WO2010096711A3 - Probe head for a microelectronic contactor assembly, and methods of making same - Google Patents

Probe head for a microelectronic contactor assembly, and methods of making same Download PDF

Info

Publication number
WO2010096711A3
WO2010096711A3 PCT/US2010/024813 US2010024813W WO2010096711A3 WO 2010096711 A3 WO2010096711 A3 WO 2010096711A3 US 2010024813 W US2010024813 W US 2010024813W WO 2010096711 A3 WO2010096711 A3 WO 2010096711A3
Authority
WO
WIPO (PCT)
Prior art keywords
methods
probe head
making same
contactor assembly
substrate
Prior art date
Application number
PCT/US2010/024813
Other languages
French (fr)
Other versions
WO2010096711A2 (en
Inventor
Yohannes Desta
Lakshmikanth Namburi
Matthew Losey
Original Assignee
Touchdown Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Touchdown Technologies, Inc. filed Critical Touchdown Technologies, Inc.
Publication of WO2010096711A2 publication Critical patent/WO2010096711A2/en
Publication of WO2010096711A3 publication Critical patent/WO2010096711A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Abstract

Microelectronic contactors on a probe contactor substrate, or adhesive elements on a probe contactor or space transformer substrate, are protected by a sacrificial material as 1) the microelectronic contactors or adhesive elements are pianarized, or 2) a surface of the substrate on which the microelectronic contactors or adhesive elements are formed is planarized. The adhesive elements are used to bond the probe contactor substrate to the space transformer substrate.
PCT/US2010/024813 2009-02-19 2010-02-19 Probe head for a microelectronic contactor assembly, and methods of making same WO2010096711A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15373109P 2009-02-19 2009-02-19
US61/153,731 2009-02-19

Publications (2)

Publication Number Publication Date
WO2010096711A2 WO2010096711A2 (en) 2010-08-26
WO2010096711A3 true WO2010096711A3 (en) 2011-01-20

Family

ID=42634479

Family Applications (3)

Application Number Title Priority Date Filing Date
PCT/US2010/024813 WO2010096711A2 (en) 2009-02-19 2010-02-19 Probe head for a microelectronic contactor assembly, and methods of making same
PCT/US2010/024817 WO2010096714A2 (en) 2009-02-19 2010-02-19 Probe head for a microelectronic contactor assembly, the probe head having smt electronic components thereon
PCT/US2010/024807 WO2010096707A2 (en) 2009-02-19 2010-02-19 Microelectronic contactor assembly, structures thereof, and methods of constructing same

Family Applications After (2)

Application Number Title Priority Date Filing Date
PCT/US2010/024817 WO2010096714A2 (en) 2009-02-19 2010-02-19 Probe head for a microelectronic contactor assembly, the probe head having smt electronic components thereon
PCT/US2010/024807 WO2010096707A2 (en) 2009-02-19 2010-02-19 Microelectronic contactor assembly, structures thereof, and methods of constructing same

Country Status (3)

Country Link
US (3) US8901950B2 (en)
TW (3) TWI522622B (en)
WO (3) WO2010096711A2 (en)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6256882B1 (en) * 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
KR101147677B1 (en) * 2008-06-02 2012-05-21 가부시키가이샤 어드밴티스트 Test system and substrate unit to be used for testing
US8901950B2 (en) * 2009-02-19 2014-12-02 Advantest America, Inc Probe head for a microelectronic contactor assembly, and methods of making same
US8362797B2 (en) * 2009-08-25 2013-01-29 Advanced Inquiry Systems, Inc. Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed therebetween
US9176186B2 (en) 2009-08-25 2015-11-03 Translarity, Inc. Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed
US8466704B1 (en) * 2010-04-19 2013-06-18 Altera Corporation Probe cards with minimized cross-talk
US8733188B2 (en) * 2010-08-27 2014-05-27 General Electric Company Apparatus for mounting pipe sensors
EP2663520B1 (en) * 2011-01-14 2019-01-09 Cavendish Kinetics Inc. Method for mems device fabrication and device formed
US8622752B2 (en) * 2011-04-13 2014-01-07 Teradyne, Inc. Probe-card interposer constructed using hexagonal modules
US9244099B2 (en) 2011-05-09 2016-01-26 Cascade Microtech, Inc. Probe head assemblies, components thereof, test systems including the same, and methods of operating the same
US20120319710A1 (en) * 2011-06-15 2012-12-20 Probelogic, Inc. Method and apparatus for implementing probes for electronic circuit testing
CN103188874B (en) * 2011-12-28 2016-01-13 北大方正集团有限公司 The dark milling localization method of a kind of control and printed circuit board (PCB)
US20130234746A1 (en) * 2012-03-07 2013-09-12 Advantest Corporation Shielded probe array
DE102012210921A1 (en) * 2012-06-27 2014-01-23 Robert Bosch Gmbh Contact element for connection to a printed circuit board, contact system and method
US9142364B2 (en) * 2012-06-29 2015-09-22 Hamilton Sundstrand Corporation Contactor mounting panel with improved thermal characteristics
US9140586B2 (en) 2012-09-25 2015-09-22 General Electric Company Removable sensor port insert apparatus
TWI490508B (en) * 2012-12-17 2015-07-01 Princo Corp Flexible testing device and testing method thereof
US9086433B2 (en) 2012-12-19 2015-07-21 International Business Machines Corporation Rigid probe with compliant characteristics
US9354273B2 (en) * 2012-12-21 2016-05-31 Intel Corporation Composite wire probe test assembly
US9312607B2 (en) 2013-02-12 2016-04-12 Raytheon Company Load spreading interposer
TWI480561B (en) * 2013-05-15 2015-04-11 Star Techn Inc Test assembly
TWM463903U (en) * 2013-05-15 2013-10-21 Star Techn Inc Test assembly
US9523713B2 (en) * 2013-05-28 2016-12-20 Intel Corporation Interconnects including liquid metal
TWI500945B (en) * 2013-12-17 2015-09-21 Primax Electronics Ltd Testing system of circuit board
US9678108B1 (en) 2014-02-06 2017-06-13 Advantest America, Inc. Methods to manufacture semiconductor probe tips
SG11201607219PA (en) * 2014-03-06 2016-09-29 Technoprobe Spa Probe card for a testing apparatus of electronic devices, particularly for extreme temperature applications
JP2018523135A (en) * 2015-05-29 2018-08-16 アール アンド ディー サーキッツ インコーポレイテッドＲ ＆ Ｄ Ｃｉｒｃｕｉｔｓ Ｉｎｃ． Improved power supply transient performance (probe integrity) for probe card assembly in integrated circuit test environments
US9735071B2 (en) 2015-08-25 2017-08-15 International Business Machines Corporation Method of forming a temporary test structure for device fabrication
US20170176496A1 (en) * 2015-12-18 2017-06-22 Akshay Mathkar Space transformer including a perforated mold preform for electrical die test
US10120020B2 (en) 2016-06-16 2018-11-06 Formfactor Beaverton, Inc. Probe head assemblies and probe systems for testing integrated circuit devices
US20190271721A1 (en) * 2016-09-30 2019-09-05 Dae-woo Kim Self aligned sort probe card for si bridge wafer
US9847602B1 (en) * 2016-10-21 2017-12-19 Dell Products, Lp Shielded high speed connector with reduced crosstalk
JP6745197B2 (en) * 2016-11-04 2020-08-26 浜松ホトニクス株式会社 Ultrasonic inspection apparatus and ultrasonic inspection method
US10663486B2 (en) 2017-02-06 2020-05-26 International Business Machines Corporation Portable electrical noise probe structure
TWI644104B (en) * 2017-03-17 2018-12-11 旺矽科技股份有限公司 Probe, probe head and method of manufacturing probe head
IT201700046645A1 (en) * 2017-04-28 2018-10-28 Technoprobe Spa Measurement board for a test device of electronic devices
TWI678537B (en) * 2018-01-05 2019-12-01 旺矽科技股份有限公司 Probe card
WO2019231928A1 (en) * 2018-06-01 2019-12-05 Xcerra Corporation Hybrid probe head assembly for testing a wafer device under test
JP7262990B2 (en) * 2018-12-13 2023-04-24 株式会社日本マイクロニクス Electrical connection device
US10830793B2 (en) * 2019-01-29 2020-11-10 Kuan-Hung Chen Deflecting device for a probe
KR102004441B1 (en) * 2019-03-25 2019-07-29 주식회사 프로이천 Pin board assembly
TWI750552B (en) * 2019-12-16 2021-12-21 旺矽科技股份有限公司 Positionable probe card and manufacturing method thereof
CN115280166A (en) * 2020-03-13 2022-11-01 日本电产理德股份有限公司 Inspection jig and substrate inspection apparatus including the same
JPWO2021182084A1 (en) * 2020-03-13 2021-09-16
WO2023112315A1 (en) * 2021-12-17 2023-06-22 日本電子材料株式会社 Probe card substrate connection base

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030076124A1 (en) * 1999-08-23 2003-04-24 Agilent Technologies, Inc. Modular interface between test and application equipment
US6799976B1 (en) * 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
KR100791945B1 (en) * 2007-08-23 2008-01-04 (주)기가레인 Probe card
JP2008170413A (en) * 2007-01-12 2008-07-24 Apex Internatl Inc Inspecting probe card and manufacturing method therefor
US20080180118A1 (en) * 2007-01-30 2008-07-31 Kyocera Corporation Substrate for probe card assembly, method of manufacturing substrate for probe card assembly and method of inspecting semiconductor wafer
JP2008268196A (en) * 2007-03-28 2008-11-06 Japan Electronic Materials Corp Contact probe and manufacturing method of contact probe
US20080278185A1 (en) * 2007-05-09 2008-11-13 Mjc Probe Incorporation Electrical contact device and its manufacturing process

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6431034A (en) 1987-07-28 1989-02-01 Shimadzu Corp Indentation hardness testing method
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
WO1996015458A1 (en) 1994-11-15 1996-05-23 Formfactor, Inc. Probe card assembly and kit, and methods of using same
JPH1031034A (en) 1996-07-17 1998-02-03 Denki Kagaku Kogyo Kk Probe card with parallelism regulator
JP3280327B2 (en) 1997-10-02 2002-05-13 インターナショナル・ビジネス・マシーンズ・コーポレーション Test probe structure and method of manufacturing the same
US6032279A (en) * 1997-11-07 2000-02-29 Atmel Corporation Boundary scan system with address dependent instructions
US6292003B1 (en) * 1998-07-01 2001-09-18 Xilinx, Inc. Apparatus and method for testing chip scale package integrated circuits
US6676438B2 (en) * 2000-02-14 2004-01-13 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
US6509751B1 (en) * 2000-03-17 2003-01-21 Formfactor, Inc. Planarizer for a semiconductor contactor
US6426638B1 (en) 2000-05-02 2002-07-30 Decision Track Llc Compliant probe apparatus
KR200200534Y1 (en) 2000-06-08 2000-10-16 주식회사유림하이테크산업 Probe card
US6729019B2 (en) 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
KR100491780B1 (en) * 2001-07-26 2005-05-31 주식회사 파이컴 Probe card
KR100484325B1 (en) * 2001-08-09 2005-04-20 주식회사 파이컴 Probe card
US7102367B2 (en) * 2002-07-23 2006-09-05 Fujitsu Limited Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof
US7132839B2 (en) * 2002-12-31 2006-11-07 Intel Corporation Ultra-short low-force vertical probe test head and method
JP4121413B2 (en) 2003-03-31 2008-07-23 株式会社神戸製鋼所 High-pressure processing equipment for plate-like products
US6924655B2 (en) * 2003-09-03 2005-08-02 Micron Technology, Inc. Probe card for use with microelectronic components, and methods for making same
KR20070016193A (en) 2004-06-15 2007-02-07 폼팩터, 인코포레이티드 Mechanically reconfigurable vertical tester interface for ic probing
US7129730B2 (en) 2004-12-15 2006-10-31 Chipmos Technologies (Bermuda) Ltd. Probe card assembly
US7271022B2 (en) 2004-12-21 2007-09-18 Touchdown Technologies, Inc. Process for forming microstructures
US7264984B2 (en) * 2004-12-21 2007-09-04 Touchdown Technologies, Inc. Process for forming MEMS
KR20060088416A (en) 2005-02-01 2006-08-04 윤병규 Apparatus for leveling a probe unit
KR20080002793A (en) 2005-03-01 2008-01-04 에스브이 프로브 피티이 엘티디 Probe card with stacked substrate
US7279911B2 (en) * 2005-05-03 2007-10-09 Sv Probe Pte Ltd. Probe card assembly with dielectric structure
US7589542B2 (en) 2007-04-12 2009-09-15 Touchdown Technologies Inc. Hybrid probe for testing semiconductor devices
US7245135B2 (en) 2005-08-01 2007-07-17 Touchdown Technologies, Inc. Post and tip design for a probe contact
US7362119B2 (en) 2005-08-01 2008-04-22 Touchdown Technologies, Inc Torsion spring probe contactor design
US20070075717A1 (en) 2005-09-14 2007-04-05 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
US7180316B1 (en) 2006-02-03 2007-02-20 Touchdown Technologies, Inc. Probe head with machined mounting pads and method of forming same
US7692433B2 (en) * 2006-06-16 2010-04-06 Formfactor, Inc. Sawing tile corners on probe card substrates
US7629804B2 (en) 2006-08-04 2009-12-08 Vertical Test Inc. Probe head assembly for use in testing multiple wafer die
JP2008216060A (en) 2007-03-05 2008-09-18 Micronics Japan Co Ltd Electrical connecting device
US8456184B2 (en) 2007-03-14 2013-06-04 Nhk Spring Co., Ltd. Probe card for a semiconductor wafer
KR20090014755A (en) 2007-08-07 2009-02-11 (주) 미코티엔 Probe card and apparatus for testing a wafer having the probe card
US7692436B2 (en) * 2008-03-20 2010-04-06 Touchdown Technologies, Inc. Probe card substrate with bonded via
US8901950B2 (en) * 2009-02-19 2014-12-02 Advantest America, Inc Probe head for a microelectronic contactor assembly, and methods of making same
US8278956B2 (en) * 2010-04-08 2012-10-02 Advantest America, Inc Probecard system and method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6799976B1 (en) * 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US20030076124A1 (en) * 1999-08-23 2003-04-24 Agilent Technologies, Inc. Modular interface between test and application equipment
JP2008170413A (en) * 2007-01-12 2008-07-24 Apex Internatl Inc Inspecting probe card and manufacturing method therefor
US20080180118A1 (en) * 2007-01-30 2008-07-31 Kyocera Corporation Substrate for probe card assembly, method of manufacturing substrate for probe card assembly and method of inspecting semiconductor wafer
JP2008268196A (en) * 2007-03-28 2008-11-06 Japan Electronic Materials Corp Contact probe and manufacturing method of contact probe
US20080278185A1 (en) * 2007-05-09 2008-11-13 Mjc Probe Incorporation Electrical contact device and its manufacturing process
KR100791945B1 (en) * 2007-08-23 2008-01-04 (주)기가레인 Probe card

Also Published As

Publication number Publication date
WO2010096711A2 (en) 2010-08-26
TW201111799A (en) 2011-04-01
WO2010096707A3 (en) 2010-11-18
TWI491885B (en) 2015-07-11
TW201037320A (en) 2010-10-16
WO2010096707A2 (en) 2010-08-26
US8901950B2 (en) 2014-12-02
US8232818B2 (en) 2012-07-31
WO2010096714A2 (en) 2010-08-26
US20100237888A1 (en) 2010-09-23
WO2010096714A3 (en) 2011-01-27
US20100237889A1 (en) 2010-09-23
TWI522622B (en) 2016-02-21
TWI512298B (en) 2015-12-11
US20100237887A1 (en) 2010-09-23
US8305101B2 (en) 2012-11-06
TW201040538A (en) 2010-11-16

Similar Documents

Publication Publication Date Title
WO2010096711A3 (en) Probe head for a microelectronic contactor assembly, and methods of making same
WO2011150157A3 (en) Detergent compositions containing streptomyces griseus lipase and methods of use thereof
WO2007089798A3 (en) Methods of preparing and characterizing mesenchymal stem cell aggregates and uses thereof
EP2283081B8 (en) Process for the surface modification of particles
WO2007053597A3 (en) An anticorrosive paper or paperboard material
WO2007066232A3 (en) Salts of fatty acids and methods of making and using thereof
WO2011047146A3 (en) Methods of affinity maturing antibodies
EP1877537A4 (en) Wood-rotting basidiomycetes for production of ligninolytic enzymes
WO2010111436A3 (en) Antiviral compounds and uses thereof
WO2008151170A3 (en) Process for the synthesis of ramelteon and its intermediates
WO2011022548A3 (en) Ketoreductase polypeptides for the preparation of phenylephrine
WO2011034808A3 (en) Composition and method for polishing bulk silicon
WO2007141593A3 (en) Process for the preparation of metoprolol and its salts
WO2011095336A3 (en) Post-synthetic modification of nucleic acids by inverse diels-alder reaction
EP2390239A3 (en) Synthetic quartz glass substrate and making method
WO2011146912A3 (en) Stencils for high-throughput micron-scale etching of substrates and processes of making and using the same
WO2008011433A3 (en) Styrenated terpene resin as well as methods of making and using the same
EP2698831A3 (en) Inkjet printable etch resist
WO2008116056A3 (en) NOVEL METHODS FOR PRODUCTION OF 5-EPI-β-VETIVONE, 2-ISOPROPYL-6,10-DIMETHYL-SPIRO[4.5]DECA-2,6-DIEN-8-ONE, AND 2-ISOPROPYL-6,10-DIMETHYL-SPIRO[4.5]DECA-1,6-DIEN-8-ONE
WO2009117498A3 (en) Methods of making cyclododecatriene and methods of making laurolactone
WO2009146202A3 (en) Transketalized compositions, synthesis, and applications
WO2011041499A3 (en) Isolated rice lp2 promoter and uses thereof
WO2010046593A3 (en) Method for defining a sports or playing area by means of a thermochromatic spin transition material
WO2012046234A3 (en) Electromechanical effect in cerium based oxides
WO2011130072A3 (en) Composition and method for polishing bulk silicon

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10744400

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10744400

Country of ref document: EP

Kind code of ref document: A2