WO2016146665A3 - Light-emitting component and method for producing a light-emitting component - Google Patents

Light-emitting component and method for producing a light-emitting component Download PDF

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Publication number
WO2016146665A3
WO2016146665A3 PCT/EP2016/055651 EP2016055651W WO2016146665A3 WO 2016146665 A3 WO2016146665 A3 WO 2016146665A3 EP 2016055651 W EP2016055651 W EP 2016055651W WO 2016146665 A3 WO2016146665 A3 WO 2016146665A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting component
producing
homogenizing element
wavelength
Prior art date
Application number
PCT/EP2016/055651
Other languages
German (de)
French (fr)
Other versions
WO2016146665A2 (en
Inventor
Christian LEIRER
Alexander Linkov
Matthias Sabathil
Matthias Knoerr
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2016146665A2 publication Critical patent/WO2016146665A2/en
Publication of WO2016146665A3 publication Critical patent/WO2016146665A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material

Abstract

The invention relates to a light-emitting component, consisting of a light-emitting chip 110, which emits light of a first wavelength, and with at least one conversion layer 130, which converts light of the first wavelength into light of at least a second wavelength, a homogenizing element 150 being provided between the light-emitting chip 110 and the conversion layer 130, and a surface of the homogenizing element 150 bordering the light-emitting chip 110 and at least one further surface of the homogenizing element 150 bordering the conversion layer 130. The invention also relates to a method for producing a light-emitting component using a photostructurable coating for the homogenizing element and lateral spacers.
PCT/EP2016/055651 2015-03-16 2016-03-16 Light-emitting component and method for producing a light-emitting component WO2016146665A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015103835.8 2015-03-16
DE102015103835.8A DE102015103835A1 (en) 2015-03-16 2015-03-16 Light-emitting component and method for producing a light-emitting component

Publications (2)

Publication Number Publication Date
WO2016146665A2 WO2016146665A2 (en) 2016-09-22
WO2016146665A3 true WO2016146665A3 (en) 2016-11-03

Family

ID=55542656

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2016/055651 WO2016146665A2 (en) 2015-03-16 2016-03-16 Light-emitting component and method for producing a light-emitting component

Country Status (2)

Country Link
DE (1) DE102015103835A1 (en)
WO (1) WO2016146665A2 (en)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020063520A1 (en) * 2000-11-29 2002-05-30 Huei-Che Yu Pre-formed fluorescent plate - LED device
DE102006024165A1 (en) * 2006-05-23 2007-11-29 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Optoelectronic semiconductor chip with a wavelength conversion substance and optoelectronic semiconductor component with such a semiconductor chip and method for producing the optoelectronic semiconductor chip
US20090115313A1 (en) * 2007-11-07 2009-05-07 Industrial Technology Research Institute Light emitting device and fabricating method thereof
US20100059771A1 (en) * 2008-09-10 2010-03-11 Chris Lowery Multi-layer led phosphors
WO2011015959A1 (en) * 2009-08-07 2011-02-10 Philips Lumileds Lighting Company, Llc Led with silicone layer and laminated remote phosphor layer
US20120007131A1 (en) * 2009-05-22 2012-01-12 Panasonic Corporation Semiconductor light-emitting device and light source device using the same
US20120033404A1 (en) * 2010-08-03 2012-02-09 Lite-On Technology Corporation Illumination device
US20120032200A1 (en) * 2009-03-30 2012-02-09 Sung Hoon Kwon Method for coating light-emitting devices, light coupler, and method for manufacturing the light coupler
US20120248479A1 (en) * 2011-03-28 2012-10-04 Osram Sylvania Inc. LED Device Utilizing Quantum Dots
US20140175492A1 (en) * 2012-12-21 2014-06-26 Soraa, Inc. Dense-luminescent-materials-coated violet leds
KR101501020B1 (en) * 2014-02-17 2015-03-13 주식회사 루멘스 Light emitting device package, backlight unit, lighting device and its manufacturing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008030815A1 (en) * 2008-06-30 2009-12-31 Osram Opto Semiconductors Gmbh Method for producing a plurality of optoelectronic components
DE102011003988A1 (en) * 2011-02-11 2012-08-16 Osram Ag Lighting device has transparent light guidance portion provided in respective emitter area of semiconductor light source such as LED
DE102012107290A1 (en) * 2012-08-08 2014-02-13 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor device, conversion agent platelets and method of making a conversion agent platelet
DE102014102828A1 (en) * 2014-03-04 2015-09-10 Osram Opto Semiconductors Gmbh Arrangement with a light-emitting diode

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020063520A1 (en) * 2000-11-29 2002-05-30 Huei-Che Yu Pre-formed fluorescent plate - LED device
DE102006024165A1 (en) * 2006-05-23 2007-11-29 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Optoelectronic semiconductor chip with a wavelength conversion substance and optoelectronic semiconductor component with such a semiconductor chip and method for producing the optoelectronic semiconductor chip
US20090115313A1 (en) * 2007-11-07 2009-05-07 Industrial Technology Research Institute Light emitting device and fabricating method thereof
US20100059771A1 (en) * 2008-09-10 2010-03-11 Chris Lowery Multi-layer led phosphors
US20120032200A1 (en) * 2009-03-30 2012-02-09 Sung Hoon Kwon Method for coating light-emitting devices, light coupler, and method for manufacturing the light coupler
US20120007131A1 (en) * 2009-05-22 2012-01-12 Panasonic Corporation Semiconductor light-emitting device and light source device using the same
WO2011015959A1 (en) * 2009-08-07 2011-02-10 Philips Lumileds Lighting Company, Llc Led with silicone layer and laminated remote phosphor layer
US20120033404A1 (en) * 2010-08-03 2012-02-09 Lite-On Technology Corporation Illumination device
US20120248479A1 (en) * 2011-03-28 2012-10-04 Osram Sylvania Inc. LED Device Utilizing Quantum Dots
US20140175492A1 (en) * 2012-12-21 2014-06-26 Soraa, Inc. Dense-luminescent-materials-coated violet leds
KR101501020B1 (en) * 2014-02-17 2015-03-13 주식회사 루멘스 Light emitting device package, backlight unit, lighting device and its manufacturing method

Also Published As

Publication number Publication date
DE102015103835A1 (en) 2016-09-22
WO2016146665A2 (en) 2016-09-22

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