WO2009121628A9 - Optical inspection system and method - Google Patents

Optical inspection system and method Download PDF

Info

Publication number
WO2009121628A9
WO2009121628A9 PCT/EP2009/002482 EP2009002482W WO2009121628A9 WO 2009121628 A9 WO2009121628 A9 WO 2009121628A9 EP 2009002482 W EP2009002482 W EP 2009002482W WO 2009121628 A9 WO2009121628 A9 WO 2009121628A9
Authority
WO
WIPO (PCT)
Prior art keywords
inspection system
optical inspection
optical
inspection
Prior art date
Application number
PCT/EP2009/002482
Other languages
French (fr)
Other versions
WO2009121628A2 (en
Inventor
Lars Markwort
Rajeshwar Chhibber
Klaus Eckerl
Norbert Harendt
Original Assignee
Nanda Technologies Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanda Technologies Gmbh filed Critical Nanda Technologies Gmbh
Priority to KR1020107022152A priority Critical patent/KR101697240B1/en
Priority to CN2009801160931A priority patent/CN102016554B/en
Priority to DE112009000832T priority patent/DE112009000832T5/en
Priority to JP2011502299A priority patent/JP5749641B2/en
Publication of WO2009121628A2 publication Critical patent/WO2009121628A2/en
Publication of WO2009121628A9 publication Critical patent/WO2009121628A9/en
Priority to US12/715,246 priority patent/US8072591B2/en
Priority to US12/916,336 priority patent/US8102521B2/en
Priority to US12/916,315 priority patent/US8345232B2/en
Priority to US13/277,986 priority patent/US8368881B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
PCT/EP2009/002482 2008-04-04 2009-04-03 Optical inspection system and method WO2009121628A2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
KR1020107022152A KR101697240B1 (en) 2008-04-04 2009-04-03 Optical Inspection System and Method
CN2009801160931A CN102016554B (en) 2008-04-04 2009-04-03 Optical inspection system and method
DE112009000832T DE112009000832T5 (en) 2008-04-04 2009-04-03 System and method for optical inspection
JP2011502299A JP5749641B2 (en) 2008-04-04 2009-04-03 Optical inspection system and method
US12/715,246 US8072591B2 (en) 2008-04-04 2010-03-01 Optical inspection system and method
US12/916,336 US8102521B2 (en) 2008-04-04 2010-10-29 Optical inspection system and method
US12/916,315 US8345232B2 (en) 2008-04-04 2010-10-29 Optical inspection system and method
US13/277,986 US8368881B2 (en) 2008-04-04 2011-10-20 Optical inspection system and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US6494908P 2008-04-04 2008-04-04
US61/064,949 2008-04-04

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/715,246 Continuation US8072591B2 (en) 2008-04-04 2010-03-01 Optical inspection system and method

Publications (2)

Publication Number Publication Date
WO2009121628A2 WO2009121628A2 (en) 2009-10-08
WO2009121628A9 true WO2009121628A9 (en) 2009-11-26

Family

ID=41059655

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/002482 WO2009121628A2 (en) 2008-04-04 2009-04-03 Optical inspection system and method

Country Status (7)

Country Link
US (4) US8072591B2 (en)
JP (1) JP5749641B2 (en)
KR (1) KR101697240B1 (en)
CN (1) CN102016554B (en)
DE (1) DE112009000832T5 (en)
TW (1) TWI479583B (en)
WO (1) WO2009121628A2 (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5749641B2 (en) 2008-04-04 2015-07-15 ナンダ テヒノロギーズ ゲーエムベーハー Optical inspection system and method
CN101963741B (en) * 2009-07-23 2013-10-09 鸿富锦精密工业（深圳）有限公司 Image pickup module and portable electronic device adopting same
EP2339331A1 (en) 2009-12-23 2011-06-29 Nanda Technologies GmbH Inspection and positioning systems and methods
JP2011203245A (en) * 2010-03-02 2011-10-13 You-Na Tech Corp System and method for inspecting surface of semiconductor wafer
EP2378548A1 (en) 2010-04-19 2011-10-19 Nanda Technologies GmbH Methods of processing and inspecting semiconductor substrates
EP2381246A1 (en) * 2010-04-26 2011-10-26 Becton Dickinson France Device, kit and method for inspection of an article
CN102269858A (en) * 2010-06-02 2011-12-07 北京智朗芯光科技有限公司 Automatic focusing system and automatic focusing method
WO2012025221A1 (en) 2010-08-24 2012-03-01 Nanda Technologies Gmbh Methods and systems for inspecting bonded wafers
US8501503B2 (en) 2011-04-28 2013-08-06 Nanda Technologies Gmbh Methods of inspecting and manufacturing semiconductor wafers
DE102011051355A1 (en) 2011-06-27 2012-12-27 Hseb Dresden Gmbh inspection device
US9213156B2 (en) * 2011-08-17 2015-12-15 Source Photonics, Inc. Optical receiver with reduced cavity size and methods of making and using the same
US20140330116A1 (en) * 2011-11-08 2014-11-06 The Trustees of Columbia University in the Ciyt of New York Systems and methods for simultaneous multi-directional imaging for capturing tomographic data
US10088413B2 (en) 2011-11-21 2018-10-02 Kla-Tencor Corporation Spectral matching based calibration
WO2013120091A1 (en) * 2012-02-10 2013-08-15 The Board Of Trustees Of The Leland Stanford Junior University Optical device
TWI460394B (en) * 2012-07-20 2014-11-11 Test Research Inc Three-dimensional image measuring apparatus
US9279663B2 (en) * 2012-07-30 2016-03-08 Kla-Tencor Corporation Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrate
DE102012111835A1 (en) 2012-12-05 2014-06-05 Hseb Dresden Gmbh inspection device
US9810892B2 (en) 2013-03-15 2017-11-07 The Board Of Trustees Of The Leland Stanford Junior University Optical lens fabrication
US9696264B2 (en) * 2013-04-03 2017-07-04 Kla-Tencor Corporation Apparatus and methods for determining defect depths in vertical stack memory
US9176070B2 (en) 2014-04-07 2015-11-03 Hseb Dresden Gmbh Inspection assembly
US20170167986A1 (en) * 2014-04-25 2017-06-15 Gdt, Inc. Cosmetic Evaluation Box for Used Electronics
JP6670561B2 (en) * 2014-07-17 2020-03-25 オルボテック リミテッド Seamless fusion of telecentric brightfield and annular darkfield illumination
US9377596B2 (en) * 2014-07-22 2016-06-28 Unimicron Technology Corp. Optical-electro circuit board, optical component and manufacturing method thereof
WO2016015734A1 (en) * 2014-08-01 2016-02-04 Dfm A/S A scatterometer apparatus
KR101741659B1 (en) 2014-11-03 2017-05-31 주식회사 엠티엠 Light source apparatus for camera module alien substances inspection
IL243167B (en) * 2014-12-18 2021-02-28 Gordon Noam Separable multiple illumination sources in optical inspection
IL243166B2 (en) * 2014-12-18 2023-10-01 Camtek Imaging Tech Suzhou Co Ltd Modification of the optical properties of line-scan illumination depending on the light angle along the line axis
JP6024056B2 (en) * 2015-01-13 2016-11-09 新一 土坂 Spherical inspection device
US10309907B2 (en) * 2015-03-04 2019-06-04 Kla-Tencor Corporation All reflective wafer defect inspection and review systems and methods
EP3411694A4 (en) * 2016-02-03 2019-09-04 Kla-Tencor Corporation Wafer defect inspection and review systems
CN107533014A (en) * 2016-04-12 2018-01-02 新日铁住金株式会社 Inspected body camera device, inspected body image capture method, surface examining device and surface inspecting method
KR102233196B1 (en) * 2017-01-31 2021-03-26 제이에프이 스틸 가부시키가이샤 Steel shape measurement device and steel shape correction device
US10422984B2 (en) * 2017-05-12 2019-09-24 Applied Materials, Inc. Flexible mode scanning optical microscopy and inspection system
US11777603B2 (en) * 2019-01-16 2023-10-03 X Development Llc High magnification afocal telescope with high index field curvature corrector
JP7175214B2 (en) * 2019-02-13 2022-11-18 リコーインダストリアルソリューションズ株式会社 inspection equipment
US11704887B2 (en) 2019-09-16 2023-07-18 Assurant, Inc. System, method, apparatus, and computer program product for utilizing machine learning to process an image of a mobile device to determine a mobile device integrity status

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2313460A (en) * 1940-01-23 1943-03-09 Kapella Ltd Compound microscope and lens system therefor
US2398276A (en) * 1945-02-05 1946-04-09 Eastman Kodak Co Variable power telescope
US2441036A (en) * 1945-02-14 1948-05-04 Eastman Kodak Co Lens system for telescopes
US2600805A (en) * 1951-02-08 1952-06-17 Eastman Kodak Co Telecentric objective of the reversed telephoto type
DE1012763B (en) * 1954-07-21 1957-07-25 Leitz Ernst Gmbh Microscope objective for overview images
US2952180A (en) 1958-06-02 1960-09-13 Eastman Kodak Co Visual optical instrument having a combined reticle and field flattening element
US3176563A (en) * 1962-02-02 1965-04-06 Better Packages Inc Tape serving machine
US4009945A (en) * 1963-09-05 1977-03-01 Walter Klein Microscope objective
US3437395A (en) * 1965-09-03 1969-04-08 Bausch & Lomb Optical system for inverted microscope
JPH07119888B2 (en) * 1987-05-08 1995-12-20 株式会社ニコン Re-imaging optics
US5058982A (en) * 1989-06-21 1991-10-22 Orbot Systems Ltd. Illumination system and inspection apparatus including same
JPH0816765B2 (en) * 1989-07-10 1996-02-21 オリンパス光学工業株式会社 Variable viewfinder optical system
JPH03249550A (en) * 1990-02-28 1991-11-07 Mitsubishi Electric Corp Pattern defect inspecting device
JPH0493911A (en) * 1990-08-06 1992-03-26 Nikon Corp Optical system for infinite system image formation
JPH07306150A (en) * 1994-05-10 1995-11-21 Kobe Steel Ltd Surface inspecting device using reversely reflecting screen
JP3386269B2 (en) * 1995-01-25 2003-03-17 株式会社ニュークリエイション Optical inspection equipment
US5804386A (en) * 1997-01-15 1998-09-08 Incyte Pharmaceuticals, Inc. Sets of labeled energy transfer fluorescent primers and their use in multi component analysis
JP4527205B2 (en) * 1997-03-31 2010-08-18 リアル・タイム・メトロジー，インコーポレーテッド Optical inspection module and method for detecting particles and defects on a substrate in an integrated process tool
JP3169857B2 (en) * 1997-05-20 2001-05-28 島田理化工業株式会社 Foreign object detection method and device
JPH10333033A (en) * 1997-06-02 1998-12-18 Olympus Optical Co Ltd Real image type variable power finder
JP3664593B2 (en) * 1998-11-06 2005-06-29 信越半導体株式会社 Semiconductor wafer and manufacturing method thereof
US6999183B2 (en) * 1998-11-18 2006-02-14 Kla-Tencor Corporation Detection system for nanometer scale topographic measurements of reflective surfaces
DE19903486C2 (en) * 1999-01-29 2003-03-06 Leica Microsystems Method and device for the optical examination of structured surfaces of objects
JP2000338048A (en) * 1999-05-31 2000-12-08 Hamamatsu Photonics Kk Surface inspecting method and apparatus
US6853446B1 (en) * 1999-08-16 2005-02-08 Applied Materials, Inc. Variable angle illumination wafer inspection system
JP5288672B2 (en) 2001-07-11 2013-09-11 株式会社ニコン Surface defect inspection equipment
US7130039B2 (en) * 2002-04-18 2006-10-31 Kla-Tencor Technologies Corporation Simultaneous multi-spot inspection and imaging
US7312432B2 (en) * 2002-07-08 2007-12-25 Dmetrix, Inc. Single axis illumination for multi-axis imaging system
US6788404B2 (en) * 2002-07-17 2004-09-07 Kla-Tencor Technologies Corporation Inspection system with multiple illumination sources
DE10239548A1 (en) * 2002-08-23 2004-03-04 Leica Microsystems Semiconductor Gmbh Device and method for inspecting an object
US20040207836A1 (en) * 2002-09-27 2004-10-21 Rajeshwar Chhibber High dynamic range optical inspection system and method
JP2004163240A (en) * 2002-11-13 2004-06-10 Silicon Technology Co Ltd Surface evaluation device
US6870949B2 (en) 2003-02-26 2005-03-22 Electro Scientific Industries Coaxial narrow angle dark field lighting
US7130036B1 (en) * 2003-09-16 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for inspection of an entire wafer surface using multiple detection channels
US20050146719A1 (en) 2003-09-26 2005-07-07 Rajeshwar Chhibber Method and apparatus for illuminating a substrate during inspection
US7351980B2 (en) * 2005-03-31 2008-04-01 Kla-Tencor Technologies Corp. All-reflective optical systems for broadband wafer inspection
US7345825B2 (en) * 2005-06-30 2008-03-18 Kla-Tencor Technologies Corporation Beam delivery system for laser dark-field illumination in a catadioptric optical system
US7898524B2 (en) * 2005-06-30 2011-03-01 Logitech Europe S.A. Optical displacement detection over varied surfaces
JP2009500631A (en) * 2005-07-08 2009-01-08 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド Optimal use and performance of optical systems implemented with dark field illumination on the telecentric axis
JP4723362B2 (en) * 2005-11-29 2011-07-13 株式会社日立ハイテクノロジーズ Optical inspection apparatus and method
JP4949928B2 (en) 2006-06-20 2012-06-13 Ｈｏｙａ株式会社 Pattern defect inspection method, pattern defect inspection apparatus, photomask product manufacturing method, and display device substrate manufacturing method
DE102006042117A1 (en) 2006-09-07 2008-03-27 Dr. Schenk Gmbh Industriemesstechnik Surface defect i.e. micro scratch, detecting device, for e.g. thin film transistor-flat screen, has enlargement unit arranged between surface and illuminator, which is oriented transverse and perpendicular to feed direction of substrate
CN101021490B (en) * 2007-03-12 2012-11-14 3i系统公司 Automatic detecting system and method for planar substrate
US7782452B2 (en) * 2007-08-31 2010-08-24 Kla-Tencor Technologies Corp. Systems and method for simultaneously inspecting a specimen with two distinct channels
JP5749641B2 (en) 2008-04-04 2015-07-15 ナンダ テヒノロギーズ ゲーエムベーハー Optical inspection system and method

Also Published As

Publication number Publication date
US20110043796A1 (en) 2011-02-24
US8102521B2 (en) 2012-01-24
US20100231902A1 (en) 2010-09-16
KR20110000560A (en) 2011-01-03
DE112009000832T5 (en) 2011-07-28
JP2011516844A (en) 2011-05-26
US8345232B2 (en) 2013-01-01
US8072591B2 (en) 2011-12-06
TWI479583B (en) 2015-04-01
US8368881B2 (en) 2013-02-05
CN102016554A (en) 2011-04-13
US20120133760A1 (en) 2012-05-31
JP5749641B2 (en) 2015-07-15
TW200952102A (en) 2009-12-16
US20110043798A1 (en) 2011-02-24
WO2009121628A2 (en) 2009-10-08
KR101697240B1 (en) 2017-01-17
CN102016554B (en) 2013-01-30

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