Back end of line interconnect structures and methods of making a back end of line interconnect structure are provided. The back end of line interconnect structure contains a first interconnect layer containing a first conductive feature and a first dielectric layer; a first cap layer over the first interconnect...http://www.google.com/patents/US8134234?utm_source=gb-gplus-sharePatent US8134234 - Application of Mn for damage restoration after etchback
