A process for manufacturing a multi-layer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure,...http://www.google.com/patents/US5592737?utm_source=gb-gplus-sharePatent US5592737 - Method of manufacturing a multilayer printed wire board
