WO2009008151A1 - Semiconductor device and method for adjusting characteristics of semiconductor device - Google Patents
Semiconductor device and method for adjusting characteristics of semiconductor device Download PDFInfo
- Publication number
- WO2009008151A1 WO2009008151A1 PCT/JP2008/001798 JP2008001798W WO2009008151A1 WO 2009008151 A1 WO2009008151 A1 WO 2009008151A1 JP 2008001798 W JP2008001798 W JP 2008001798W WO 2009008151 A1 WO2009008151 A1 WO 2009008151A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor device
- recording
- circuit
- process fluctuation
- information
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37224—Inspect wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
A first recording circuit (110) is arranged for recording process fluctuation information which indicates process fluctuation during manufacture. A second recording circuit (140) is arranged for recording fluctuation characteristic data of at least use conditions or external environment (substrate characteristics). A control circuit (130) controls output current performance of an external IF circuit (120) by using process fluctuation information and process fluctuation control information.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007179934 | 2007-07-09 | ||
JP2007-179934 | 2007-07-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009008151A1 true WO2009008151A1 (en) | 2009-01-15 |
Family
ID=40228344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/001798 WO2009008151A1 (en) | 2007-07-09 | 2008-07-04 | Semiconductor device and method for adjusting characteristics of semiconductor device |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2009008151A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009139101A1 (en) * | 2008-05-13 | 2009-11-19 | パナソニック株式会社 | Electronic equipment system and semiconductor integrated circuit controller |
JP2016025157A (en) * | 2014-07-17 | 2016-02-08 | ラピスセミコンダクタ株式会社 | Semiconductor device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0697240A (en) * | 1992-07-09 | 1994-04-08 | Advanced Micro Devices Inc | Device containing integrated circuit on die featured as die-specific information |
JP2003517193A (en) * | 1999-11-18 | 2003-05-20 | ピー・デイ・エフ ソリユーシヨンズ インコーポレイテツド | Product Yield Prediction System and Method Using Device and Near-Process Characteristic Analysis Vehicle |
JP2005032291A (en) * | 2003-07-07 | 2005-02-03 | Renesas Technology Corp | Semiconductor memory device |
JP2007134701A (en) * | 2005-11-08 | 2007-05-31 | Internatl Business Mach Corp <Ibm> | Method and device for memorizing circuit calibration information |
-
2008
- 2008-07-04 WO PCT/JP2008/001798 patent/WO2009008151A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0697240A (en) * | 1992-07-09 | 1994-04-08 | Advanced Micro Devices Inc | Device containing integrated circuit on die featured as die-specific information |
JP2003517193A (en) * | 1999-11-18 | 2003-05-20 | ピー・デイ・エフ ソリユーシヨンズ インコーポレイテツド | Product Yield Prediction System and Method Using Device and Near-Process Characteristic Analysis Vehicle |
JP2005032291A (en) * | 2003-07-07 | 2005-02-03 | Renesas Technology Corp | Semiconductor memory device |
JP2007134701A (en) * | 2005-11-08 | 2007-05-31 | Internatl Business Mach Corp <Ibm> | Method and device for memorizing circuit calibration information |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009139101A1 (en) * | 2008-05-13 | 2009-11-19 | パナソニック株式会社 | Electronic equipment system and semiconductor integrated circuit controller |
US8072832B2 (en) | 2008-05-13 | 2011-12-06 | Panasonic Corporation | Electronic equipment system and semiconductor integrated circuit controller |
JP2016025157A (en) * | 2014-07-17 | 2016-02-08 | ラピスセミコンダクタ株式会社 | Semiconductor device |
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