A locked hinge based technique for controllably holding surface-micromachined modules off the edge of a substrate for subsequent processing. The mechanism enables reliable, accurate, and low-cost fabrication of even complex multi layer flip-chip MEMS devices using for example only a simple two-layer...http://www.google.com/patents/US7319260?utm_source=gb-gplus-sharePatent US7319260 - Hinged bonding of micromechanical devices
