A new method and structure is provided to create a System On Package (SOP). The process starts with a ceramic substrate that is typically used as the basis for a ceramic substrate. One or more layers of dielectric such as polyimide are deposited over the surface of the ceramic substrate, patterned and...http://www.google.com/patents/US6495912?utm_source=gb-gplus-sharePatent US6495912 - Structure of ceramic package with integrated passive devices
