WO2009154952A3 - Systems and methods for determining two or more characteristics of a wafer - Google Patents

Systems and methods for determining two or more characteristics of a wafer Download PDF

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Publication number
WO2009154952A3
WO2009154952A3 PCT/US2009/045124 US2009045124W WO2009154952A3 WO 2009154952 A3 WO2009154952 A3 WO 2009154952A3 US 2009045124 W US2009045124 W US 2009045124W WO 2009154952 A3 WO2009154952 A3 WO 2009154952A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
systems
determining
methods
characteristic
Prior art date
Application number
PCT/US2009/045124
Other languages
French (fr)
Other versions
WO2009154952A2 (en
Inventor
Stephen Biellak
Daniel Kavaldjiev
Original Assignee
Kla-Tencor Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla-Tencor Corporation filed Critical Kla-Tencor Corporation
Priority to KR1020107029451A priority Critical patent/KR101506894B1/en
Publication of WO2009154952A2 publication Critical patent/WO2009154952A2/en
Publication of WO2009154952A3 publication Critical patent/WO2009154952A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Systems and methods for determining two or more characteristics of a wafer are provided. The two or more characteristics include a characteristic of the wafer that is spatially localized in at least one dimension and a characteristic of the wafer that is not spatially localized in two dimensions.
PCT/US2009/045124 2008-05-28 2009-05-26 Systems and methods for determining two or more characteristics of a wafer WO2009154952A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020107029451A KR101506894B1 (en) 2008-05-28 2009-05-26 Systems and methods for determining two or more characteristics of a wafer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/128,426 2008-05-28
US12/128,426 US7912658B2 (en) 2008-05-28 2008-05-28 Systems and methods for determining two or more characteristics of a wafer

Publications (2)

Publication Number Publication Date
WO2009154952A2 WO2009154952A2 (en) 2009-12-23
WO2009154952A3 true WO2009154952A3 (en) 2010-02-25

Family

ID=41380823

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/045124 WO2009154952A2 (en) 2008-05-28 2009-05-26 Systems and methods for determining two or more characteristics of a wafer

Country Status (3)

Country Link
US (1) US7912658B2 (en)
KR (1) KR101506894B1 (en)
WO (1) WO2009154952A2 (en)

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US8269960B2 (en) * 2008-07-24 2012-09-18 Kla-Tencor Corp. Computer-implemented methods for inspecting and/or classifying a wafer
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US10324046B1 (en) * 2009-06-03 2019-06-18 Kla-Tencor Corp. Methods and systems for monitoring a non-defect related characteristic of a patterned wafer
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Also Published As

Publication number Publication date
KR20110027716A (en) 2011-03-16
US7912658B2 (en) 2011-03-22
WO2009154952A2 (en) 2009-12-23
KR101506894B1 (en) 2015-03-31
US20090299655A1 (en) 2009-12-03

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