WO2011093960A2 - Variable pressure brush/pad - Google Patents
Variable pressure brush/pad Download PDFInfo
- Publication number
- WO2011093960A2 WO2011093960A2 PCT/US2010/061314 US2010061314W WO2011093960A2 WO 2011093960 A2 WO2011093960 A2 WO 2011093960A2 US 2010061314 W US2010061314 W US 2010061314W WO 2011093960 A2 WO2011093960 A2 WO 2011093960A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fluid
- brush
- rigid core
- workpiece
- brushes
- Prior art date
Links
- 239000012530 fluid Substances 0.000 claims abstract description 72
- 238000004140 cleaning Methods 0.000 claims abstract description 54
- 239000012528 membrane Substances 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims description 17
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 3
- 230000008602 contraction Effects 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 9
- 238000010586 diagram Methods 0.000 description 28
- 238000000034 method Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 5
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 229920002943 EPDM rubber Polymers 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 239000011538 cleaning material Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B13/00—Brushes with driven brush bodies or carriers
- A46B13/008—Disc-shaped brush bodies
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B11/00—Brushes with reservoir or other means for applying substances, e.g. paints, pastes, water
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B13/00—Brushes with driven brush bodies or carriers
- A46B13/001—Cylindrical or annular brush bodies
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46D—MANUFACTURE OF BRUSHES
- A46D1/00—Bristles; Selection of materials for bristles
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46D—MANUFACTURE OF BRUSHES
- A46D1/00—Bristles; Selection of materials for bristles
- A46D1/02—Bristles details
- A46D1/0246—Hollow bristles
-
- B08B1/32—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
Definitions
- Figure 9A is a simplified schematic diagram illustrating and expandable brush in accordance with one embodiment of the invention.
- roller assemblies While illustrated with a disc 106, the roller assemblies are configured to accommodate multiple discs that are placed into the support structure 100 by an automated carrier moving between roller assembly 102a and roller assembly 102b.
- the distance between roller assembly 102a and roller assembly 102b defines the width of a support nest of Figure 1.
- Features of the roller assembly 102a and 102b enable support nests that can accommodate large diameter discs while in other configurations enabling accommodation of smaller diameter discs.
- the relative size of the support structure 100 shown in Figure IB is not intended to be limiting.
- the support structure 100 can be modified in order to
- compartments 160 may be varied independently.
- FIG. 9B is a simplified schematic diagram illustrating a cross-sectional view of a brush in accordance with one embodiment of the invention.
- Tube 210 extends along the length of brush 204.
- the walls of tube 210 define a plurality of openings 220 that extend through the tube wall.
- Brush material 214 is disposed around tube 210.
- tube 210 is composed of a flexible membrane.
- tube 210 is a rigid material.
- brush 214 may include a flexible membrane that will contract and expand according to an amount of pressure from the fluid being delivered from tube 210, through openings 220 to the flexible membrane disposed between the brush material 214 and an outer surface of tube 210. Thus, the expansion of the flexible membrane will cause the brush to expand.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012551161A JP2013517941A (en) | 2010-01-26 | 2010-12-20 | Variable pressure brush / pad |
CN2010800621967A CN102714154A (en) | 2010-01-26 | 2010-12-20 | Variable Pressure Brush/Pad |
SG2012040077A SG181457A1 (en) | 2010-01-26 | 2010-12-20 | Variable pressure brush/pad |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/694,188 | 2010-01-26 | ||
US12/694,188 US20110182653A1 (en) | 2010-01-26 | 2010-01-26 | Variable Pressure Brush/Pad |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011093960A2 true WO2011093960A2 (en) | 2011-08-04 |
WO2011093960A3 WO2011093960A3 (en) | 2011-12-08 |
Family
ID=44309061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2010/061314 WO2011093960A2 (en) | 2010-01-26 | 2010-12-20 | Variable pressure brush/pad |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110182653A1 (en) |
JP (1) | JP2013517941A (en) |
CN (1) | CN102714154A (en) |
SG (1) | SG181457A1 (en) |
TW (1) | TW201200066A (en) |
WO (1) | WO2011093960A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9202723B2 (en) * | 2011-11-29 | 2015-12-01 | Illinois Tool Works, Inc. | Brush with cantilevered nodules |
US9704729B2 (en) * | 2013-06-13 | 2017-07-11 | K.C. Tech Co., Ltd. | Substrate cleaning apparatus and method and brush assembly used therein |
US10504753B2 (en) | 2013-12-13 | 2019-12-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5311634A (en) * | 1993-02-03 | 1994-05-17 | Nicholas Andros | Sponge cleaning pad |
US6006391A (en) * | 1997-11-10 | 1999-12-28 | Speedfam-Ipec Corporation | Workpiece cleaning element with improved rib configuration |
US20020100132A1 (en) * | 2001-01-30 | 2002-08-01 | Mcmullen Daniel T. | Porous polymeric substrate treatment device and method |
US20070084004A1 (en) * | 2005-10-13 | 2007-04-19 | Noritake Shizawa | Disc cleaning machinery, disc cleaning device thereof and rotary brush thereof |
US20080182488A1 (en) * | 2006-10-03 | 2008-07-31 | Dave Frost | Spiral brush for cleaning and conveying a substrate |
US20080313833A1 (en) * | 2007-06-25 | 2008-12-25 | Noritake Shizawa | Disc cleaning mechanism and disc cleaning device |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1943422A (en) * | 1929-05-29 | 1934-01-16 | Compo Shoe Machinery Corp | Upper-roughing machine |
US2509957A (en) * | 1946-06-11 | 1950-05-30 | Goodall Sanford Inc | Machine for liquid cleaning of upholstered articles, fabrics, rugs, carpets, etc. |
US2680938A (en) * | 1949-11-09 | 1954-06-15 | Osborn Mfg Co | Apparatus for conditioning metal sheets and the like |
US4061136A (en) * | 1976-09-09 | 1977-12-06 | Giuseppe Vaniglia | Portable washer and massager apparatus for bathtubs |
JPS596974A (en) * | 1982-07-05 | 1984-01-14 | カネボウ株式会社 | Washing method |
US5016311A (en) * | 1988-04-27 | 1991-05-21 | Minnesota Mining And Manufacturing Company | Apparatus and brush segment arrangement for finishing wheel brushes; and method |
US5076024A (en) * | 1990-08-24 | 1991-12-31 | Intelmatec Corporation | Disk polisher assembly |
DE59306132D1 (en) * | 1992-10-02 | 1997-05-15 | Putzmeister Maschf | BRUSH HEAD FOR CLEANING SURFACES |
US5778481A (en) * | 1996-02-15 | 1998-07-14 | International Business Machines Corporation | Silicon wafer cleaning and polishing pads |
US5964006A (en) * | 1997-01-13 | 1999-10-12 | 3M Innovative Properties Company | Rotary surface treatment tool |
JP3399772B2 (en) * | 1997-02-28 | 2003-04-21 | 株式会社藤森技術研究所 | Cleaning equipment for semiconductor manufacturing equipment |
US5870792A (en) * | 1997-03-31 | 1999-02-16 | Speedfam Corporation | Apparatus for cleaning wafers and discs |
US5966766A (en) * | 1997-10-06 | 1999-10-19 | Advanced Micro Devices, Inc. | Apparatus and method for cleaning semiconductor wafer |
US6076217A (en) * | 1998-04-06 | 2000-06-20 | Micron Technology, Inc. | Brush alignment platform |
JP3200036B2 (en) * | 1998-05-22 | 2001-08-20 | アイオン株式会社 | Rotating brush for cleaning |
US6467120B1 (en) * | 1999-09-08 | 2002-10-22 | International Business Machines Corporation | Wafer cleaning brush profile modification |
US6240588B1 (en) * | 1999-12-03 | 2001-06-05 | Lam Research Corporation | Wafer scrubbing brush core |
JP4087581B2 (en) * | 2001-06-06 | 2008-05-21 | 株式会社荏原製作所 | Polishing equipment |
US6641462B2 (en) * | 2001-06-27 | 2003-11-04 | Speedfam-Ipec Corporation | Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing |
US20100186180A1 (en) * | 2009-01-23 | 2010-07-29 | Xyratex Corporation | Support structure for multiple workpiece support rollers |
-
2010
- 2010-01-26 US US12/694,188 patent/US20110182653A1/en not_active Abandoned
- 2010-12-20 CN CN2010800621967A patent/CN102714154A/en active Pending
- 2010-12-20 JP JP2012551161A patent/JP2013517941A/en active Pending
- 2010-12-20 WO PCT/US2010/061314 patent/WO2011093960A2/en active Application Filing
- 2010-12-20 SG SG2012040077A patent/SG181457A1/en unknown
-
2011
- 2011-01-26 TW TW100102897A patent/TW201200066A/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5311634A (en) * | 1993-02-03 | 1994-05-17 | Nicholas Andros | Sponge cleaning pad |
US6006391A (en) * | 1997-11-10 | 1999-12-28 | Speedfam-Ipec Corporation | Workpiece cleaning element with improved rib configuration |
US20020100132A1 (en) * | 2001-01-30 | 2002-08-01 | Mcmullen Daniel T. | Porous polymeric substrate treatment device and method |
US20070084004A1 (en) * | 2005-10-13 | 2007-04-19 | Noritake Shizawa | Disc cleaning machinery, disc cleaning device thereof and rotary brush thereof |
US20080182488A1 (en) * | 2006-10-03 | 2008-07-31 | Dave Frost | Spiral brush for cleaning and conveying a substrate |
US20080313833A1 (en) * | 2007-06-25 | 2008-12-25 | Noritake Shizawa | Disc cleaning mechanism and disc cleaning device |
Also Published As
Publication number | Publication date |
---|---|
CN102714154A (en) | 2012-10-03 |
JP2013517941A (en) | 2013-05-20 |
US20110182653A1 (en) | 2011-07-28 |
WO2011093960A3 (en) | 2011-12-08 |
SG181457A1 (en) | 2012-07-30 |
TW201200066A (en) | 2012-01-01 |
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