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We have discovered advantageous substrates for III-V nitride semiconductors such as GaN. The substrate material is of the YbFe.sub.2 O.sub.4 or InFeO.sub.3 (ZnO).sub.n structure type and has general composition RAO.sub.3 (MO).sub.n, where R is one or more of Sc, In, Y and the lanthanides (atomic number 67-71); A is one or more of Fe(III), Ga, and Al; M is one or more of Mg, Mn, Fe(II), Co, Cu, Zn and Cd; and n is an integer.gtoreq.1, typically<9. Furthermore, the substrate material is selected to have a lattice constant that provides less than .+-.5% lattice mismatch with the III-V nitride semiconductor material that is to be deposited thereon. At least some of the substrate materials (e.g., ScMgAlO.sub.4) typically can be readily and relatively cheaply produced in single crystal form, are readily clearable on the basal plane, and do essentially not interact chemically with the III-V nitride under typical deposition conditions. Use of the novel substrate materials for opto-electr...

InventorsCharles D. Brandle, Jr., Denis N. Buchanan, Elliot H. Hartford, Jr., Eric S. Hellman, Lynn F. Schneemeyer
Original AssigneeAT&T Corp.
Current U.S. Classification257/76
International Classification: H01L 29201

View patent at USPTO
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Referenced by

Citing PatentFiling dateIssue dateOriginal AssigneeTitle
US5652551Jun 25, 1996Jul 29, 1997The United States of America as represented by the Secretary of the ArmyMethod for high frequency device operation with high temperature and radiation hard characteristics
US5741724Dec 27, 1996Apr 21, 1998MotorolaMethod of growing gallium nitride on a spinel substrate
US5770887Oct 11, 1994Jun 23, 1998Mitsubishi Cable Industries, Ltd.Gan single crystal
US5838707Dec 27, 1996Nov 17, 1998Motorola, Inc.Ultraviolet/visible light emitting vertical cavity surface emitting laser and method of fabrication
US5847397Jul 30, 1996Dec 8, 1998Trustees of Boston UniversityPhotodetectors using III-V nitrides
US5889806Aug 8, 1997Mar 30, 1999Toyoda Gosei Co., Ltd.Group III nitride compound semiconductor laser diodes
US6043514Feb 12, 1998Mar 28, 2000Sharp Kabushiki KaishaGroup III-V type nitride semiconductor device
US6284395Apr 20, 1999Sep 4, 2001Corning Applied Technologies Corp.Nitride based semiconductors and devices
US6576932Mar 1, 2001Jun 10, 2003Lumileds Lighting, U.S., LLCIncreasing the brightness of III-nitride light emitting devices
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US7235819Jun 30, 2003Jun 26, 2007The Trustees of Boston UniversitySemiconductor device having group III nitride buffer layer and growth layers
US7323356Feb 19, 2003Jan 29, 2008Japan Science and Technology AgencyLnCuO(S,Se,Te)monocrystalline thin film, its manufacturing method, and optical device or electronic device using the monocrystalline thin film
US7326477Sep 23, 2003Feb 5, 2008Saint-Gobain Ceramics & Plastics, Inc.Spinel boules, wafers, and methods for fabricating same
US7368766Jul 15, 2004May 6, 2008Matsushita Electric Industrial Co., Ltd.Semiconductor light emitting element and method for fabricating the same
US7663157Jan 26, 2007Feb 16, 2010The Trustees of Boston UniversitySemiconductor device having group III nitride buffer layer and growth layers
US7919815Mar 1, 2006Apr 5, 2011Saint-Gobain Ceramics & Plastics, Inc.Spinel wafers and methods of preparation

Claims

1. An article comprising a quantity of III-V nitride semiconductor material disposed on a substrate and substantially epitaxial therewith,

CHARACTERIZED IN THAT
a) said substrate is an essentially single crystal material of general composition RAO.sub.3 (MO).sub.n, where R is one or more of Sc, In, Y and the lanthanides of atomic number 67-71; A is one or more of Fe (III), Ga and Al; M is one or more of Mg, Mn, Fe (II), Co, Cu, Zn and Cd; and n is an integer.gtoreq.1;
b) said essentially single crystal substrate material has a crystal structure of the YbFe.sub.2 O.sub.4 structure type or of the InFeO.sub.3 (ZnO).sub.n structure type; and
c) said essentially single crystal substrate material has a lattice constant that provides less than .+-.5% lattice mismatch with a lattice constant a of said quantity of III-V nitride semiconductor material.

2. An article according to claim 1, wherein said quantity of III-V nitride semiconductor material comprises material selected from GaN, AlN, InN, GaAlN, GaInN, AlInN, GaAlInN, and of said nitrides with As or P substituted for a portion of the nitrogen.

3. An article according to claim 1, wherein n<9.

4. An article according to claim 3, where n.ltoreq.3.

5. An article according to claim 4, wherein n=1.

6. An article according to claim 5, wherein said essentially single crystal substrate material is selected from ScGaMgO.sub.4, InGaMgO.sub.4, ScAlMnO.sub.4, ScAlCoO.sub.4, ScAlMgO.sub.4 and InAlMgO.sub.4.

7. An article according to claim 1, wherein said quantity of III-V nitride semiconductor material is a layer structure comprising at least a first and a second layer of III-V nitride semiconductor material, with the first layer differing in composition from the second layer, and with at least one of said layers comprising doped semiconductor material.

8. An article according to claim 7, further comprising contacts adapted for flowing an electric current through said layer structure.

9. An article according to claim 8, wherein said article is a semiconductor laser or a light emitting diode.

Drawings