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An anode comprising a substrate having a deposit of lead dioxide containing bismuth and process for preparing the anode.

InventorsRaymond C. Rhees, Bruce B. Halker
Current U.S. Classification204/290.03; 204/290.08; 204/290.12; 204/290.15; 205/50; 205/188; 205/208; 429/228
International Classification: C25B 134; C25B 126; C25B 130; C25B 1106

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Citations

Cited PatentFiling dateIssue dateOriginal AssigneeTitle
US1851219Aug 27, 1928Mar 29, 1932TJBLYN C
US2945791Mar 5, 1958Jul 19, 1960INERT LEAD DIOXIDE ANODE AND PROCESS OF PRODUCTION
US3207679May 3, 1960Sep 21, 1965METHOD FOR ELECTROPLATING ON TITANIUM
US3213004Mar 8, 19611965SURFACE PREPARATION OF PLATINUM GROUP METALS FOR ELECTRODEPOSITION
US3463707Jan 13, 1966Aug 26, 1969ELECTRODEPOSITION OF LEAD DIOXIDE
US3632497Jun 21, 1966Jan 4, 1972ELECTROCHEMICAL CELL
US3755112Feb 1, 19721973ELECTROWINNING OF COPPER
US38807281975MANUFACTURE OF LEAD DIOXIDE/TITANIUM COMPOSITE ELECTRODES

Referenced by

Citing PatentFiling dateIssue dateOriginal AssigneeTitle
US4278522Jun 18, 1979Jul 14, 1981BBC Brown Boveri & Company LimitedApparatus for treating contaminated water
US5411821Jun 10, 1993May 2, 1995Derafe, Ltd.Integral battery electrode structure for lead/acid batteries
US5593557Aug 14, 1995Jan 14, 1997BASF AktiengesellschaftElectrode consisting of an iron-containing core and a lead-containing coating
US5616234Oct 31, 1995Apr 1, 1997Pepcon Systems, Inc.Method for producing chlorine or hypochlorite product
US5688385Mar 22, 1996Nov 18, 1997Pepcon Systems, Inc.Apparatus for producing chlorine on-site

Claims

1. An anode comprising a substrate having a continuous adherent deposit of lead dioxide containing bismuth in an amount sufficient to provide a ratio of bismuth to lead in the deposit of at least about 1:10.sup.2 and being sufficient to increase the current efficiency of the anode at temperature of use below 25.degree. C., and/or to decrease lead loss from the anode surface.

2. The anode of claim 1 wherein the ratio of bismuth to lead in the coating is between about 1:20 and about 1:8.

3. The anode of claim 1 wherein the ratio of bismuth to lead at the surface is greater than the ratio at the substrate interface.

4. The anode of claim 1 which further includes a lead dioxide deposit between said substrate and said deposit of lead dioxide containing bismuth.

5. The anode of claim 1 wherein said substrate is graphite or a metal selected from titanium, tantalum, zirconium, niobium, tungsten, hafnium, mixtures thereof, and alloys thereof.

6. The anode of claim 1 wherein the thickness of the coating is about 0.01" to about 0.5".

7. The anode of claim 1 wherein the thickness of the coating is about 0.02 to about 0.2.

8. The anode of claim 1 wherein said substrate includes a precoating of an electroreactive metal-containing coating.

9. The anode of claim 8 wherein said metal-containing coating is selected from the group consisting of a metal of the platinum group, oxides thereof, nitrides thereof, borides thereof, and mixtures thereof.