WO2009055767A3 - Micromachined piezoelectric ultrasound transducer arrays - Google Patents

Micromachined piezoelectric ultrasound transducer arrays Download PDF

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Publication number
WO2009055767A3
WO2009055767A3 PCT/US2008/081278 US2008081278W WO2009055767A3 WO 2009055767 A3 WO2009055767 A3 WO 2009055767A3 US 2008081278 W US2008081278 W US 2008081278W WO 2009055767 A3 WO2009055767 A3 WO 2009055767A3
Authority
WO
WIPO (PCT)
Prior art keywords
ultrasound transducer
twvs
transducer arrays
electrical impedance
transducers
Prior art date
Application number
PCT/US2008/081278
Other languages
French (fr)
Other versions
WO2009055767A2 (en
Inventor
Xiaoning Jiang
Wesley S. Hackenberger
Kevin A. Snook
Original Assignee
Trs Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trs Technologies, Inc. filed Critical Trs Technologies, Inc.
Publication of WO2009055767A2 publication Critical patent/WO2009055767A2/en
Publication of WO2009055767A3 publication Critical patent/WO2009055767A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Abstract

A piezoelectric composite micromachined ultrasound transducer including single and multilayer 1-D and 2-D arrays having through-wafer-vias (TWVs) that significantly decreased electrical impedance per element, and hence the improved electrical impedance matching to T/R electronics and improved signal to noise ratio is disclosed. The TWVs facilitate integrated interconnection in single element transducers (positive and negative contact on the same side) and array transducers (contact pads array for integration with T/R switches and/or pre-amplifier circuits).
PCT/US2008/081278 2007-10-26 2008-10-27 Micromachined piezoelectric ultrasound transducer arrays WO2009055767A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US58907P 2007-10-26 2007-10-26
US61/000,589 2007-10-26
US12/258,615 2008-10-27
US12/258,615 US8008842B2 (en) 2007-10-26 2008-10-27 Micromachined piezoelectric ultrasound transducer arrays

Publications (2)

Publication Number Publication Date
WO2009055767A2 WO2009055767A2 (en) 2009-04-30
WO2009055767A3 true WO2009055767A3 (en) 2010-10-14

Family

ID=40580438

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/081278 WO2009055767A2 (en) 2007-10-26 2008-10-27 Micromachined piezoelectric ultrasound transducer arrays

Country Status (2)

Country Link
US (3) US8008842B2 (en)
WO (1) WO2009055767A2 (en)

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Also Published As

Publication number Publication date
US20110215677A1 (en) 2011-09-08
US20090108708A1 (en) 2009-04-30
US8148877B2 (en) 2012-04-03
WO2009055767A2 (en) 2009-04-30
US8008842B2 (en) 2011-08-30
US20110191997A1 (en) 2011-08-11

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