An improved multi-chip module includes a main circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes a pair of IC packages, both of which are mounted on opposite sides of a package carrier. The package units...http://www.google.com/patents/US6900529?utm_source=gb-gplus-sharePatent US6900529 - Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
