A multiple circuit board package employing solder balls and method and apparatus for fabricating same is described. Two or more printed circuit boards and a plurality of electronic devices are joined together using solder balls. Alternatively, three or more printed circuit boards are joined together...http://www.google.com/patents/US6043990?utm_source=gb-gplus-sharePatent US6043990 - Multiple board package employing solder balis and fabrication method and apparatus
