WO2009029851A3 - Apparatus and methods for predicting a semiconductor parameter across an area of a wafer - Google Patents

Apparatus and methods for predicting a semiconductor parameter across an area of a wafer Download PDF

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Publication number
WO2009029851A3
WO2009029851A3 PCT/US2008/074872 US2008074872W WO2009029851A3 WO 2009029851 A3 WO2009029851 A3 WO 2009029851A3 US 2008074872 W US2008074872 W US 2008074872W WO 2009029851 A3 WO2009029851 A3 WO 2009029851A3
Authority
WO
WIPO (PCT)
Prior art keywords
predicting
methods
wafer
area
parameter values
Prior art date
Application number
PCT/US2008/074872
Other languages
French (fr)
Other versions
WO2009029851A2 (en
Inventor
Pavel Izikson
Original Assignee
Kla Tencor Tech Corp
Pavel Izikson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Tech Corp, Pavel Izikson filed Critical Kla Tencor Tech Corp
Priority to KR1020107006714A priority Critical patent/KR101381304B1/en
Priority to EP08799001.6A priority patent/EP2188832B1/en
Priority to CN200880113786.0A priority patent/CN101939833B/en
Priority to JP2010523167A priority patent/JP5606313B2/en
Publication of WO2009029851A2 publication Critical patent/WO2009029851A2/en
Publication of WO2009029851A3 publication Critical patent/WO2009029851A3/en
Priority to IL204014A priority patent/IL204014A/en

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/0265—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric the criterion being a learning criterion
    • G05B13/027—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric the criterion being a learning criterion using neural networks only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Abstract

Apparatus and methods are provided for predicting a plurality of unknown parameter values (e.g. overlay error or critical dimension) using a plurality of known parameter values. In one embodiment, the method involves training a neural network to predict the plurality of parameter values (114, 700, 800, 900). In other embodiments, the prediction process does not depend on an optical property of a photolithography tool. Such predictions may be used to determine wafer lot disposition (114).
PCT/US2008/074872 2007-08-31 2008-08-29 Apparatus and methods for predicting a semiconductor parameter across an area of a wafer WO2009029851A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020107006714A KR101381304B1 (en) 2007-08-31 2008-08-29 Apparatus and methods for predicting a semiconductor parameter across an area of a wafer
EP08799001.6A EP2188832B1 (en) 2007-08-31 2008-08-29 Apparatus and methods for predicting a semiconductor parameter across an area of the wafer
CN200880113786.0A CN101939833B (en) 2007-08-31 2008-08-29 Apparatus and method for across wafer area prediction semiconductor parameter
JP2010523167A JP5606313B2 (en) 2007-08-31 2008-08-29 Apparatus and method for predicting semiconductor parameters across an area of a wafer
IL204014A IL204014A (en) 2007-08-31 2010-02-17 Apparatus and methods for predicting a semiconductor parameter across an area of a wafer

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US96929107P 2007-08-31 2007-08-31
US60/969,291 2007-08-31
US11/955,262 US7873585B2 (en) 2007-08-31 2007-12-12 Apparatus and methods for predicting a semiconductor parameter across an area of a wafer
US11/955,262 2007-12-12

Publications (2)

Publication Number Publication Date
WO2009029851A2 WO2009029851A2 (en) 2009-03-05
WO2009029851A3 true WO2009029851A3 (en) 2009-04-30

Family

ID=40388146

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/074872 WO2009029851A2 (en) 2007-08-31 2008-08-29 Apparatus and methods for predicting a semiconductor parameter across an area of a wafer

Country Status (7)

Country Link
US (1) US7873585B2 (en)
EP (1) EP2188832B1 (en)
JP (1) JP5606313B2 (en)
KR (1) KR101381304B1 (en)
CN (1) CN101939833B (en)
IL (1) IL204014A (en)
WO (1) WO2009029851A2 (en)

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Also Published As

Publication number Publication date
JP5606313B2 (en) 2014-10-15
IL204014A (en) 2013-08-29
EP2188832B1 (en) 2019-02-27
CN101939833A (en) 2011-01-05
JP2010538474A (en) 2010-12-09
KR20100063095A (en) 2010-06-10
US7873585B2 (en) 2011-01-18
CN101939833B (en) 2017-03-15
US20090063378A1 (en) 2009-03-05
EP2188832A2 (en) 2010-05-26
KR101381304B1 (en) 2014-04-04
WO2009029851A2 (en) 2009-03-05
EP2188832A4 (en) 2012-10-17

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