WO2009066183A3 - Tightly-coupled pcb gnss circuit and manufacturing method - Google Patents

Tightly-coupled pcb gnss circuit and manufacturing method Download PDF

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Publication number
WO2009066183A3
WO2009066183A3 PCT/IB2008/003796 IB2008003796W WO2009066183A3 WO 2009066183 A3 WO2009066183 A3 WO 2009066183A3 IB 2008003796 W IB2008003796 W IB 2008003796W WO 2009066183 A3 WO2009066183 A3 WO 2009066183A3
Authority
WO
WIPO (PCT)
Prior art keywords
pcb
providing
tightly
manufacturing
layers
Prior art date
Application number
PCT/IB2008/003796
Other languages
French (fr)
Other versions
WO2009066183A2 (en
Inventor
Andrew J. Jakab
Nicholas J. Boorman
Original Assignee
Hemisphere Gps Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hemisphere Gps Llc filed Critical Hemisphere Gps Llc
Publication of WO2009066183A2 publication Critical patent/WO2009066183A2/en
Publication of WO2009066183A3 publication Critical patent/WO2009066183A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component

Abstract

A method and apparatus for tightly coupling a printed circuit board (PCB), which method comprises the steps of providing a PCB with multiple conductive layers, separating said conductive layers with insulating layers, providing a positive reference layer, providing a ground plane comprising a grounded reference layer, providing a signal layer, photoetching the signal layer to define a circuit, providing electrical components, connecting each electrical component to one or more layers, forming a decoupling line in said PCB; and forming an electrical isolation island m said PCB with said decoupling line.
PCT/IB2008/003796 2007-09-27 2008-09-28 Tightly-coupled pcb gnss circuit and manufacturing method WO2009066183A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US97572707P 2007-09-27 2007-09-27
US60/975,727 2007-09-27
US12/239,312 US7948769B2 (en) 2007-09-27 2008-09-26 Tightly-coupled PCB GNSS circuit and manufacturing method
US12/239,312 2008-09-26

Publications (2)

Publication Number Publication Date
WO2009066183A2 WO2009066183A2 (en) 2009-05-28
WO2009066183A3 true WO2009066183A3 (en) 2011-04-28

Family

ID=40507625

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2008/003796 WO2009066183A2 (en) 2007-09-27 2008-09-28 Tightly-coupled pcb gnss circuit and manufacturing method

Country Status (2)

Country Link
US (1) US7948769B2 (en)
WO (1) WO2009066183A2 (en)

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