An intercoupling component (e.g., socket or adapter) is provided for increasing the dissipation of heat generated within an integrated circuit (IC) array positioned within the intercoupling component, while maintaining a relatively low profile. The intercoupling component includes a heat sink positioned...http://www.google.com/patents/US5917703?utm_source=gb-gplus-sharePatent US5917703 - Integrated circuit intercoupling component with heat sink
