A semiconductor device includes a semiconductor element attached to a support member by a junction material that includes a parent phase of a low-melting-point junction material and fine particles of a high-melting-point junction material which are uniformly dispersed in the low-melting-point material....http://www.google.com/patents/US5317191?utm_source=gb-gplus-sharePatent US5317191 - Low-melting-point junction material having high-melting-point particles uniformly dispersed therein
