A precision laser based method of marking semiconductor wafers, packages, substrates or similar workpieces is provided. The workpieces have articles which may include die, chip scale packages, circuit patterns and the like. The marking occurs in a workpiece marking system and within a designated region...http://www.google.com/patents/US20040152233?utm_source=gb-gplus-sharePatent US20040152233 - Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
