanent.”
- a fuse process can be used without the tack process, although this will directly make the connections permanent.
- a reflowable material like a solder could be substituted for the malleable material if a barrier is used to confine the molten solder and prevent it from causing an undesirable short with another connection.
- this "barrier" approach can involve use of a well, such as described in the above-incorporated applications, or some other physical wall that is part of, applied to or formed on the IC.
- connection components 110, 1 12 were a pure metal like copper or pure oxide
- a metal-to-metal in this example, copper-to-copper fusion or covalent bonding process, respectively, could be used to similar effect - the former being used if an electrically conductive bond is required.
- these processes do not have any penetration, they are less amenable to off plane connections where exact connection surfaces of the pieces to be joined deviate from parallel.
- the formation of the stack of ICs can occur before, or concurrent with, the attachment of the perpendicular IC.
- different implementations can place the malleable or other type of contacts 302 on a perpendicular IC and the posts 112 on the mating ICs.
- still other implementations can have any one or more of the ICs each include a mixture of different contact types such as, for example, rigid posts 112 and malleable contacts 302 such as shown in the stack 500 of FIG. 5.
- one or more of the ICs 602, 604, 606, 608, 610 in a module 600 can include a feature 612 that, depending upon the particular instance, can be formed on the IC or formed separately and attached to the IC.
- the particular feature can be formed through use of a known etching technique on the IC or formed separately from some other appropriate material, be it a plastic, ceramic, semiconductor, deposited metal or other material.
- the feature can thus serve as a spacer to maintain or define a minimum separation between the IC and some other IC, act as an alignment element 614 itself or in a mating fashion with another feature 616, or serve some other purpose for the particular application.
- a "standoff” can be created directly under a malleable or solder contact to create a minimum and reproducible spacing between adjacent pieces in a stack or between an off plane IC and a stack.
- FIGS. 7 through 10 illustrate, in overly simplified form, a variant of the approach of FIGS. 1 through 4 in order to illustrate why "perpendicular,” as that term is used herein includes a substantial deviation from the mathematical definition of perpendicular bearing in mind that the figures contained herein are not to scale and, in fact, the scale is grossly distorted. Nevertheless, this distortion helps to more clearly illustrate the concept.
- FIG. 7 illustrates, in overly simplified form, a portion 700 of a stack of ICs 702 having malleable contacts 302 at the periphery in which there is substantial misalignment moving from IC to IC in the stack.
- the misalignment of the ICs is within the length tolerance of the length of the rigid posts 112 on another IC 710 that that will be joined to the stack 700.
- an off plane IC such as shown in FIG. 8, can still be attached to the stack of ICs via its posts.
- FIG. 9 illustrates, in overly simplified form, the intended off plane IC 710 of FIG. 8 and the stack 700 of FIG. 7 immediately before joining them together.
- FIG. 9 illustrates, in overly simplified form, the intended off plane IC 710 of FIG. 8 and the stack 700 of FIG. 7 immediately before joining them together.
- the module 1000 illustrates, in overly simplified form, the module 1000 created after the off plane IC 710 has been brought into alignment and the posts 112 of the off plane IC have penetrated their respective malleable contacts 302 on the IC stack 700 forming an electrical connection among the off plane IC 710 and the IC stack 700.
- the post can be configured in the manner they would if it was to be joined to an aligned stack.
- the spacing between post may have to be adjusted prior to formation or through rerouting to account for the deviation.
- 1 IA through 1 IH for example, ICs of triangular, other quadrilateral, hexagonal, octagonal, or even irregular shapes can be used, the limiting factor now being the ability to dice those shapes from a wafer or otherwise saw, cut or create them.
- the off plane IC can be used to bridge ICs so as to provide a more direct connection between them while bypassing one or more ICs that are located in between them.
- This approach is illustrated, in overly simplified form, in FIG. 12 where the ICs that are bridged to each other 1202, 1204, 1210, 1212 have a commonly aligned edge 1216 and in FIG. 13 where the ICs 1302, 1306, 1308 that are bridged to each other are offset from each other (i.e. their pertinent edges 1312, 1314, 1316, 1318 are not commonly aligned).
- FIGS. 14 through 17 illustrate, in overly simplified form, some example modules
- connections between ICs include one or more of a post and penetration connection, a confined solder connection, a metal-to-metal fusion connection and/or a covalent bonding connection.
- 1404, 1406, 1408 are have an off plane IC 1410 connected to them on the left side and three of the ICs 1404, 1406, 1408 in the stack also have an off plane IC 1412 on their right side.
- a further IC 1414 bridges the ICs 1402, 1404, 1406, 1408 in the stack on the front side.
- a more complex module 1600 arrangement has a stack of multiple octagonal ICs 1602 (only one of which is visible in this view) having a stack of three ICs 1604, 1606 on either side, a single IC 1608 on the upper face and a single IC 1610 on the lower face that also bridges the stacks on either side to each other.
- the trapezoidal stack 1702 has a stack 1708 of varying size ICs on its left side which, in turn has a two IC stack 1710 bridging the lower two ICs 1712, 1714 to the upper two ICs 1716, 1718.
- any IC can be an off plane IC with respect to a particular stack while also being part of a stack itself and even having an off plane IC connected to it or another one or more ICs in its stack.
- FIG. 18 and FIG. 19 illustrate, in overly simplified form, how the approach described herein can be used with conventional passive elements such as an element configured with an RDL as well as interposers or flex circuitry.
- a module 1800 is made up of complex stack of ICs and also includes a passive element 1802, in this case flex circuitry, that interconnects a connection point 1804 between the middle two ICs 1806, 1808 in the vertical stack with a connection point 1810 of the lower IC 1812 at the rightmost extreme of the module and partially wraps around a portion of the module.
- the passive element is configured so that conventional ICs 1814, 1816, 1818 can be connected to it using conventional techniques, such as, for example, the ball grid arrays 1820 on the three chips located above the top of the passive element 1802.
- a module 1900 is made up of a stack of four vertically stacked ICs 1902, 1904, 1906, 1908.
- the module 1900 includes a passive element 1910, in this case an interposer that has rigid posts on one face so that it can form post and penetration interconnections with the stacked ICs 1902, 1904, 1906, 1908 and conventional connections 1912 on its other face where a conventional IC 1914 is connected in a known manner.
- the passive elements 1802, 1910 of FIG. 18 or of FIG. 19 can optionally include, in the case of the passive element 1802 of FIG. 18 a rigid portion, or, in the case of the passive element 1910 of FIG.
- the passive element for example the passive element 1802 of FIG. 18 could include a connection that joins to the stack, by way of example, at the connection point 1822 between the two upper and rightmost chips 1824, 1826 or at another connection point between the two upper leftmost chips 1808, 1830.
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Abstract
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JP2009554797A JP2011521437A (en) | 2007-03-19 | 2008-05-19 | Side lamination apparatus and method |
CN200880009023A CN101689544A (en) | 2007-03-19 | 2008-05-19 | Side stacking apparatus and method |
KR1020097021563A KR20100137344A (en) | 2007-03-19 | 2008-05-19 | Side stacking apparatus and method |
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US11/688,088 US7687400B2 (en) | 2005-06-14 | 2007-03-19 | Side stacking apparatus and method |
US11/688,088 | 2007-03-19 |
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EP2457253A1 (en) * | 2009-07-22 | 2012-05-30 | Oracle America, Inc. formerly known as Sun Microsystems, Inc. | A high-bandwidth ramp-stack chip package |
Also Published As
Publication number | Publication date |
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US7687400B2 (en) | 2010-03-30 |
US20070278641A1 (en) | 2007-12-06 |
CN101689544A (en) | 2010-03-31 |
US20100148343A1 (en) | 2010-06-17 |
KR20100137344A (en) | 2010-12-30 |
WO2008116230A3 (en) | 2008-11-20 |
JP2011521437A (en) | 2011-07-21 |
US8084851B2 (en) | 2011-12-27 |
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