WO2009104384A3 - Mounting condition determining method, mounting condition determining apparatus, component mounting method, mounter, and program - Google Patents

Mounting condition determining method, mounting condition determining apparatus, component mounting method, mounter, and program Download PDF

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Publication number
WO2009104384A3
WO2009104384A3 PCT/JP2009/000653 JP2009000653W WO2009104384A3 WO 2009104384 A3 WO2009104384 A3 WO 2009104384A3 JP 2009000653 W JP2009000653 W JP 2009000653W WO 2009104384 A3 WO2009104384 A3 WO 2009104384A3
Authority
WO
WIPO (PCT)
Prior art keywords
mounter
condition determining
mounting condition
mounting
program
Prior art date
Application number
PCT/JP2009/000653
Other languages
French (fr)
Other versions
WO2009104384A2 (en
Inventor
Yasuhiro Maenishi
Yoshiaki Awata
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Publication of WO2009104384A2 publication Critical patent/WO2009104384A2/en
Publication of WO2009104384A3 publication Critical patent/WO2009104384A3/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

To ensure a high operating rate for every mounter without suspending the mounter even during change of elements, and to determine a component mounting condition that achieves enhanced area productivity. That is, a type-A board and a type-B board are respectively carried on the R-lane and F-lane. In addition, the component mounting condition is determined such that a mounter (MC1) and a mounter (MC2) mount components only on the type-A board, and a mounter (MC3) and a mounter (MC4) mount components only on the type-B board.
PCT/JP2009/000653 2008-02-21 2009-02-18 Mounting condition determining method, mounting condition determining apparatus, component mounting method, mounter, and program WO2009104384A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008040532 2008-02-21
JP2008-040532 2008-02-21
JP2008-045964 2008-02-27
JP2008045964 2008-02-27

Publications (2)

Publication Number Publication Date
WO2009104384A2 WO2009104384A2 (en) 2009-08-27
WO2009104384A3 true WO2009104384A3 (en) 2009-10-15

Family

ID=40847830

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/000653 WO2009104384A2 (en) 2008-02-21 2009-02-18 Mounting condition determining method, mounting condition determining apparatus, component mounting method, mounter, and program

Country Status (1)

Country Link
WO (1) WO2009104384A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106465576B (en) 2014-06-17 2020-04-03 株式会社富士 Electronic component mounting method and electronic component mounting system
CN107852853B (en) * 2015-07-29 2020-04-14 株式会社富士 Component mounting machine

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06252546A (en) * 1993-02-23 1994-09-09 Matsushita Electric Ind Co Ltd Mounting-substrate production system
US5692292A (en) * 1994-09-02 1997-12-02 Fuji Machine Mfg. Co., Ltd. Transfer type circuit board fabricating system
JP2004128245A (en) * 2002-10-03 2004-04-22 Matsushita Electric Ind Co Ltd Electronic part mounting equipment and electronic part mounting method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06252546A (en) * 1993-02-23 1994-09-09 Matsushita Electric Ind Co Ltd Mounting-substrate production system
US5692292A (en) * 1994-09-02 1997-12-02 Fuji Machine Mfg. Co., Ltd. Transfer type circuit board fabricating system
JP2004128245A (en) * 2002-10-03 2004-04-22 Matsushita Electric Ind Co Ltd Electronic part mounting equipment and electronic part mounting method

Also Published As

Publication number Publication date
WO2009104384A2 (en) 2009-08-27

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