WO2010068515A3 - Electronic devices including flexible electrical circuits and related methods - Google Patents

Electronic devices including flexible electrical circuits and related methods Download PDF

Info

Publication number
WO2010068515A3
WO2010068515A3 PCT/US2009/066042 US2009066042W WO2010068515A3 WO 2010068515 A3 WO2010068515 A3 WO 2010068515A3 US 2009066042 W US2009066042 W US 2009066042W WO 2010068515 A3 WO2010068515 A3 WO 2010068515A3
Authority
WO
WIPO (PCT)
Prior art keywords
die
electronic devices
devices including
related methods
electrical circuits
Prior art date
Application number
PCT/US2009/066042
Other languages
French (fr)
Other versions
WO2010068515A2 (en
Inventor
Helmut Eckhardt
Stefan Ufer
Original Assignee
Premitec, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Premitec, Inc. filed Critical Premitec, Inc.
Publication of WO2010068515A2 publication Critical patent/WO2010068515A2/en
Publication of WO2010068515A3 publication Critical patent/WO2010068515A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/02—Details
    • A61N1/04—Electrodes
    • A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/375—Constructional arrangements, e.g. casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/20—Structure, shape, material or disposition of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1032—III-V
    • H01L2924/10329—Gallium arsenide [GaAs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit structure is bonded directly to the die, and includes electrical conductors encapsulated by structural layers. Each electrical conductor contacts a respective electrical contact. The electronic device is encapsulated by the barrier film and one or more of the structural layers.
PCT/US2009/066042 2008-12-12 2009-11-30 Electronic devices including flexible electrical circuits and related methods WO2010068515A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/333,448 US7898074B2 (en) 2008-12-12 2008-12-12 Electronic devices including flexible electrical circuits and related methods
US12/333,448 2008-12-12

Publications (2)

Publication Number Publication Date
WO2010068515A2 WO2010068515A2 (en) 2010-06-17
WO2010068515A3 true WO2010068515A3 (en) 2010-08-26

Family

ID=42239529

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/066042 WO2010068515A2 (en) 2008-12-12 2009-11-30 Electronic devices including flexible electrical circuits and related methods

Country Status (2)

Country Link
US (2) US7898074B2 (en)
WO (1) WO2010068515A2 (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7877866B1 (en) * 2005-10-26 2011-02-01 Second Sight Medical Products, Inc. Flexible circuit electrode array and method of manufacturing the same
FR2929864B1 (en) * 2008-04-09 2020-02-07 Commissariat A L'energie Atomique SELF-ASSEMBLY OF CHIPS ON A SUBSTRATE
TW201032389A (en) * 2009-02-20 2010-09-01 Aiconn Technology Corp Wireless transceiver module
US20100314149A1 (en) * 2009-06-10 2010-12-16 Medtronic, Inc. Hermetically-sealed electrical circuit apparatus
US8664748B2 (en) * 2009-08-17 2014-03-04 Mosaid Technologies Incorporated Package-level integrated circuit connection without top metal pads or bonding wire
FR2960787B1 (en) * 2010-06-09 2012-07-27 Commissariat Energie Atomique PROCESS FOR PRODUCING AN INTRAOCULAR RETINAL SOFT IMPLANT WITH DOPE DIAMOND ELECTRODES
US8379381B1 (en) 2010-12-27 2013-02-19 Telecommunications Systems, Inc. Rugged solid state hard drive with silicone gel damping
US8450840B1 (en) * 2010-12-27 2013-05-28 Telecommunication Systems, Inc. Ultra ruggedized ball grid array electronic components
TWI575684B (en) * 2011-06-13 2017-03-21 矽品精密工業股份有限公司 Chip-scale package structure
WO2012173654A2 (en) * 2011-06-15 2012-12-20 Power Gold LLC Flexible circuit assembly and method thereof
US8879276B2 (en) 2011-06-15 2014-11-04 Power Gold LLC Flexible circuit assembly and method thereof
US9427569B2 (en) * 2012-05-09 2016-08-30 Po-Kang Lin Structure of artificial electronic retina
US8877558B2 (en) 2013-02-07 2014-11-04 Harris Corporation Method for making electronic device with liquid crystal polymer and related devices
US9293438B2 (en) 2013-07-03 2016-03-22 Harris Corporation Method for making electronic device with cover layer with openings and related devices
EP3046869B1 (en) * 2013-09-17 2019-01-09 California Institute of Technology Multi-layer packaging scheme for implant electronics
US9837191B2 (en) * 2014-01-02 2017-12-05 Raytheon Company Method of connecting an additive communication cable to an electrical harness
CN106653702B (en) * 2015-11-04 2019-03-01 中国科学院深圳先进技术研究院 A kind of encapsulating structure of implanted chip and preparation method thereof
US10092396B2 (en) * 2015-12-14 2018-10-09 Novartis Ag Flexible, hermetic electrical interconnect for electronic and optoelectronic devices for in vivo use
US11623082B2 (en) * 2016-03-07 2023-04-11 Cortigent, Inc. Flexible circuit peripheral nerve stimulator with low profile hybrid assembly
US10765428B2 (en) 2016-08-15 2020-09-08 Covidien Lp Hermetic force sensors for surgical devices
US10345165B2 (en) 2016-09-08 2019-07-09 Covidien Lp Force sensor for surgical devices
US9837390B1 (en) * 2016-11-07 2017-12-05 Corning Incorporated Systems and methods for creating fluidic assembly structures on a substrate
US10588231B2 (en) 2017-05-18 2020-03-10 Covidien Lp Hermetically sealed printed circuit boards
US10973142B2 (en) 2017-05-18 2021-04-06 Covidien Lp Hermetically sealed printed circuit boards
US10667408B2 (en) 2017-05-18 2020-05-26 Covidien Lp Fully encapsulated electronics and printed circuit boards
EP3466485B1 (en) * 2017-10-05 2022-11-30 Heraeus Deutschland GmbH & Co. KG Internal cermet routing for complex feedthroughs
CN114421199A (en) 2017-11-14 2022-04-29 申泰公司 Data communication system
NL2022160B1 (en) * 2018-12-10 2020-07-02 Salvia Bioelectronics B V An implantable medical device
US11324944B1 (en) * 2019-07-23 2022-05-10 Verily Life Sciences Llc Flexible cable assembly for medical implantation
US11559686B2 (en) * 2019-09-06 2023-01-24 Nextern, Inc. Systems, devices, components and methods for the delivery of electrical stimulation to cranial nerves to treat mood or mood affective disorders
US11318319B2 (en) * 2019-12-04 2022-05-03 Salvia Bioelectronics B.V. Implantable stimulator with a conformable foil-like electrode array
US11129986B2 (en) * 2019-12-04 2021-09-28 Salvia Bioelectronics B.V. Implantable stimulator with a conformable foil like electrode array
US10902867B1 (en) 2020-01-03 2021-01-26 International Business Machines Corporation Interconnect die for multichannel tape head assembly
WO2022094467A1 (en) * 2020-11-02 2022-05-05 Samtec, Inc. Flex circuit and electrical communication assemblies related to same
US20220293884A1 (en) * 2021-03-15 2022-09-15 SDK New Materials, Inc. Encapsulated Electronic Device with Improved Protective Barrier Layer and Method of Manufacture Thereof
DE102022123560A1 (en) * 2022-09-15 2024-03-21 Neuroloop GmbH Implantable electrical contact assembly

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020182778A1 (en) * 2001-05-29 2002-12-05 Pei-Wei Wang Flexible package fabrication method
US20030057567A1 (en) * 2000-03-23 2003-03-27 Harry Hedler Semiconductor component and method for its production
US20050017345A1 (en) * 2001-06-27 2005-01-27 Intel Corporation Flexible tape electronics packaging and methods of manufacture
US20050263909A1 (en) * 2004-05-21 2005-12-01 Kazuhiko Fukuta Semiconductor device

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5109844A (en) * 1990-10-11 1992-05-05 Duke University Retinal microstimulation
US5597381A (en) * 1993-06-03 1997-01-28 Massachusetts Eye And Ear Infirmary Methods for epi-retinal implantation
US6071597A (en) * 1997-08-28 2000-06-06 3M Innovative Properties Company Flexible circuits and carriers and process for manufacture
US5935155A (en) * 1998-03-13 1999-08-10 John Hopkins University, School Of Medicine Visual prosthesis and method of using same
US6221769B1 (en) * 1999-03-05 2001-04-24 International Business Machines Corporation Method for integrated circuit power and electrical connections via through-wafer interconnects
EP1171188B1 (en) * 1999-03-24 2009-05-06 Second Sight Medical Products, Inc. Retinal color prosthesis for color sight restoration
US6368349B1 (en) * 2000-11-21 2002-04-09 Massachusetts Institute Of Technology Inflatable neural prosthesis
DE60237463D1 (en) * 2001-11-16 2010-10-07 Roche Diagnostics Gmbh FLEXIBLE SENSOR AND MANUFACTURING PROCESS
US7146221B2 (en) * 2001-11-16 2006-12-05 The Regents Of The University Of California Flexible electrode array for artifical vision
US6756244B2 (en) * 2002-01-29 2004-06-29 Hewlett-Packard Development Company, L.P. Interconnect structure
US7645262B2 (en) * 2002-04-11 2010-01-12 Second Sight Medical Products, Inc. Biocompatible bonding method and electronics package suitable for implantation
US7142909B2 (en) * 2002-04-11 2006-11-28 Second Sight Medical Products, Inc. Biocompatible bonding method and electronics package suitable for implantation
WO2004014479A2 (en) * 2002-08-09 2004-02-19 Second Sight Medical Products, Inc Insulated implantable electrical circuit
WO2005114720A2 (en) * 2004-05-14 2005-12-01 California Institute Of Technology Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same
US20070067000A1 (en) * 2004-06-10 2007-03-22 Ndi Medical, Llc Implantable pulse generator systems and methods for providing functional and/or therapeutic stimulation of muscles and/or nerves and/or central nervous system tissue
US7881799B2 (en) * 2005-04-28 2011-02-01 Second Sight Medical Products, Inc. Retinal prosthesis and method of manufacturing a retinal prosthesis
KR100785458B1 (en) * 2005-05-18 2007-12-13 삼성전자주식회사 Method of forming a ferroelectric layer and Method of manufacturing a semiconductor device using the same
US8190266B2 (en) * 2006-02-15 2012-05-29 Dohey Eye Institute Wide-field retinal prosthesis
US8197539B2 (en) * 2006-05-05 2012-06-12 University Of Southern California Intraocular camera for retinal prostheses
EP1883107A3 (en) * 2006-07-07 2014-04-09 Imec Method for forming packaged microelectronic devices and devices thus obtained
AU2007284422B2 (en) * 2006-08-18 2011-06-02 Second Sight Medical Products, Inc. Package for an implantable neural stimulation device
US7417310B2 (en) * 2006-11-02 2008-08-26 Entorian Technologies, Lp Circuit module having force resistant construction

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030057567A1 (en) * 2000-03-23 2003-03-27 Harry Hedler Semiconductor component and method for its production
US20020182778A1 (en) * 2001-05-29 2002-12-05 Pei-Wei Wang Flexible package fabrication method
US20050017345A1 (en) * 2001-06-27 2005-01-27 Intel Corporation Flexible tape electronics packaging and methods of manufacture
US20050263909A1 (en) * 2004-05-21 2005-12-01 Kazuhiko Fukuta Semiconductor device

Also Published As

Publication number Publication date
US8173490B2 (en) 2012-05-08
US20100148345A1 (en) 2010-06-17
US7898074B2 (en) 2011-03-01
US20110117703A1 (en) 2011-05-19
WO2010068515A2 (en) 2010-06-17

Similar Documents

Publication Publication Date Title
WO2010068515A3 (en) Electronic devices including flexible electrical circuits and related methods
GB2488265A (en) Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
WO2011084235A3 (en) Glass core substrate for integrated circuit devices and methods of making the same
TWI260056B (en) Module structure having an embedded chip
TWI268583B (en) High-frequency device
WO2007146307A3 (en) Stack die packages
TW200715499A (en) Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
WO2009129334A3 (en) Three-dimensional semiconductor device structures and methods
EP2469591A3 (en) Method for fabricating a semiconductor device package
WO2007084328A3 (en) High power module with open frame package
WO2007106634A3 (en) Semiconductor device packaging
WO2018089919A3 (en) Integrated packaging devices and methods with backside interconnections
TW200731438A (en) Flip chip MLP with conductive ink
DE502008000072D1 (en) Circuit arrangement with connecting device and manufacturing method thereof
GB201213442D0 (en) Security wrap with breakable conductors
WO2010145907A3 (en) Methods and systems for fabrication of mems cmos devices
GB2459238A (en) Packaging methods for imager devices
TW200744173A (en) Semiconductor device and its manufacturing method
WO2009155164A3 (en) Conducting film or electrode with improved optical and electrical performance
WO2008102476A1 (en) Electronic circuit device, process for manufacturing the same and display apparatus
WO2003069695A3 (en) Multilayer package for a semiconductor device
WO2007134308A3 (en) Thin film battery on an integrated circuit or circuit board and method thereof
TW200704582A (en) Semiconductor composite device and method of manufacturing the same
WO2015095836A3 (en) Scalable fabrication techniques and circuit packaging devices
WO2012012569A3 (en) Multi-sensor integrated circuit device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09832382

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09832382

Country of ref document: EP

Kind code of ref document: A2