The lower end of a resin wall is bonded to a radiating plate, and a lead is fixed so as to extend through the resin wall. After a semiconductor chip is bonded thereto, a resin lid is put to seal the semiconductor chip. Recessed parts for burying the lower end of the resin wall are formed on the side...http://www.google.com/patents/US7429791?utm_source=gb-gplus-sharePatent US7429791 - Semiconductor device in a resin sealed package with a radiating plate and manufacturing method thereof
