A molded package comprises at least a first metal member, a second metal member, and a third metal member. Each member includes an end portion inserted into a mold member where a recess is formed and another end portion protruding from an outer wall of the mold member. A portion of each main surface...http://www.google.com/patents/US20060175716?utm_source=gb-gplus-sharePatent US20060175716 - Molded package and semiconductor device using molded package
