WO2008157080A4 - Solid state illumination device - Google Patents

Solid state illumination device Download PDF

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Publication number
WO2008157080A4
WO2008157080A4 PCT/US2008/066075 US2008066075W WO2008157080A4 WO 2008157080 A4 WO2008157080 A4 WO 2008157080A4 US 2008066075 W US2008066075 W US 2008066075W WO 2008157080 A4 WO2008157080 A4 WO 2008157080A4
Authority
WO
WIPO (PCT)
Prior art keywords
sidewall
base
coupled
chamber
semiconductor light
Prior art date
Application number
PCT/US2008/066075
Other languages
French (fr)
Other versions
WO2008157080A3 (en
WO2008157080A2 (en
Inventor
Gerard Harbers
Mark A. Pugh
Original Assignee
Xicato, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xicato, Inc. filed Critical Xicato, Inc.
Priority to BRPI0811678-4A2A priority Critical patent/BRPI0811678A2/en
Priority to CA2689508A priority patent/CA2689508C/en
Priority to MX2009013727A priority patent/MX2009013727A/en
Priority to CN2008800205659A priority patent/CN101689588B/en
Priority to KR1020097027044A priority patent/KR101166625B1/en
Priority to JP2010513322A priority patent/JP5346931B2/en
Priority to EP08770298A priority patent/EP2174356A2/en
Publication of WO2008157080A2 publication Critical patent/WO2008157080A2/en
Publication of WO2008157080A3 publication Critical patent/WO2008157080A3/en
Publication of WO2008157080A4 publication Critical patent/WO2008157080A4/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/62—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using mixing chambers, e.g. housings with reflective walls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/65—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V14/00—Controlling the distribution of the light emitted by adjustment of elements
    • F21V14/08—Controlling the distribution of the light emitted by adjustment of elements by movement of the screens or filters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/02—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with provision for adjustment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0075—Arrangements of multiple light guides
    • G02B6/0078—Side-by-side arrangements, e.g. for large area displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/002—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
    • G02B6/0021—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces for housing at least a part of the light source, e.g. by forming holes or recesses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0045—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide
    • G02B6/0046—Tapered light guide, e.g. wedge-shaped light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Abstract

A solid state illumination device includes a semiconductor light emitter (106) mounted on a base (110) and surrounded by sidewalls (120), e.g., in a circular, elliptical, triangular, rectangular or other appropriate arrangement, to define a chamber (130). A top element (122), which may be reflective, may be coupled to the sidewalls to further define the chamber. The light produced by the semiconductor light emitter (106) is emitted through the sidewalls (120) of the chamber. The sidewalls and/or top element may include wavelength converting material, for example, as a plurality of dots on the surfaces. An adjustable wavelength converting element (452) may be used within the chamber, with the adjustable wavelength converting element (452) being configured to adjust the surface area that is exposed to the light emitted by the semiconductor light emitter in the chamber to alter an optical property of the chamber.

Claims

AMENDED CLAIMS received by the International Bureau on 25 June 2009 (25.06.2009)
1. An apparatus comprising: at least one semiconductor light emitter (106); a base (1 10) upon which the at least one semiconductor light emitter (106) is mounted, the base (110) comprising electrical connections for the at least one semiconductor light emitter (106) and a heat spreader (1 12) thermally coupled to the at least one semiconductor light emitter (106); at least one sidewall (120) surrounding the at least one semiconductor light emitter (106) and coupled to the base (1 10), wherein the at least one sidewall (170) comprises a wavelength converting material; and a reflective top element (122) coupled to the at least one sidewall (120), wherein the base (110), the at least one sidewall (120and the reflective top element (122) define a chamber (130) that contains the at least one semiconductor light emitter (160), and wherein at least 70% of light that is emitted from the chamber (130) is emitted from the at least one sidewall (120).
2. The apparatus of claim 1 , further comprising: a reflective element (124a) between the at least one semiconductor light emitter (106) and the at least one sidewall (120) and between a light emitting area of the semiconductor light emitter (106) and the base (1 10).
3. The apparatus of claim 1, wherein the at least one sidewall (120) has a configuration of selected from one of a circular, elliptical, triangular, and rectangular configuration.
4. (CANCELLED)
5. The apparatus of claim 4, wherein the wavelength converting material is formed by a plurality of dots on a surface of the at least one sidewall (170).
6. The apparatus of claim 1 , wherein the top element (180) comprises a wavelength converting material on the inside of the chamber (130).
-25-
7. The apparatus of claim 1, further comprising a transparent optical material (214) that fills the chamber (213).
8. The apparatus of claim 1 , wherein the top element (252A, 252B) is one of concave to extend into the chamber and convex to extend out of the chamber.
9. The apparatus of claim 1, wherein the at least one sidewall (356) has a first diameter where the at least one sidewall (356) is coupled to the top element (122), and a second diameter where the at least one sidewall (356) is coupled to the base (110), the second diameter is larger than the first diameter.
10. The apparatus of claim 1, wherein the at least one sidewall comprises an interior portion (404) and an exterior portion (402), the exterior portion (402) defines a cavity, wherein the base (110) and top element (406) are coupled to different ones of the interior portion (404) and the exterior portion (402), the interior portion (404) slides into the cavity defined by the exterior portion (402).
11. The apparatus of claim 1, further comprising at least one reflective element (702, 812) optically coupled to the at least one sidewall (120) on the outside of the chamber (130) and configured to reflect light emitted through the at least one sidewall (120) into a forward direction that is generally orthogonal to normal to a surface of the at least one sidewall (120).
12. The apparatus of claim 11, wherein the apparatus is one of a reflector lamp and a backlight.
13. The apparatus of claim 11, wherein the at least one reflective element is a first light guide (812) and a second light guide (812), wherein the chamber is between the first light guide and the second light guide.
14. The apparatus of claim 13, the apparatus further comprising an optically diffuse front plate (814) that is optically coupled to the first light guide (812) and the second light guide (812) so that light reflected into a forward direction is diffused by the optically diffuse front plate (814).
15. The apparatus of claim 11, the apparatus further comprising: a second at least one semiconductor light emitter; a second base upon which the second at least one semiconductor light emitter is mounted; a second at least one sidewall surrounding the second at least one semiconductor light emitter and coupled to the second base; and a second reflective top element coupled to the second at least one sidewall, wherein the second base, the second at least one sidewall and the second reflective top element define a second chamber that contains the second at least one semiconductor light emitter, and wherein light produced by the second at least one semiconductor light emitter is emitted through the second at least one sidewall; wherein the at least one reflective element (812) is optically coupled to the second at least one sidewall on the outside of the second chamber and configured to reflect light emitted through the second at least one sidewall into the forward direction that is generally orthogonal to normal to a surface of the second at least one sidewall.
16. The apparatus of claim 15, wherein the at least one reflective element is a first light guide and a second light guide coupled to the chamber, wherein the chamber is between the first light guide and the second light guide (832a); and a third light guide and a fourth light guide coupled to the second chamber (832b), wherein the second chamber is between the third light guide and the fourth light guide.
17. The apparatus of claim 1, the apparatus further comprising: an optically translucent housing (902) that encloses the chamber defined by the at least one sidewall; and a base (904) electrically coupled to the at least one semiconductor light emitter (912) and coupled to the optically translucent housing (902).
18. The apparatus of claim 17, wherein the base (902) is a first base, the apparatus further comprising a second base (920) coupled to the optically translucent housing (902) and a connector (922) coupled to the first base (904), wherein the first base (904) is coupled to the optically translucent housing (902) through the connector (922) and the second base (920).
19. An apparatus comprising:
-27- at least one semiconductor light emitter (106); a base upon which the at least one semiconductor light emitter is mounted (110); at least one sidewall (120) surrounding the at least one semiconductor light emitter and coupled to the base (110); a top element (460) coupled to the at least one sidewall (120), wherein the base (110), the at least one sidewall (120) and the top element (460) define a chamber that contains the at least one semiconductor light emitter, wherein the top element (508) is reflective and wherein light produced by the at least one semiconductor light emitter is emitted through the at least one sidewall (120); and an adjustable wavelength converting element (452) coupled to the chamber, the adjustable wavelength converting element (452) being configured to adjust a surface area that is exposed to light emitted by the at least one semiconductor light emitter (106) in the chamber to alter a optical properties of the chamber.
20. The apparatus of claim 19, further comprising an aperture (458) in one of the base (528) and the top element (460), the adjustable wavelength converting element being configured to adjust the surface area that is exposed to light by adjustably extending into the chamber through the aperture.
21. The apparatus of claim 20, wherein the adjustable wavelength converting element (452) comprises a rod (454) and wavelength converting material (456) coupled to the rod.
22. The apparatus of claim 21, further comprising a plurality of apertures (608) in one of the base (110) and the top element (610), wherein the rod (602) is split into a plurality of ends (606), each end extending into the chamber through a separate aperture.
23. The apparatus of claim 20, wherein the adjustable wavelength converting element (560) comprises a tube (562) with an expandable portion (566), the expandable portion (566) being positioned within the chamber and being configured to expand and constrict to adjust the surface area that is exposed to light emitted.
24. The apparatus of claim 23, wherein the expandable portion expands to lengthen the tube (570) and constricts to shorten the tube.
-28-
25. The apparatus of claim 23, wherein the expandable portion (566) expands to increase a diameter of the expandable portion of the tube (560) and constricts to decrease the diameter of the expandable portion of the tube (560).
26. The apparatus of claim 19, wherein the adjustable wavelength converting element comprises a wavelength converting material on the top element (660), wherein the top element (660)and wavelength converting material are configured to adjust a surface area that is exposed to light by being raised or lowered with respect to the semiconductor light emitter.
27. The apparatus of claim 19, wherein the adjustable wavelength converting element is manually adjustable.
28. The apparatus of claim 19, further comprising an actuator (526) coupled to the adjustable wavelength converting element, wherein the actuator (526) adjusts the adjustable wavelength converting element.
29. (CANCELLED)
30. The apparatus of claim 19, wherein at least one of the top element (122) and the at least one sidewall (120) comprises a wavelength converting material.
31. The apparatus of claim 19, the apparatus further comprising: a base (904) electrically coupled to the at least one semiconductor light emitter (912); an optically translucent housing (902) that encloses the chamber defined by the at least one sidewall and adjustable coupled to the base, the adjustable wavelength converting element (914) being coupled to the optically translucent housing (902), wherein the surface area of the adjustable wavelength converting element (914) that is exposed to light is adjusted when the optically translucent housing is adjusted with respect to the base.
32. The apparatus of claim 31, wherein the base (904) is a first base, the apparatus further comprising a second base (920) coupled to the optically translucent housing (902) and a
-29- connector (922) coupled to the first base (904), wherein the first base (904) is coupled to the optically translucent housing (902) through the connector (922) and the second base (920).
33. The apparatus of claim 19, further comprising a reflective element (902b) optically coupled to the at least one sidewall on the outside of the chamber and configured to reflect light emitted through the at least one sidewall into a forward direction that is generally orthogonal to the direction of the light emitted through the at least one sidewall.
34. The apparatus of claim 33, further comprising: a base (904) electrically coupled to the at least one semiconductor light emitter (912); wherein the reflective element (902b) is adjustably coupled to the base (904), the adjustable wavelength converting element (914) being coupled to the reflective element (902b), wherein the surface area of the adjustable wavelength converting element that is exposed to light is adjusted when the reflective element is adjusted with respect to the base.
35. An apparatus comprising: at least one semiconductor light emitter (106); a base (110) upon which the at least one semiconductor light emitter (106) is mounted, the base comprising electrical connections for the at least one semiconductor light emitter (106) and a heat spreader (112) thermally coupled to the at least one semiconductor light emitter; at least one sidewall (120) surrounding the at least one semiconductor light emitter (106) and coupled to the base (110), wherein light produced by the at least one semiconductor light emitter is emitted through the at least one sidewall, the at least one sidewall and the base define a chamber having a diameter and a height, wherein the height to diameter ratio of the chamber is 2 or greater.
36. The apparatus of claim 35, wherein the at least one sidewall (302) has a top element edge (304) opposite the portion that is coupled to the base, the top element portion (304) being coupled together.
37. The apparatus of claim 35, further comprising:
-30- a reflective element (124a) between the at least one semiconductor light emitter (106) and the at least one sidewall (120) and between a light emitting area of the semiconductor light emitter and the base.
38. The apparatus of claim 35, wherein the at least one sidewall (120) has a configuration of selected from one of a circular, elliptical, triangular, and rectangular configuration.
39. The apparatus of claim 35, wherein the at least one sidewall (120) comprises a wavelength converting material.
40. The apparatus of claim 35, wherein the wavelength converting material is formed by a plurality of dots on a surface of the at least one sidewall.
41. The apparatus of claim 35, wherein the base (110) comprises a printed circuit board coupled to the at least one semiconductor light emitter (106) and a heat spreader (112) coupled to the printed circuit board.
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PCT/US2008/066075 2007-06-18 2008-06-06 Solid state illumination device WO2008157080A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
BRPI0811678-4A2A BRPI0811678A2 (en) 2007-06-18 2008-06-06 "LIGHTING APPLIANCE"
CA2689508A CA2689508C (en) 2007-06-18 2008-06-06 Solid state illumination device
MX2009013727A MX2009013727A (en) 2007-06-18 2008-06-06 Solid state illumination device.
CN2008800205659A CN101689588B (en) 2007-06-18 2008-06-06 Solid state illumination device
KR1020097027044A KR101166625B1 (en) 2007-06-18 2008-06-06 Solid state illumination device
JP2010513322A JP5346931B2 (en) 2007-06-18 2008-06-06 Solid element lighting device
EP08770298A EP2174356A2 (en) 2007-06-18 2008-06-06 Solid state illumination device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US94453807P 2007-06-18 2007-06-18
US60/944,538 2007-06-18
US12/015,474 2008-01-16
US12/015,474 US7942556B2 (en) 2007-06-18 2008-01-16 Solid state illumination device

Publications (3)

Publication Number Publication Date
WO2008157080A2 WO2008157080A2 (en) 2008-12-24
WO2008157080A3 WO2008157080A3 (en) 2009-06-18
WO2008157080A4 true WO2008157080A4 (en) 2009-09-24

Family

ID=40132114

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/066075 WO2008157080A2 (en) 2007-06-18 2008-06-06 Solid state illumination device

Country Status (10)

Country Link
US (4) US7942556B2 (en)
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JP (2) JP5346931B2 (en)
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