WO2009016493A3 - Method of preparing a die and use of the so obtained die for etching a substrate - Google Patents

Method of preparing a die and use of the so obtained die for etching a substrate Download PDF

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Publication number
WO2009016493A3
WO2009016493A3 PCT/IB2008/002014 IB2008002014W WO2009016493A3 WO 2009016493 A3 WO2009016493 A3 WO 2009016493A3 IB 2008002014 W IB2008002014 W IB 2008002014W WO 2009016493 A3 WO2009016493 A3 WO 2009016493A3
Authority
WO
WIPO (PCT)
Prior art keywords
die
substrate
etching
preparing
conductive element
Prior art date
Application number
PCT/IB2008/002014
Other languages
French (fr)
Other versions
WO2009016493A2 (en
Inventor
Leonardo Setti
Morgera Alessandro Fraleoni
Ivan Mencarelli
Original Assignee
Univ Bologna Alma Mater
Leonardo Setti
Morgera Alessandro Fraleoni
Ivan Mencarelli
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Bologna Alma Mater, Leonardo Setti, Morgera Alessandro Fraleoni, Ivan Mencarelli filed Critical Univ Bologna Alma Mater
Publication of WO2009016493A2 publication Critical patent/WO2009016493A2/en
Publication of WO2009016493A3 publication Critical patent/WO2009016493A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO

Abstract

Use of a die (1) for etching a substrate (2), the use provide to keep in contact the substrate (2) and the die (1) and put them under an electrical tension; the die (1) comprises a conductive element (3), a layer (9) of an insulating material, which is shaped so as to delimitate on a surface (4) of the conductive element (3) an uncovered area defining a pattern (6), and an electrolyte material (7) firmly placed into the pattern (6) in contact with the surface (4) of the conductive element (3) and presenting a viscosity of at least 50 Pa-s.
PCT/IB2008/002014 2007-08-01 2008-08-01 Method of preparing a die and use of the so obtained die for etching a substrate WO2009016493A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT000544A ITBO20070544A1 (en) 2007-08-01 2007-08-01 METHOD FOR THE PREPARATION OF A MOLD AND USE OF THE MOLD SO 'OBTAINED FOR THE ENGRAVING OF A SUBSTRATE
ITBO2007A000544 2007-08-01

Publications (2)

Publication Number Publication Date
WO2009016493A2 WO2009016493A2 (en) 2009-02-05
WO2009016493A3 true WO2009016493A3 (en) 2009-03-26

Family

ID=40153863

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2008/002014 WO2009016493A2 (en) 2007-08-01 2008-08-01 Method of preparing a die and use of the so obtained die for etching a substrate

Country Status (2)

Country Link
IT (1) ITBO20070544A1 (en)
WO (1) WO2009016493A2 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0595542A1 (en) * 1992-10-21 1994-05-04 Sharp Kabushiki Kaisha A method for forming a transparent conductive film
US5993637A (en) * 1996-12-06 1999-11-30 Canon Kabushiki Kaisha Electrode structure, electrolytic etching process and apparatus
US6051116A (en) * 1995-10-17 2000-04-18 Canon Kabushiki Kaisha Etching apparatus
EP1102522A2 (en) * 1999-11-17 2001-05-23 Ebara Corporation Substrate coated with a conductive layer and manufacturing method thereof
WO2004025356A2 (en) * 2002-09-10 2004-03-25 Sipix Imaging, Inc. Electrochromic or electrodeposition display and novel process for their manufacture

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0595542A1 (en) * 1992-10-21 1994-05-04 Sharp Kabushiki Kaisha A method for forming a transparent conductive film
US6051116A (en) * 1995-10-17 2000-04-18 Canon Kabushiki Kaisha Etching apparatus
US5993637A (en) * 1996-12-06 1999-11-30 Canon Kabushiki Kaisha Electrode structure, electrolytic etching process and apparatus
EP1102522A2 (en) * 1999-11-17 2001-05-23 Ebara Corporation Substrate coated with a conductive layer and manufacturing method thereof
WO2004025356A2 (en) * 2002-09-10 2004-03-25 Sipix Imaging, Inc. Electrochromic or electrodeposition display and novel process for their manufacture

Also Published As

Publication number Publication date
ITBO20070544A1 (en) 2009-02-02
WO2009016493A2 (en) 2009-02-05

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