The present invention stacks integrated circuits (ICs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided herein. In a preferred embodiment...http://www.google.com/patents/US6956284?utm_source=gb-gplus-sharePatent US6956284 - Integrated circuit stacking system and method
