A lead frame for manufacturing semiconductor device packages has inner leads, tie bars and a die pad that are formed with irregular dimples on their respective upper and lower surfaces. This improves the bonding strength between the lead frame and the molding compound as well as between the die pad and...http://www.google.com/patents/US6197615?utm_source=gb-gplus-sharePatent US6197615 - Method of producing lead frame having uneven surfaces
