A platform carries an integrated circuit (IC) (20) for handling and alignment through wire bonding operations, provides interconnections, and supports the shielded IC with uniform, controlled adhesive thickness. The platform base (10) has a flat portion which may have a slot (30) extending the length...http://www.google.com/patents/US6043557?utm_source=gb-gplus-sharePatent US6043557 - Tape application platform and processes therefor
