A semiconductor device package includes a substrate, first and second chip pads spaced apart over a surface of the substrate, and an insulating layer located over the surface of the substrate. The insulating layer includes a stepped upper surface defined by at least a lower reference potential line support...http://www.google.com/patents/US20050269684?utm_source=gb-gplus-sharePatent US20050269684 - Semiconductor package including redistribution pattern and method of manufacturing the same
