Stacking techniques are illustrated in example embodiments of the present invention wherein semiconductor dies are mounted in a module to become a MCM which serves as the basic building block. A combination of these modules and dies in a substrate creates a package with specific function or a range of...http://www.google.com/patents/US8093103?utm_source=gb-gplus-sharePatent US8093103 - Multiple chip module and package stacking method for storage devices
