WO2009037673A3 - An integrated wafer transfer mechanism - Google Patents
An integrated wafer transfer mechanism Download PDFInfo
- Publication number
- WO2009037673A3 WO2009037673A3 PCT/IB2008/053825 IB2008053825W WO2009037673A3 WO 2009037673 A3 WO2009037673 A3 WO 2009037673A3 IB 2008053825 W IB2008053825 W IB 2008053825W WO 2009037673 A3 WO2009037673 A3 WO 2009037673A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- robot
- transfer
- integrated
- moving
- disclosed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/40—Robotics, robotics mapping to robotics vision
- G05B2219/40562—Position and orientation of end effector, teach probe, track them
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010525480A JP5758628B2 (en) | 2007-09-22 | 2008-09-22 | Integrated wafer delivery mechanism |
KR1020107008842A KR101387585B1 (en) | 2007-09-22 | 2008-09-22 | An integrated wafer transfer mechanism |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/859,752 US7976263B2 (en) | 2007-09-22 | 2007-09-22 | Integrated wafer transfer mechanism |
US11/859,752 | 2007-09-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009037673A2 WO2009037673A2 (en) | 2009-03-26 |
WO2009037673A3 true WO2009037673A3 (en) | 2009-09-03 |
Family
ID=40342255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2008/053825 WO2009037673A2 (en) | 2007-09-22 | 2008-09-22 | An integrated wafer transfer mechanism |
Country Status (4)
Country | Link |
---|---|
US (1) | US7976263B2 (en) |
JP (1) | JP5758628B2 (en) |
KR (1) | KR101387585B1 (en) |
WO (1) | WO2009037673A2 (en) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008173744A (en) * | 2007-01-22 | 2008-07-31 | Tokyo Electron Ltd | Conveying position alignment method for conveying system |
US8277165B2 (en) * | 2007-09-22 | 2012-10-02 | Dynamic Micro System Semiconductor Equipment GmbH | Transfer mechanism with multiple wafer handling capability |
US8757026B2 (en) | 2008-04-15 | 2014-06-24 | Dynamic Micro Systems, Semiconductor Equipment Gmbh | Clean transfer robot |
TWI368593B (en) * | 2009-02-23 | 2012-07-21 | Inotera Memories Inc | A system and a method for automatically product distributing |
WO2010146561A1 (en) * | 2009-06-17 | 2010-12-23 | Dynamic Micro Systems | Integrated cleaner and dryer |
JP2011003864A (en) * | 2009-06-22 | 2011-01-06 | Tokyo Electron Ltd | Substrate carrier, method of carrying substrate, coating, developing device and storage medium |
US8580585B2 (en) * | 2009-12-18 | 2013-11-12 | Micrel, Inc. | Method and system for controlled isotropic etching on a plurality of etch systems |
KR101329303B1 (en) * | 2010-06-17 | 2013-11-20 | 세메스 주식회사 | Substrates processing apparatus for loading/unloading of substrates |
DE102011076742B4 (en) * | 2011-05-30 | 2017-02-09 | Siltronic Ag | A method for depositing a semiconductor wafer on a susceptor with a predetermined angular orientation |
US9299598B2 (en) * | 2013-12-23 | 2016-03-29 | Lam Research Corp. | Robot with integrated aligner |
EP3093879B1 (en) * | 2015-05-13 | 2021-07-07 | Integrated Dynamics Engineering GmbH | End effector of a wafer handling system and wafer handling system |
DE102016118462A1 (en) * | 2016-09-29 | 2018-03-29 | Asys Automatic Systems Gmbh & Co. Kg | Handling device for substrates, in particular semiconductor substrates |
ES2774394T3 (en) * | 2016-10-25 | 2020-07-20 | Siemens Ag | Procedure to optimize movement profiles, procedure to provide movement profiles, control device, installation and software product |
EP4272909A3 (en) * | 2016-11-16 | 2024-01-17 | Jabil Inc. | Apparatus, system and method for an air bearing stage for component or devices |
KR102166343B1 (en) * | 2018-06-14 | 2020-10-15 | 세메스 주식회사 | Stoker |
US10957571B2 (en) * | 2018-08-30 | 2021-03-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and methods for determining wafer characters |
JP7175735B2 (en) * | 2018-12-11 | 2022-11-21 | 平田機工株式会社 | Substrate carrier |
SG11202108522TA (en) | 2019-02-08 | 2021-09-29 | Yaskawa America Inc | Through-beam auto teaching |
US11139190B2 (en) | 2019-04-23 | 2021-10-05 | Applied Materials, Inc. | Equipment front end modules including multiple aligners, assemblies, and methods |
CN110085534A (en) * | 2019-05-05 | 2019-08-02 | 北京华卓精科科技股份有限公司 | A kind of wafer alignment method and its prealignment mechanism, handling machinery arm |
US11276593B2 (en) | 2019-07-22 | 2022-03-15 | Rorze Automation, Inc. | Systems and methods for horizontal wafer packaging |
JP7374683B2 (en) * | 2019-09-19 | 2023-11-07 | 株式会社Screenホールディングス | Substrate transfer device and hand position correction method for the substrate transfer device |
CN110813676A (en) * | 2019-12-02 | 2020-02-21 | 湖南宗辉门窗有限公司 | Paint surface drying device is used in aluminum alloy door and window production |
US11551958B2 (en) | 2020-05-22 | 2023-01-10 | Taiwan Semiconductor Manufacturing Company Limited | Apparatus and method for transferring wafers |
US11521883B2 (en) * | 2021-03-03 | 2022-12-06 | Nanya Technology Corporation | Load lock device having optical measuring device for acquiring distance |
EP4092722B1 (en) * | 2021-05-21 | 2023-04-12 | Semsysco GmbH | Handling system for fetching a substrate |
CN114165998A (en) * | 2021-10-29 | 2022-03-11 | 广东旺盈环保包装实业有限公司 | Packing box drying equipment for improving drying uniformity |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06124995A (en) * | 1992-10-13 | 1994-05-06 | Anelva Corp | Wafer conveying robot |
WO1999017244A1 (en) * | 1997-09-30 | 1999-04-08 | Brooks Automation Inc. | Substrate transport apparatus |
WO1999052142A1 (en) * | 1998-04-04 | 1999-10-14 | Tokyo Electron Limited | Transfer device for body to be treated |
WO2001040086A1 (en) * | 1999-11-30 | 2001-06-07 | Asyst Technologies, Inc. | Wafer orienting and reading mechanism |
WO2003021645A2 (en) * | 2001-08-31 | 2003-03-13 | Asyst Technologies, Inc. | Wafer engine |
WO2004077531A1 (en) * | 2003-02-25 | 2004-09-10 | Technische Universität München | Device for gripping, retaining and orienting contact-sensitive flat components involving little contact therewith |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2926592B2 (en) * | 1988-02-12 | 1999-07-28 | 東京エレクトロン株式会社 | Substrate processing equipment |
JPH05109868A (en) * | 1991-10-21 | 1993-04-30 | Fujitsu Ltd | Semiconductor manufacturing apparatus |
JPH0986655A (en) * | 1995-09-20 | 1997-03-31 | Olympus Optical Co Ltd | Sample conveyer |
US6126381A (en) * | 1997-04-01 | 2000-10-03 | Kensington Laboratories, Inc. | Unitary specimen prealigner and continuously rotatable four link robot arm mechanism |
JP3988805B2 (en) * | 1997-10-02 | 2007-10-10 | 大日本スクリーン製造株式会社 | Substrate transfer method and apparatus |
US7101510B2 (en) * | 1999-02-16 | 2006-09-05 | Applera Corporation | Matrix storage and dispensing system |
JP2002217268A (en) * | 2001-01-19 | 2002-08-02 | Yaskawa Electric Corp | Method and device for carrying substrate |
US6752585B2 (en) * | 2001-06-13 | 2004-06-22 | Applied Materials Inc | Method and apparatus for transferring a semiconductor substrate |
JP4283559B2 (en) | 2003-02-24 | 2009-06-24 | 東京エレクトロン株式会社 | Conveying apparatus, vacuum processing apparatus, and atmospheric pressure conveying apparatus |
US7607879B2 (en) * | 2004-06-15 | 2009-10-27 | Brooks Automation, Inc. | Substrate processing apparatus with removable component module |
US7578650B2 (en) * | 2004-07-29 | 2009-08-25 | Kla-Tencor Technologies Corporation | Quick swap load port |
US7771151B2 (en) * | 2005-05-16 | 2010-08-10 | Muratec Automation Co., Ltd. | Interface between conveyor and semiconductor process tool load port |
-
2007
- 2007-09-22 US US11/859,752 patent/US7976263B2/en active Active
-
2008
- 2008-09-22 KR KR1020107008842A patent/KR101387585B1/en active IP Right Grant
- 2008-09-22 WO PCT/IB2008/053825 patent/WO2009037673A2/en active Application Filing
- 2008-09-22 JP JP2010525480A patent/JP5758628B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06124995A (en) * | 1992-10-13 | 1994-05-06 | Anelva Corp | Wafer conveying robot |
WO1999017244A1 (en) * | 1997-09-30 | 1999-04-08 | Brooks Automation Inc. | Substrate transport apparatus |
WO1999052142A1 (en) * | 1998-04-04 | 1999-10-14 | Tokyo Electron Limited | Transfer device for body to be treated |
WO2001040086A1 (en) * | 1999-11-30 | 2001-06-07 | Asyst Technologies, Inc. | Wafer orienting and reading mechanism |
WO2003021645A2 (en) * | 2001-08-31 | 2003-03-13 | Asyst Technologies, Inc. | Wafer engine |
WO2004077531A1 (en) * | 2003-02-25 | 2004-09-10 | Technische Universität München | Device for gripping, retaining and orienting contact-sensitive flat components involving little contact therewith |
Also Published As
Publication number | Publication date |
---|---|
US7976263B2 (en) | 2011-07-12 |
KR101387585B1 (en) | 2014-04-24 |
JP2010541200A (en) | 2010-12-24 |
WO2009037673A2 (en) | 2009-03-26 |
US20090082895A1 (en) | 2009-03-26 |
KR20100085066A (en) | 2010-07-28 |
JP5758628B2 (en) | 2015-08-05 |
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