A method of forming a copper oxide film includes forming a copper oxide film including an ammonia complex by causing a mixed solution of aqueous ammonia and aqueous hydrogen peroxide, which has been adjusted to have pH of 8 to 10 or pH of 9 to 10, to contact a surface of a copper film. A method of fabricating...http://www.google.com/patents/US6818556?utm_source=gb-gplus-sharePatent US6818556 - Method of plating a metal or metal compound on a semiconductor substrate that includes using the same main component in both plating and etching solutions
