A multi-chip module includes metal frame segments including a plurality of die-bonding pads and a plurality of terminals, a plurality of electronic components mounted on the die-bonding pads in electrical connection to the terminals, and a resin package for enclosing the electronic components and the...http://www.google.com/patents/US6610923?utm_source=gb-gplus-sharePatent US6610923 - Multi-chip module utilizing leadframe
