A multipackage module has multiple die of various types and having various functions and, in some embodiments, the module includes a digital processor, an analog device, and memory. A first die, having a comparatively large footprint, is mounted onto first die attach region on a surface of a first package...http://www.google.com/patents/US20070278658?utm_source=gb-gplus-sharePatent US20070278658 - Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package
