WO2009012672A1

WO2009012672A1 - Transmitter optical sub-assembly for optical fiber communication

Info

Publication number: WO2009012672A1
Application number: PCT/CN2008/071098
Authority: WO
Inventors: Strong Tain Liao; Yu-Sheng Liao; Hsiu Shing Liao Sun
Original assignee: Aeco Optoelectronics (Shenzhen) Co. Ltd
Priority date: 2007-07-26
Filing date: 2008-05-27
Publication date: 2009-01-29
Also published as: CN201114082Y

Abstract

A Transmitter Optical Sub-Assembly for optical fiber communication includes setting a spot ball at the axis center of the light spot assembly joint in order to form an optic fiber spot assembly joint; said optical fiber spot joint is in cooperation with a side emitting or surface emitting laser diode.

Description

Instructions Light emission submodule for fiber optic communication

Technical field

[1] The present invention relates to a fiber optic communication device, and more particularly to a light emitting sub-module (TOS) for optical fiber communication

AJransmitter Optical Sub-Assembly).

Background technique

[2] In the current fiber-optic system, a laser diode is generally applied as a light source component, as shown in FIG. 1 , which is a sectional view of a package structure of a commonly used light-emitting sub-module for a single-mode fiber. Photodiode

91 is fixed on the surface of the base 9; then, the edge of the fixing cover 92 is correspondingly welded to the groove dug by the base 9, thereby forming a space 93 between the fixed cover 92 and the base 9, and the laser The diode 91 is located in this space 93, and is filled with nitrogen gas in the space 93 to prevent oxidation of the laser diode 91 and interference with light. The fixing cover 92 is disposed through a hole, and the hole is embedded in a focusing ball 95, so that the light emitted by the laser diode 91 can be collectively coupled to the optical core of the fiber ceramic ferrule 8 to become coaxial. Metal packaged laser diode assembly 10. The laser diode assembly 10 is placed inside the metal base 2 and fixed by a metal fitting or fixing glue 3, a fixing sleeve 4 is fixedly coupled with the metal base 2, and a hollow ceramic sleeve 5 is coaxially arranged. Inside the sleeve 4, it is used to access the transmission fiber.

[3] Another common package structure cross-sectional view of a light-emitting sub-module for a multi-mode fiber, as shown in FIG. 2, the laser diode assembly 10 is assembled with a light concentrating group connector ( Metal) 27, adhered between the laser diode assembly 10 and the light concentrating group connector 27 with a sealing adhesive 33, and combined into a light emitting sub-module.

[4] The package structure of the above-mentioned commonly used light-emitting sub-module, because the current of the laser diode 91 is high, the work is easy to generate high heat, and the oxidation resistance must be strengthened, so the outer layer must be fixed with a metal material. 9 2 package, and the fixing cover 92 needs to dig holes and be embedded in the focusing ball 95, and the manufacturing process is complicated; and the metal bonding room must be manually welded, and then the space of the fixing cover 92 is filled with nitrogen to prevent the laser diode. Oxidation, complicated production process; In addition, the materials used in the packaging need to use high-cost raw materials such as precious metals or metals, so the cost is high, the production cannot be rapid, the production capacity cannot be improved rapidly, and improvement is needed to enhance the competitiveness of the products.

[5] The production cost is too high, and after careful research and trial improvement, the invention is finally born, its primary purpose The invention provides an optical transmission sub-module package structure improved by an optical fiber transmission module, which can provide an optical fiber communication light source device with low production cost and high precision transmission with high precision.

Summary of the invention

[6] The technical problem to be solved by the present invention is to construct a light-emitting sub-module for a fiber-optic transmission module, which can provide production cost, in view of the high cost and complicated production process of the above-mentioned conventional light-emitting sub-module. A fiber optic communication light source device that is inexpensive and simple in production process.

[7] The technical solution adopted by the present invention to solve the technical problem thereof is: A light emitting sub-module for optical fiber communication, comprising: a fiber concentrating assembly joint and a laser diode assembly bonded to the optical fiber;

[8] The fiber concentrating assembly joint is a transparent joint, and a shaft of the concentrating light is disposed at an axial center for collecting light emitted by the laser diode assembly;

[9] The laser diode assembly is coupled to the fiber concentrating assembly and the light emitted by the laser diode assembly is coupled to the optical core of the optical fiber by the concentrating sphere.

[10] In the light-emitting sub-module of the present invention, the laser diode assembly may be a side-emitting type laser diode assembly or a surface-emitting type laser diode assembly;

[11] the laser diode assembly includes a light source assembly;

[12] The light source assembly comprises a side-emitting laser diode or a surface-emitting laser diode chip, at least two supports, wire bonding, and epoxy resin packaging;

[13] The side-emitting type laser diode or the surface-emitting type laser diode chip is fixed on one of the brackets, and the side-emitting type laser diode or the surface-emitting type laser diode chip and other places The brackets are connected by the wire bonding; the epoxy resin package wraps the one end of the bracket carrying the side-emitting laser diode or the surface-emitting laser diode chip, and only exposes the bracket The other end.

[14] Alternatively, in the light emitting sub-module of the present invention, the laser diode assembly may be a side-emitting type laser diode assembly or a surface-emitting type laser diode assembly;

[15] The laser diode assembly includes a light source assembly; the light source assembly includes a base, a side-emitting laser diode mounted on the base or a surface-emitting laser diode chip, and sleeved in the a fixing cover on the periphery of the side-emitting type laser diode or the surface-emitting laser diode chip; the edge of the fixing cover is soldered to the groove of the pedestal, and is located at the side-emitting type laser diode or surface A through hole is formed at the position of the laser diode chip; the hole may be embedded in a flat or curved glass or omitted glass. [16] In the light emitting sub-module of the present invention, the laser diode assembly further includes a sleeve disposed outside the light source assembly

[17] In the light-emitting sub-module of the present invention, the optical fiber concentrating assembly joint is an optical fiber concentrating assembly joint made of a transparent plastic material integrally formed.

[18] In the light-emitting sub-module of the present invention, at least one groove is provided in an outer wall of the fiber concentrating assembly.

[19] The material of the casing in the light-emitting sub-module of the present invention is one of nickel stainless steel or plastic.

[20] The optical concentrating joint of the light emitting sub-module of the present invention directly passes the seal with the epoxy resin package

[21] In the optical emission sub-module of the present invention, the front end of the optical fiber concentrating assembly connector forms an accommodating space for accessing one end of the epoxy resin package of the laser diode assembly, and the concentrating ball is disposed at the Included in the space.

[22] In the light-emitting sub-module of the present invention, a metal member for soldering the two is provided between the laser diode assembly and the fiber concentrating assembly.

[23] The light-emitting sub-module embodying the present invention has at least the following beneficial effects: The present invention sets the concentrating sphere at the axis of the light concentrating assembly joint to form a fiber concentrating assembly joint, and the laser diode assembly Combined with fiber optic concentrating unit connectors for cost-saving results, in addition to high-speed transmission equivalent to common technology, and achieving fast and mass-produced performance, reducing the cost of fiber-optic transmission modules and increasing product Competitiveness.

DRAWINGS

[24] Figure 1 is a cross-sectional view of a package structure of a light-emitting sub-module of a commonly used single-mode fiber.

[25] Fig. 2 is a cross-sectional view showing the package structure of a light-emitting submodule of a commonly used multimode fiber.

Figure 3 is a cross-sectional view showing a first embodiment of the light-emitting sub-module of the present invention.

₄ is a cross-sectional view showing a second embodiment of the light-emitting submodule of the present invention.

Figure 5 is a cross-sectional view showing a third embodiment of the light-emitting sub-module of the present invention.

Figure 6 is a cross-sectional view showing a fourth embodiment of the light-emitting sub-module of the present invention.

Figure 7 is a cross-sectional view showing a fifth embodiment of the light-emitting sub-module of the present invention.

[31] [Main component symbol description]

[32] Metal base 2 Fixing glue 3

[33] Fixed sleeve 4 ceramic sleeve 5 [34] Fiber-optic ceramic ferrule 8 pedestal 9

[35] Laser diode assembly 10 Laser diode 91

[36] Fixed cover 92 Focusing ball 95

[37] Encapsulant 33 Fiber concentrator connector (metal) 2Ί

[38] Side-shot or area-type laser diodes 32 lines 40

[39] Case 50 fiber concentrator connector (plastic) 60

[40] Metal member, 0 groove 35

[41] Bracket 110 Laser Diode Assembly 111

[42] Concentrating sphere 311 encapsulant 322

[43] Housing space 315

detailed description

Referring to FIG. 3, it is a first embodiment of the light-emitting sub-module of the present invention, which mainly comprises: a fiber concentrating assembly joint 60, a light source assembly, a metal member 70, and a casing 50. The light source assembly includes a side-emitting or surface-emitting laser diode chip 32, a wire bonding 40, and two or more metal brackets 110. In the present embodiment, a side-emitting type laser diode 32 is used. The top end of one of the metal brackets 110 is combined with the side-emitting laser diode chip 32, and the side-emitting laser diode chip 32 is connected to the other brackets 110 by a wire bonding 40, and then the bracket 110 is loaded with a side-emitting laser. One end of the diode chip 32 is integrally covered with an epoxy resin package 322, and only the other end of the bracket 110 is exposed to connect the current and the signal source. The cover 50 is covered on the periphery of the epoxy resin 322 to form an epoxy resin packaged laser diode assembly 111.

[45] The side-emitting laser diode assembly 111 is mounted on the side of the side-emitting laser diode chip 32 with a fiber concentrating assembly joint 60. The fiber concentrating assembly connector 60 is integrally formed of a transparent plastic material, and the front end is an accommodating space 315 connected to the side-emitting type laser diode assembly 111. A concentrating sphere 311 is disposed in the accommodating space 315, and a gap is formed between the concentrating sphere 311 and the side-emitting type laser diode assembly 111, so that the side-emitting type laser diode assembly 111 emits a light source, and then condenses the light through the optical fiber. The concentrating spheres 311 of the set of joints 60 allow light to be collectively coupled into the optical core of the fiber-optic ceramic ferrule 8. The outer wall of the fiber concentrating assembly connector 60 is provided with one or a plurality of retractable grooves 35 for external fixation, and the optical concentrating assembly connector 60 and the metal member 70 are buried or glued to the casing 50. The joints are welded together to form a complete light-emitting sub-module for fiber-optic communication transmission. [46] As shown in FIG. 4, it is a second embodiment of the light-emitting sub-module of the present invention, which differs from the first embodiment in the connection between the optical fiber concentrating assembly connector 60 and the casing 50. 33 solid glue, other structures are the same as the first embodiment, and are not mentioned.

[47] As shown in FIG. 5, it is a third embodiment of the light-emitting sub-module of the present invention, wherein the laser diode assembly uses a surface-emitting laser diode chip, and the package rubber 322 of the side-emitting laser diode chip 32. The outer casing omits the casing 50, and the joint between the optical fiber concentrating assembly 60 and the side-emitting laser diode chip 32 is modified by the encapsulation 33, as shown in FIG. 5; the other structure is the same as that of the first embodiment. Do not praise.

[48] As shown in FIG. 6, is a fourth embodiment of the light-emitting sub-module of the present invention, wherein the light source assembly uses a package structure similar to that of the light source assembly of FIG. 1, including a base 9, mounted on the base 9 The upper side-emitting type laser diode chip ₉₁ , the fixing cover 92 sleeved on the periphery of the side-emitting diode chip 91, and the casing 50 provided on the periphery of the susceptor 9. The edge of the fixing cover 92 is welded to the groove of the base 9 and the hole is formed at the position of the side-emitting laser diode chip 91. A plane or curved glass can be embedded in the hole, or the hole is not Embedding glass. The focusing sphere in Fig. 1 is omitted, and the concentrating sphere 311 on the fiber concentrating assembly joint 60 is condensed. The seam of the fiber concentrating assembly connector 60 and the casing 50 is modified by the sealing adhesive 33, as shown in FIG. Other structures are basically the same as those of the first embodiment, and are not described.

[49] As shown in FIG. 7, it is a fifth embodiment of the light-emitting sub-module of the present invention, and its structure is basically the same as that of the fourth embodiment, with the difference that: the optical fiber concentrating assembly joint 60 and the metal member 70 are embedded. The shot or glued joint is then joined to the seam of the casing ₅₀ by laser welding, as shown in FIG.

[50] For a better understanding of the present invention, a comparative analysis with commonly used products is as follows:

[51] Disadvantages of commonly used products:

[52] 1. The laser diode package structure of the commonly used light-emitting sub-module is complicated and has a yield problem;

[53] 2. The laser diode package structure of the commonly used light-emitting sub-module, in the production process, a focusing ball 95 needs to be embedded in the fixed cover, and the production process is complicated;

[54] 3. The cost is higher.

[55] 4. Production is slow.

[56] Advantages of the invention:

[57] 1. The laser diode package assembled in the light emission sub-module has a simple structure and a high yield.

[58] 2. The invention can improve the laser diode package structure of the single-mode or multi-mode fiber transmission module. It is easy to concentrate the illuminating source from the fiber concentrating assembly to the optical fiber core.

[59] 3. Packaging materials are inexpensive.

[60] 4. Labor costs are low.

[61] 5, can be mass produced quickly.

[62] The invention designs the concentrating sphere to be disposed at the axis of the light concentrating assembly joint, and combines the side-emitting and surface-emitting laser diode assembly with the fiber concentrating assembly, and not only achieves the change of the packaging mode, but also achieves In the same high-speed transmission, the cost is greatly reduced, and the production speed is also greatly improved. In summary, the case is not only a major innovation in the technical thinking and industry, but also can enhance the above-mentioned multiple functions in a more common way.

Claims

Claim

What is claimed is: 1. A light emitting sub-module for optical fiber communication, comprising: a fiber concentrating assembly joint and a laser diode assembly bonded to an optical fiber;

The fiber concentrating assembly joint is a transparent joint, and a shaft of the concentrating light is disposed at an axial center for collecting light emitted by the laser diode assembly;

The laser diode assembly is coupled to the fiber optic concentrating assembly and the light from the laser diode assembly is coupled to the optical core of the optical fiber by the concentrating sphere.

2. The light emitting sub-module according to claim 1, wherein the laser diode assembly is a side-emitting type laser diode assembly or a surface-emitting laser diode assembly;

The laser diode assembly includes a light source assembly;

The light source assembly includes a side-emitting laser diode or a surface-emitting laser diode chip, at least two brackets, wire bonding, and epoxy resin packaging;

The side-emitting type laser diode or the surface-emitting type laser diode chip is fixed on one of the brackets, and the side-emitting type laser diode or the surface-emitting type laser diode chip and the other of the brackets are Interconnected by the wire bonding; the epoxy resin package encloses one end of the side-mounted laser diode or the surface-emitting laser diode chip, and only exposes the other end of the bracket .

3. The light emitting sub-module according to claim 1, wherein the laser diode assembly is a side-emitting type laser diode assembly or a surface-emitting laser diode assembly;

The laser diode assembly includes a light source assembly; the light source assembly includes a base, a side-emitting laser diode mounted on the base or a surface-emitting laser diode chip, and the side-emitting type a fixing cover on the periphery of the laser diode or the surface-emitting laser diode chip; the edge of the fixing cover is soldered to the recessed surface of the base, and is located in the side-emitting type laser diode or the surface-emitting type lightning A through hole is formed at the position of the diode chip; the hole may be embedded in a flat or curved glass or omitted glass.

The light emitting sub-module according to claim 2 or 3, wherein the laser diode assembly further comprises a casing sleeved around the periphery of the light source assembly.

The optical emission sub-module according to claim 2 or 3, wherein the optical fiber concentrating group The joint is a fiber-optic concentrating set joint made of transparent plastic material.

The light-emitting sub-module according to claim 5, wherein the outer wall of the fiber concentrating assembly is provided with at least one groove.

The light-emitting sub-module according to claim 5, wherein the casing is made of one of nickel stainless steel or plastic.

The optical emission sub-module according to claim 2 or 3, wherein the optical fiber concentrating connector is directly bonded to the epoxy resin package through a package adhesive.

The optical emission sub-module according to claim 2 or 3, wherein the front end of the optical fiber concentrating assembly joint forms an accommodating space for one end of the epoxy resin package that is connected to the laser diode assembly.

The concentrating ball is disposed in the accommodating space.

The light-emitting sub-module according to claim 2 or 3, wherein a metal member for soldering the two is provided between the laser diode assembly and the fiber concentrating assembly.