A molded optical interconnect is provided. A plurality of electrical tracings is disposed thereon. An optical module having an optical surface and a photonic device are operably coupled to an interconnect substrate. A molded optical portion having a core region with a first end and a cladding region...http://www.google.com/patents/US5521992?utm_source=gb-gplus-sharePatent US5521992 - Molded optical interconnect
