An encapsulation method enabling high throughput production of semiconductor die packages. In an exemplary embodiment, a mold is provided with an upper mold platen having a plurality of cavities for encapsulating interconnections on a first side of a multi-chip carrier substrate. The mold further includes...http://www.google.com/patents/US6746895?utm_source=gb-gplus-sharePatent US6746895 - Method for encapsulating a multi-chip substrate array
