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A dislocation-free sheet may be formed from a melt. A sheet of material with a first width is formed on a melt of the material using a cooling plate. This sheet has dislocations. The sheet is transported with respect to the cooling plate and the dislocations migrate to an edge of the sheet. The first width of the sheet is increased to a second width by the cooling plate. The sheet does not have dislocations at the second width. The cooling plate may have a shape with two different widths in one instance. The cooling plate may have segments that operate at different temperatures to increase the width of the sheet in another instance. The sheet may be pulled or flowed with respect to the cooling plate.

Inventors: Peter L. Kellerman, Frank Sinclair, Frederick Carlson, Nicholas P. T. Bateman, Robert J. Mitchell
Original Assignee: Varian Semiconductor Equipment Associates, Inc.
Primary Examiner: Michael S Lebentritt
Current U.S. Classification: 438/15; 257/E21.001; 257/E21.012; 257/E21.585; 257/E21.586; 438/16

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Citations

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Japan Silicon Co., Ltd.		Lateral pulling growth of crystal ribbons and apparatus therefor
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Claims

1. A method of forming a sheet from a melt comprising:

forming a sheet of a material having a first width on a melt of said material using a cooling plate, said sheet having dislocations;

transporting said sheet with respect to said cooling plate whereby said dislocations migrate to an edge of said sheet;

increasing said sheet to a second width as said sheet is transported with respect to said cooling plate by changing a parameter of said cooling plate, said second width being larger than said first width, said sheet not having said dislocations at said second width.

2. The method of claim 1, wherein said transporting comprising flowing said melt.

3. The method of claim 1, wherein said transporting comprises pulling said sheet with respect to said melt.

4. The method of claim 1, wherein said sheet and said melt are comprised of silicon or silicon and germanium.

5. The method of claim 1, wherein said forming comprises radiative cooling.

6. The method of claim 1, wherein said cooling plate is at least 10 K colder than said melt.

7. The method of claim 1, wherein said parameter is a width of said cooling plate at a temperature below a melting temperature of said melt.

8. The method of claim 1, further comprising transporting said sheet at said second width with respect to said cooling plate, said sheet having a uniform thickness at said second width.

9. A product formed using the method of claim 1.

Drawings