A package module is provided. The package module includes a substrate having a surface including a die region. A die is disposed in the die region of the surface on the substrate. A flexible heat spreader conformally covers the surface of the substrate and the die. The invention also discloses an electronic...http://www.google.com/patents/US7608923?utm_source=gb-gplus-sharePatent US7608923 - Electronic device with flexible heat spreader
